Method for fabricating an isolated microelectromechanical system (MEMS) device using an internal void
    9.
    发明授权
    Method for fabricating an isolated microelectromechanical system (MEMS) device using an internal void 有权
    使用内部空隙制造隔离的微机电系统(MEMS)装置的方法

    公开(公告)号:US07387737B2

    公开(公告)日:2008-06-17

    申请号:US11299151

    申请日:2005-12-09

    IPC分类号: C23F1/22

    摘要: A method for fabricating an electrically isolated MEMS device having an outer stationary MEMS element and an inner movable MEMS element is provided that does not use a sacrificial layer. Rather, a pair of spacers are defined on the outer portions of the upper surface of a conductive wafer, and an insulating material is deposited thereon. The spacers are attached to a substrate to define an internal void therein. The wafer is then patterned to form the outer MEMS element as well as a conductive member for the inner MEMS element, separated from the outer MEMS element by a gap. A portion of the insulating layer that is disposed in the gap is then removed, thereby releasing the inner MEMS element from the stationary MEMS element.

    摘要翻译: 提供了一种用于制造具有外部固定MEMS元件和内部可移动MEMS元件的电隔离MEMS器件的方法,其不使用牺牲层。 相反,在导电晶片的上表面的外部部分限定一对间隔物,并且在其上沉积绝缘材料。 间隔件附接到基底以在其中限定内部空隙。 然后将晶片图案化以形成外部MEMS元件以及用于内部MEMS元件的导电构件,其通过间隙与外部MEMS元件分离。 然后去除设置在间隙中的绝缘层的一部分,从而将内部MEMS元件从固定MEMS元件释放。

    Method for constructing an isolate microelectromechanical system (MEMS) device using surface fabrication techniques
    10.
    发明授权
    Method for constructing an isolate microelectromechanical system (MEMS) device using surface fabrication techniques 有权
    使用表面制造技术构建隔离微机电系统(MEMS)器件的方法

    公开(公告)号:US06756310B2

    公开(公告)日:2004-06-29

    申请号:US09963936

    申请日:2001-09-26

    IPC分类号: H01L2100

    摘要: A method for fabricating an electrically isolated MEMS device is provided that uses surface fabrication techniques to form a conductive stationary MEMS element, and a movable MEMS element spaced apart from the conductive stationary MEMS element. The movable element includes a nonconductive base which provides for electrical isolation between a plurality of conductive members extending from the base. Modifications to the basic process permit the incorporation of a wafer-level cap which provides mechanical protection to the movable portions of the device.

    摘要翻译: 提供了一种用于制造电隔离的MEMS器件的方法,其使用表面制造技术来形成导电固定MEMS元件,以及与导电固定MEMS元件间隔开的可移动MEMS元件。 可移动元件包括非导电基底,其提供从基部延伸的多个导电构件之间的电绝缘。 对基本工艺的修改允许结合提供机械保护的晶片级盖,以使该装置的可移动部分。