公开(公告)号：US06477058B1

公开(公告)日：2002-11-05

申请号：US09894923

申请日：2001-06-28

申请人： Richard J Luebs ,  Jonathan W Craig ,  Jeffrey L. Deeney ,  David W. Peters

发明人： Richard J Luebs ,  Jonathan W Craig ,  Jeffrey L. Deeney ,  David W. Peters

IPC分类号： H05K111

CPC分类号： H05K7/1061 ,  H05K1/141 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/10378 ,  H05K2201/10719

摘要： An integrated circuit device package in accordance with the invention comprises a first land grid array (LGA) interposer socket positioned between, and in communication with, an LGA integrated circuit device and a first side of a first circuit board; a second LGA interposer socket positioned between, and in communication with, a second circuit board and a second side of the first circuit board, wherein the second side of the first circuit board is opposite to and parallel with the first side of the first circuit board; and a clamping mechanism for compressively urging together the LGA integrated circuit device, the first LGA interposer socket, the first circuit board, the second LGA interposer socket, and the second circuit board into electrical interconnection under a predetermined load.

摘要翻译： 根据本发明的集成电路器件封装包括位于LGA集成电路器件和第一电路板的第一侧之间且与LGA集成电路器件连接的第一焊盘格栅阵列（LGA）插入器插座; 位于所述第一电路板的第二电路板和所述第二侧之间并与之连通的第二LGA插入器插座，其中所述第一电路板的所述第二侧与所述第一电路板的第一侧相对并平行 ; 以及夹持机构，用于将LGA集成电路器件，第一LGA插入器插座，第一电路板，第二LGA插入器插座和第二电路板压缩到预定负载下的电互连中。

公开(公告)号：US06710264B2

公开(公告)日：2004-03-23

申请号：US09994004

申请日：2001-11-16

申请人： Jeffrey L. Deeney ,  Joseph D. Dutson ,  Richard J. Luebs

发明人： Jeffrey L. Deeney ,  Joseph D. Dutson ,  Richard J. Luebs

IPC分类号： H05K116

CPC分类号： H05K3/301 ,  H05K3/3436 ,  Y10T29/49144

摘要： A circuit board assembly having a circuit board and a column grid array (“CGA”) integrated circuit package. The CGA package has a substrate having an array of solder columns extending from a bottom surface. A frame surrounds the CGA integrated circuit package and is affixed thereto. The frame extends from the substrate to a portion of the circuit board when the column grid array integrated circuit package is mounted on the circuit board to support the column grid array integrated circuit package. The frame is affixed to the CGA integrated circuit package by adhesive after the CGA integrated circuit package is mounted on the circuit board, the adhesive accommodating any variations in height of the CGA integrated circuit package.

摘要翻译： 一种具有电路板和列栅格阵列（“CGA”）集成电路封装的电路板组件。 CGA封装具有从底表面延伸的焊料列阵列的衬底。 框架围绕着CGA集成电路封装并被固定在其上。 当列格栅阵列集成电路封装安装在电路板上以支持列格栅阵列集成电路封装时，框架从基板延伸到电路板的一部分。 在将CGA集成电路封装安装在电路板上之后，框架通过粘合剂固定在CGA集成电路封装上，该粘合剂可容纳CGA集成电路封装的任何高度变化。

公开(公告)号：US07434309B2

公开(公告)日：2008-10-14

申请号：US10652598

申请日：2003-08-29

申请人： Jeffrey L. Deeney ,  Joseph D. Dutson ,  Richard J. Luebs

发明人： Jeffrey L. Deeney ,  Joseph D. Dutson ,  Richard J. Luebs

IPC分类号： H05K3/36

CPC分类号： H05K3/301 ,  H05K3/3436 ,  Y10T29/49144

摘要： A circuit board assembly having a circuit board and a column grid array (“CGA”) integrated circuit package. The CGA package has a substrate having an array of solder columns extending from a bottom surface. A frame surrounds the CGA integrated circuit package and is affixed thereto. The frame extends from the substrate to a portion of the circuit board when the column grid array integrated circuit package is mounted on the circuit board to support the column grid array integrated circuit package. The frame is affixed to the CGA integrated circuit package by adhesive after the CGA integrated circuit package is mounted on the circuit board, the adhesive accommodating any variations in height of the CGA integrated circuit package.

摘要翻译： 一种具有电路板和列栅格阵列（“CGA”）集成电路封装的电路板组件。 CGA封装具有从底表面延伸的焊料列阵列的衬底。 框架围绕着CGA集成电路封装并被固定在其上。 当列格栅阵列集成电路封装安装在电路板上以支持列格栅阵列集成电路封装时，框架从基板延伸到电路板的一部分。 在将CGA集成电路封装安装在电路板上之后，框架通过粘合剂固定在CGA集成电路封装上，该粘合剂可容纳CGA集成电路封装的任何高度变化。

公开(公告)号：US20150217822A1

公开(公告)日：2015-08-06

申请号：US14609126

申请日：2015-01-29

申请人： Michael Sturdevant ,  Jeffrey L. Deeney

发明人： Michael Sturdevant ,  Jeffrey L. Deeney

IPC分类号： B62H1/06 ,  B62H1/02

CPC分类号： B62H1/06 ,  B62H1/02

摘要： An extendable and retractable support stand for holding a parked vehicle such as a motorcycle, bicycle or similar vehicle which is otherwise unstable in an upright position. The support stand has the ability to be locked into place without the need for fixed locking positions by means of a tilted plate locking mechanism that can be operated by the operator using only one foot irrespective of the orientation of the support stand. The support members may include an outer telescoping member pivotally attach to the vehicle frame, an inner support member, a support pad, a running clutch mechanism that automatically locks the telescoping members, and a refraction spring to automatically return the stand to the minimum length when the clutch mechanism is disengaged.

摘要翻译： 用于保持停放的车辆的可伸缩支撑架，例如摩托车，自行车或类似的车辆，否则这些车辆在直立位置不稳定。 支撑架能够通过倾斜的板锁定机构锁定就位而不需要固定的锁定位置，只要操作者仅使用一只脚就能操作，而不管支架的方向如何。 支撑构件可以包括可枢转地附接到车架的外部伸缩构件，内部支撑构件，支撑垫，自动锁定伸缩构件的行进离合器机构和折射弹簧以自动地将支架返回到最小长度，当 离合器机构脱离。

公开(公告)号：US06541710B1

公开(公告)日：2003-04-01

申请号：US09991430

申请日：2001-11-16

申请人： Jeffrey L. Deeney ,  David W. Mayer

发明人： Jeffrey L. Deeney ,  David W. Mayer

IPC分类号： H05K103

CPC分类号： H05K3/3436 ,  H01L23/49811 ,  H01L2924/0002 ,  H05K3/303 ,  H05K3/4015 ,  H05K2201/10242 ,  H05K2201/2036 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/53174 ,  H01L2924/00

摘要： A column grid array integrated circuit package has a substrate. The substrate has a solder column array having a plurality of solder columns and a plurality of rigid columns interspersed with the solder columns at no-connect locations. The rigid columns contact a circuit board to which the column grid array integrated circuit package is mounted and support the column grid array integrated circuit package against compressive force.

摘要翻译： 列栅格阵列集成电路封装具有基板。 衬底具有焊料柱阵列，其具有多个焊料柱和多个刚性柱，其在未连接位置处散布有焊料柱。 刚性柱接触安装列栅格阵列集成电路封装的电路板，并抵抗压缩力支撑列格栅阵列集成电路封装。

公开(公告)号：US5521425A

公开(公告)日：1996-05-28

申请号：US633591

申请日：1990-12-21

申请人： Jeffrey L. Deeney

发明人： Jeffrey L. Deeney

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L23/48 ,  H01L23/28 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3157 ,  H01L23/49572 ,  H01L24/50 ,  H01L2924/14

摘要： A tape automated bonded circuit comprising a flexible substrate having an opening defined by a peripheral sidewall. A plurality of conductive traces are provided on the flexible substrate which terminate in a plurality of leads which extend into alignment with the opening. An electronic device having a plurality of pad regions is aligned with the opening in the substrate. The leads are bonded to the pad regions. A continuous encapsulation layer which touches the peripheral side wall of the substrate opening on all sides encapsulatingly covers the bonded leads and pad regions and structurally reinforces each lead along the entire length which projects over the opening.

摘要翻译： 一种胶带自动键合电路，包括具有由周边侧壁限定的开口的柔性基板。 多个导电迹线设置在柔性基板上，其终止于与开口对准延伸的多个引线中。 具有多个焊盘区域的电子设备与衬底中的开口对准。 引线键合到焊盘区域。 接触所有侧面的基板开口的周边侧壁的连续封装层封装地覆盖粘合引线和焊盘区域，并且沿着突出在开口上的整个长度结构地加强每个引线。

公开(公告)号：US09623925B2

公开(公告)日：2017-04-18

申请号：US14609126

申请日：2015-01-29

申请人： Michael Sturdevant ,  Jeffrey L. Deeney

发明人： Michael Sturdevant ,  Jeffrey L. Deeney

IPC分类号： B62D1/02 ,  B62D1/06 ,  B62H1/06 ,  B62H1/02

CPC分类号： B62H1/06 ,  B62H1/02

摘要： An extendable and retractable support stand for holding a parked vehicle such as a motorcycle, bicycle or similar vehicle which is otherwise unstable in an upright position. The support stand has the ability to be locked into place without the need for fixed locking positions by means of a tilted plate locking mechanism that can be operated by the operator using only one foot irrespective of the orientation of the support stand. The support members may include an outer telescoping member pivotally attach to the vehicle frame, an inner support member, a support pad, a running clutch mechanism that automatically locks the telescoping members, and a refraction spring to automatically return the stand to the minimum length when the clutch mechanism is disengaged.

公开(公告)号：US06813162B2

公开(公告)日：2004-11-02

申请号：US09992864

申请日：2001-11-16

申请人： Jeffrey L. Deeney

发明人： Jeffrey L. Deeney

IPC分类号： H05K118

CPC分类号： H05K3/301 ,  H05K3/3436

摘要： A circuit board assembly has a circuit board and a column grid array (“CGA”) integrated circuit package. The CGA integrated circuit package has a substrate having an array of solder columns extending from a bottom surface. An oversized lid is affixed to the substrate. Support shims are disposed between a portion of the lid that extends beyond an outer periphery of the substrate and a circuit board to which the CGA integrated circuit package is mounted. The support shims are affixed to the lid with adhesive after the CGA integrated circuit package is mounted on the circuit board. The adhesive accommodates any variations in height in the CGA integrated circuit package.

摘要翻译： 电路板组件具有电路板和列格栅阵列（“CGA”）集成电路封装。 CGA集成电路封装具有从底面延伸的焊料列阵列的基板。 尺寸过大的盖子固定在基板上。 支撑垫片设置在盖子的延伸超出基板的外周边的部分和安装有CGA集成电路封装件的电路板之间。 在CGA集成电路封装安装在电路板上之后，支撑垫片用粘合剂固定在盖子上。 粘合剂可以适应CGA集成电路封装中的任何高度变化。

公开(公告)号：US5783862A

公开(公告)日：1998-07-21

申请号：US938282

申请日：1997-09-26

申请人： Jeffrey L. Deeney

发明人： Jeffrey L. Deeney

IPC分类号： H01L23/373 ,  H01L23/36 ,  H01L23/34

CPC分类号： H01L23/3733 ,  H01L2924/0002

摘要： A thermal interface 26 between a heat source (e.g., an IC die) 24 and a heat sink 28 comprises a metallic mesh (26a) filled with a thermally conductive semi-liquid substance (26b). The thermally conductive semi-liquid substance may comprise, e.g., silicone grease or paraffin. The wire mesh may comprise silver, copper and/or gold cloth.

摘要翻译： 热源（例如IC芯片）24和散热器28之间的热界面26包括填充有导热半液体物质（26b）的金属网（26a）。 导热半液体物质可以包括例如硅脂或石蜡。 金属丝网可以包括银，铜和/或金布。

公开(公告)号：US07273386B2

公开(公告)日：2007-09-25

申请号：US10901338

申请日：2004-07-28

申请人： Richard E. Olson ,  Jill H. Quinn ,  Stacy A. Fraker ,  Jeffrey L. Deeney ,  Joseph D. Dutson

发明人： Richard E. Olson ,  Jill H. Quinn ,  Stacy A. Fraker ,  Jeffrey L. Deeney ,  Joseph D. Dutson

IPC分类号： H01R13/62

CPC分类号： H01R13/5213

摘要： A pin shroud for a circuit board having a raised pin platform and a pin array projecting from the raised pin platform. A spacer extending from a side wall of the shroud engages a side of the raised pin platform, thereby accurately aligning the pin shroud with the pin platform.

摘要翻译： 一种用于电路板的针罩，其具有凸起销平台和从升高的销平台突出的销阵列。 从护罩的侧壁延伸的间隔件接合凸起销平台的一侧，从而将销护罩与销平台精确地对准。