Method for making recessed field oxide for radiation hardened
microelectronics
    2.
    发明授权
    Method for making recessed field oxide for radiation hardened microelectronics 失效
    制造用于辐射硬化微电子学的凹陷场氧化物的方法

    公开(公告)号:US6063690A

    公开(公告)日:2000-05-16

    申请号:US999476

    申请日:1997-12-29

    IPC分类号: H01L21/762 H01L21/76

    CPC分类号: H01L21/76221

    摘要: A method of forming a recessed electrically-insulating field oxide region in a semiconductor substrate is disclosed. In a preferred embodiment, the method includes the steps of oxidizing a surface of the substrate; depositing a polysilicon layer over the oxide layer; depositing a silicon nitride layer over the polysilicon layer; patterning the silicon nitride and polysilicon layers and etching away both layers where the field oxide is to be located; forming a field oxide by thermally oxidizing the substrate in the openings previously formed in the silicon nitride and polysilicon layers; etching away the thermal field oxide; thermally oxidizing the substrate in the etched-away field oxide areas; etching away the silicon nitride layer; optionally, implanting through the thermal oxide with an impurity; depositing a doped oxide; densifying the oxide in a steam ambient; etching back the deposited oxide; then either depositing an undoped CVD oxide, coating the oxide with a leveling layer to planarize the oxide surface, etching both the undoped CVD oxide and leveling layers and etching away the polysilicon; or etching away the polysilicon, leaching the dopants out of the surface of the field oxide structure and passivating the surface in a dry oxygen ambient.

    摘要翻译: 公开了一种在半导体衬底中形成凹陷的电绝缘场氧化物区域的方法。 在优选的实施方案中,该方法包括氧化基材表面的步骤; 在所述氧化物层上沉积多晶硅层; 在所述多晶硅层上沉积氮化硅层; 图案化氮化硅和多晶硅层并蚀刻去除场氧化物所在的两层; 通过在先前形成在氮化硅和多晶硅层中的开口中的衬底热氧化来形成场氧化物; 蚀刻掉热场氧化物; 在蚀刻掉的氧化物区域中热氧化衬底; 蚀刻掉氮化硅层; 任选地,通过具有杂质的热氧化物注入; 沉积掺杂氧化物; 在蒸汽环境中使氧化物致密化; 蚀刻沉积的氧化物; 然后沉积未掺杂的CVD氧化物,用平整层涂覆氧化物以平坦化氧化物表面,蚀刻未掺杂的CVD氧化物和流平层并蚀刻掉多晶硅; 或蚀刻掉多晶硅,将掺杂剂从场氧化物结构的表面浸出并在干氧环境中钝化表面。

    Radiation hardened semiconductor device
    3.
    发明授权
    Radiation hardened semiconductor device 失效
    辐射硬化半导体器件

    公开(公告)号:US06511893B1

    公开(公告)日:2003-01-28

    申请号:US09072932

    申请日:1998-05-05

    IPC分类号: H01L21336

    摘要: A method for manufacturing a radiation hardened semiconductor device, having defined active region and isolation region. The isolation region containing an isolation material and active region containing a transition region between active and isolation region, sometimes denoted a bird's beak region. Wherein the transition region is implanted with germanium and boron, to prevent formation of leakage paths between active devices, or within an active device. The implanted area can be further limited to that area of the transition region that is adapted to be covered by a gate material, such as polysilicon.

    摘要翻译: 一种制造具有限定的有源区和隔离区的辐射硬化半导体器件的方法。 隔离区域包含隔离材料和活性区域,活性区域在活性隔离区域和隔离区域之间包含过渡区域,有时表示为鸟的喙区域。 其中在过渡区域中注入锗和硼,以防止在有源器件之间或在有源器件内形成泄漏路径。 可以将注入区域进一步限制为适合被栅极材料例如多晶硅覆盖的过渡区域的区域。

    Radiation hardened semiconductor device
    4.
    发明授权
    Radiation hardened semiconductor device 有权
    辐射硬化半导体器件

    公开(公告)号:US06855618B2

    公开(公告)日:2005-02-15

    申请号:US10284230

    申请日:2002-10-30

    摘要: A method for manufacturing a radiation hardened semiconductor device, having defined active region and isolation region. The isolation region containing an isolation material and active region containing a transition region between active and isolation region, sometimes denoted a bird's beak region. Wherein the transition region is implanted with germanium and boron, to prevent formation of leakage paths between active devices, or within an active device. The implanted area can be further limited to that area of the transition region that is adapted to be covered by a gate material, such as polysilicon.

    摘要翻译: 一种制造具有限定的有源区和隔离区的辐射硬化半导体器件的方法。 隔离区域包含隔离材料和活性区域,活性区域在活性隔离区域和隔离区域之间包含过渡区域,有时表示为鸟的喙区域。 其中在过渡区域中注入锗和硼,以防止在有源器件之间或在有源器件内形成泄漏路径。 可以将注入区域进一步限制为适合被栅极材料例如多晶硅覆盖的过渡区域的区域。