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    Direct contact semiconductor cooling
    3.
    发明授权
    Direct contact semiconductor cooling 有权
    直接接触半导体冷却

    公开(公告)号：US07157793B2

    公开(公告)日：2007-01-02

    申请号：US10849097

    申请日：2004-05-19

    申请人： Richard S. Torkington ,  Jon Filreis ,  Kenneth V. Buer

    发明人： Richard S. Torkington ,  Jon Filreis ,  Kenneth V. Buer

    IPC分类号： H01L23/34 ,  G01R31/26

    CPC分类号： H01L23/44 ,  H01L2224/48091 ,  H01L2924/1305 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Thermal spreading resistance, associated with small geometry electronic features that generate heat on a semiconductor, may be reduced through the addition of a thermally conductive fluid. For example, a dielectric fluid may be used within a volume between a semiconductor package and the semiconductor substrate. Therefore, direct thermal cooling may be employed to reduce the thermal spreading resistance often encountered in MMIC power amplifier devices. Furthermore, exemplary methods to achieve this sealing are described herein.

    摘要翻译： 通过添加导热流体可以减少与在半导体上产生热量的小几何电子特征相关联的热扩散阻力。 例如，可以在半导体封装和半导体衬底之间的体积内使用电介质流体。 因此，可以采用直接热冷却来降低MMIC功率放大器器件中经常遇到的耐热扩散电阻。 此外，本文描述了实现该密封的示例性方法。

    High power block upconverter
    4.
    发明授权
    High power block upconverter 有权

    公开(公告)号：US07035617B2

    公开(公告)日：2006-04-25

    申请号：US10066024

    申请日：2002-01-29

    申请人： Kenneth V. Buer ,  Richard S. Torkington ,  Edwin Jack Stanfield

    发明人： Kenneth V. Buer ,  Richard S. Torkington ,  Edwin Jack Stanfield

    IPC分类号： H04B1/26

    CPC分类号： H04B1/26

    摘要： A system and method for high power block upconversion having a stand-alone and surface-mountable component is provided. The HP-BUC system of the invention provides a “drop-in” component capable of mixing a local oscillator signal with an IF signal to produce an RF signal in the millimeter-wave and higher bands. In addition, the HP-BUC provides filtering of unwanted spurious signals and requires no further signal amplification prior to transmission, for example in a satellite communications system.

    LEADFRAME PACKAGE WITH INTEGRATED PARTIAL WAVEGUIDE INTERFACE
    5.
    发明申请
    LEADFRAME PACKAGE WITH INTEGRATED PARTIAL WAVEGUIDE INTERFACE 有权
    具有集成的部分波导接口的LEADFRAME封装

    公开(公告)号：US20120051000A1

    公开(公告)日：2012-03-01

    申请号：US13221693

    申请日：2011-08-30

    申请人： David R. Laidig ,  Kenneth V. Buer ,  Michael R. Lyons ,  Noel Lopez

    发明人： David R. Laidig ,  Kenneth V. Buer ,  Michael R. Lyons ,  Noel Lopez

    IPC分类号： H05K1/14 ,  H01L31/18

    CPC分类号： H05K7/20409 ,  H01L23/047 ,  H01L23/315 ,  H01L23/495 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01Q23/00 ,  H05K7/02 ,  H01L2924/00014

    摘要： A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

    摘要翻译： 公开了一种MMIC封装，包括：基于引线框的包覆成型封装，位于所述包覆成型封装内的管芯; 和部分波导接口，其中部分波导接口与包覆成型的封装集成，促进了低成本和可靠的组装。 还公开了一种包覆成型的封装，其中管芯位于暴露在封装底部的金属部分上，并且封装构造成用于附接到收发器的底架，使得来自模具的热量容易地以直接热量散发到底架 路径。 本公开有助于MMIC封装的并行组装以及使用拾取和放置/表面安装技术将MMIC封装连接到收发器的底盘。 这有助于可靠和低成本的收发器。