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公开(公告)号：US20110173806A1
公开(公告)日：2011-07-21
申请号：US13009802
申请日：2011-01-19
申请人： Robert Flemming , Lex Kowsowsky , Shurui Shang , Bhret Graydon , Xiaofeng Chen , Glen Irvin
发明人： Robert Flemming , Lex Kowsowsky , Shurui Shang , Bhret Graydon , Xiaofeng Chen , Glen Irvin
IPC分类号： H05K3/00
CPC分类号： H05K1/0259 , H05K1/0271 , H05K1/036 , H05K1/0373 , H05K3/0005 , H05K2201/068 , H05K2201/0738 , H05K2201/09136 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49155 , Y10T156/10
摘要： A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.
摘要翻译： 描述了一种用于设计符合规格的印刷电路板的方法。 第一电压可切换电介质材料与第一铜箔一起放置。 第二可电压切换电介质材料与第二铜箔一起放置。 第一铜箔的弓形部分与铝构件的第一侧相配合，粘合剂物质位于第一铜箔和铝构件的第一侧之间。 第二铜箔的弧形部分与铝构件的第二侧配合，粘合剂物质位于第二铜箔和铝构件的第二侧之间。
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公开(公告)号：US08272123B2
公开(公告)日：2012-09-25
申请号：US13009802
申请日：2011-01-19
申请人： Robert Fleming , Lex Kosowsky , Shurui Shang , Bhret Graydon , Xiaofeng Chen , Glen Irvin
发明人： Robert Fleming , Lex Kosowsky , Shurui Shang , Bhret Graydon , Xiaofeng Chen , Glen Irvin
IPC分类号： H01R43/00
CPC分类号： H05K1/0259 , H05K1/0271 , H05K1/036 , H05K1/0373 , H05K3/0005 , H05K2201/068 , H05K2201/0738 , H05K2201/09136 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49155 , Y10T156/10
摘要： A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.
摘要翻译： 描述了一种用于设计符合规格的印刷电路板的方法。 第一电压可切换电介质材料与第一铜箔一起放置。 第二可电压切换电介质材料与第二铜箔一起放置。 第一铜箔的弓形部分与铝构件的第一侧相配合，粘合剂物质位于第一铜箔和铝构件的第一侧之间。 第二铜箔的弧形部分与铝构件的第二侧配合，粘合剂物质位于第二铜箔和铝构件的第二侧之间。
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3.发明授权Method of manufacturing a substrate having a voltage switchable dielectric material 有权制造具有可开关电介质材料的基板的方法公开(公告)号：US09084354B2
公开(公告)日：2015-07-14
申请号：US13597152
申请日：2012-08-28
申请人： Robert Fleming , Lex Kosowsky , Shurui Shang , Bhret Graydon , Xiaofeng Chen , Glen Irvin
发明人： Robert Fleming , Lex Kosowsky , Shurui Shang , Bhret Graydon , Xiaofeng Chen , Glen Irvin
CPC分类号： H05K1/0259 , H05K1/0271 , H05K1/036 , H05K1/0373 , H05K3/0005 , H05K2201/068 , H05K2201/0738 , H05K2201/09136 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49155 , Y10T156/10
摘要： A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.
摘要翻译： 描述了一种用于设计符合规格的印刷电路板的方法。 第一电压可切换电介质材料与第一铜箔一起放置。 第二可电压切换电介质材料与第二铜箔一起放置。 第一铜箔的弓形部分与铝构件的第一侧相配合，粘合剂物质位于第一铜箔和铝构件的第一侧之间。 第二铜箔的弧形部分与铝构件的第二侧配合，粘合剂物质位于第二铜箔和铝构件的第二侧之间。
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公开(公告)号：US20120318569A1
公开(公告)日：2012-12-20
申请号：US13597152
申请日：2012-08-28
申请人： Robert Fleming , Lex Kosowsky , Shurui Shang , Bhret Graydon , Xiaofeng Chen , Glen Irvin
发明人： Robert Fleming , Lex Kosowsky , Shurui Shang , Bhret Graydon , Xiaofeng Chen , Glen Irvin
CPC分类号： H05K1/0259 , H05K1/0271 , H05K1/036 , H05K1/0373 , H05K3/0005 , H05K2201/068 , H05K2201/0738 , H05K2201/09136 , Y10T29/49117 , Y10T29/49124 , Y10T29/4913 , Y10T29/49155 , Y10T156/10
摘要： A method for designing a printed circuit board to meet a specification is described. A first voltage switchable dielectric material is placed in apposition with a first copper foil. A second voltage switchable dielectric material is placed in apposition with a second copper foil. An arcuate portion of the first copper foil is placed in apposition with a first side of an aluminum member, an adhesive substance being situated between the first copper foil and the first side of the aluminum member. An arcuate portion of the second copper foil in is placed apposition with a second side of the aluminum member, an adhesive substance being situated between the second copper foil and the second side of the aluminum member.
摘要翻译： 描述了一种用于设计符合规格的印刷电路板的方法。 第一电压可切换电介质材料与第一铜箔一起放置。 第二可电压切换电介质材料与第二铜箔一起放置。 第一铜箔的弓形部分与铝构件的第一侧相配合，粘合剂物质位于第一铜箔和铝构件的第一侧之间。 第二铜箔的弧形部分与铝构件的第二侧配合，粘合剂物质位于第二铜箔和铝构件的第二侧之间。
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公开(公告)号：US08399773B2
公开(公告)日：2013-03-19
申请号：US12694702
申请日：2010-01-27
CPC分类号： H05K1/0259 , H05K1/0271 , H05K1/036 , H05K1/0373 , H05K3/0005 , H05K2201/068 , H05K2201/0738 , H05K2201/09136 , Y10T428/24917 , Y10T428/24942
摘要： Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.
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公开(公告)号：US20100187006A1
公开(公告)日：2010-07-29
申请号：US12694702
申请日：2010-01-27
CPC分类号： H05K1/0259 , H05K1/0271 , H05K1/036 , H05K1/0373 , H05K3/0005 , H05K2201/068 , H05K2201/0738 , H05K2201/09136 , Y10T428/24917 , Y10T428/24942
摘要： Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.
摘要翻译： 各种方面提供将VSDM结合到基底中以产生受ESD保护的基底。 在一些情况下，以导致ESD保护的衬底满足用于各种后续处理或应用的一个或多个规格（例如，厚度，平面度等）的方式结合VSDM。 各种方面提供了设计包含VSDM的衬底（例如，PCB），以及调整衬底的一个或多个方面以设计平衡的，受ESD保护的衬底。 某些实施方案包括将具有VSDM层的基底模制成第一形状。
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公开(公告)号：US09226391B2
公开(公告)日：2015-12-29
申请号：US12976236
申请日：2010-12-22
申请人： Shurui Shang , Robert Fleming
发明人： Shurui Shang , Robert Fleming
CPC分类号： H05K1/0271 , H05K1/0259 , H05K1/036 , H05K1/0373 , H05K3/0005 , H05K2201/068 , H05K2201/0738 , H05K2201/09136 , Y10T29/49124
摘要： Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.
摘要翻译： 各种方面提供将VSDM结合到基底中以产生受ESD保护的基底。 在一些情况下，以导致ESD保护的衬底满足用于各种后续处理或应用的一个或多个规格（例如，厚度，平面度等）的方式结合VSDM。 各种方面提供了设计包含VSDM的衬底（例如，PCB），以及调整衬底的一个或多个方面以设计平衡的，受ESD保护的衬底。 某些实施方案包括将具有VSDM层的基底模制成第一形状。
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公开(公告)号：US20110132647A1
公开(公告)日：2011-06-09
申请号：US12976236
申请日：2010-12-22
申请人： Shurui Shang , Robert Fleming
发明人： Shurui Shang , Robert Fleming
CPC分类号： H05K1/0271 , H05K1/0259 , H05K1/036 , H05K1/0373 , H05K3/0005 , H05K2201/068 , H05K2201/0738 , H05K2201/09136 , Y10T29/49124
摘要： Various aspects provide for incorporating a VSDM into a substrate to create an ESD-protected substrate. In some cases, a VSDM is incorporated in a manner that results in the ESD-protected substrate meeting one or more specifications (e.g., thickness, planarity, and the like) for various subsequent processes or applications. Various aspects provide for designing a substrate (e.g., a PCB) incorporating a VSDM, and adjusting one or more aspects of the substrate to design a balanced, ESD-protected substrate. Certain embodiments include molding a substrate having a VSDM layer into a first shape.
摘要翻译： 各种方面提供将VSDM结合到基底中以产生受ESD保护的基底。 在一些情况下，以导致ESD保护的衬底满足用于各种后续处理或应用的一个或多个规格（例如，厚度，平面度等）的方式结合VSDM。 各种方面提供了设计包含VSDM的衬底（例如，PCB），以及调整衬底的一个或多个方面以设计平衡的，受ESD保护的衬底。 某些实施方案包括将具有VSDM层的基底模制成第一形状。
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