CARBON MATERIALS FOR CARBON IMPLANTATION
    2.
    发明申请
    CARBON MATERIALS FOR CARBON IMPLANTATION 审中-公开
    用于碳化物的碳材料

    公开(公告)号:US20110021011A1

    公开(公告)日:2011-01-27

    申请号:US12842006

    申请日:2010-07-22

    IPC分类号: H01L21/265

    摘要: A method of implanting carbon ions into a target substrate, including: ionizing a carbon containing dopant material to produce a plasma having ions; optionally co-flowing an additional gas or series of gases with the carbon-containing dopant material; and implanting the ions into the target substrate. The carbon-containing dopant material is of the formula CwFxOyHz wherein if w=1, then x>0 and y and z can take any value, and wherein if w>1 then x or y is >0, and z can take any value. Such method significantly improves the efficiency of an ion implanter tool, in relation to the use of carbon source gases such as carbon monoxide or carbon dioxide.

    摘要翻译: 一种将碳离子注入目标衬底的方法,包括:使含碳的掺杂剂材料电离以产生具有离子的等离子体; 任选地将另外的气体或一系列气体与含碳掺杂剂材料共流动; 并将离子注入目标衬底。 含碳掺杂剂材料为CwFxOyHz,其中如果w = 1,则x> 0,y和z可以取任何值,并且其中如果w> 1,则x或y> 0,并且z可以取任何值 。 相对于碳源气体如一氧化碳或二氧化碳的使用,这种方法显着地提高了离子注入机工具的效率。

    METHOD OF FORMING ULTRA-SHALLOW JUNCTIONS FOR SEMICONDUCTOR DEVICES
    4.
    发明申请
    METHOD OF FORMING ULTRA-SHALLOW JUNCTIONS FOR SEMICONDUCTOR DEVICES 审中-公开
    形成用于半导体器件的超微结点的方法

    公开(公告)号:US20100112795A1

    公开(公告)日:2010-05-06

    申请号:US12570995

    申请日:2009-09-30

    IPC分类号: H01L21/265

    摘要: A first method for producing a doped region in a semiconductor substrate includes performing a first implant step in which a carborane cluster molecule is implanted into a semiconductor substrate to form a doped region. A second method for producing a semiconductor device having a shallow junction region includes providing a first gas and a second gas in a container. The first gas includes a first dopant and the second gas includes a second dopant. The second method also includes implanting the first and second dopants into a semiconductor substrate using an ion. The ion source is not turned off between the steps of implanting the first dopant and implanting the second dopant.

    摘要翻译: 用于在半导体衬底中制造掺杂区域的第一种方法包括进行第一注入步骤,其中将碳硼烷簇分子注入到半导体衬底中以形成掺杂区域。 用于制造具有浅结区域的半导体器件的第二种方法包括在容器中提供第一气体和第二气体。 第一气体包括第一掺杂剂,第二气体包括第二掺杂剂。 第二种方法还包括使用离子将第一和第二掺杂剂注入到半导体衬底中。 离子源在植入第一掺杂剂和注入第二掺杂剂的步骤之间不被关闭。