摘要:
A compressible electrical connector (10) includes a rigid molded body (11) having elastomeric caps (19, 20) at the top (12) and bottom (13) thereof. A thin flexible film (21), provided with respective connector elements (22), is wrapped around the rigid molded body (11) and its caps (19, 20) and is retained by a film retaining plate (23). The film retaining plate (23) has a plurality of latching lances (24) received in corresponding mounting holes (30) formed transversely in the rigid molded body (11). A hot melt layer (36) is placed over the film retaining plate (23), and a plurality of compressible electrical connectors (10) are stacked side-by-side to form an array (35). The array (35) is disposed between a pair of PC boards or other electronic assemblies (39, 40) having respective circuit elements (37, 38). The height of the rigid molded body may be changed conveniently to readily accommodate different product applications.
摘要:
A connector body (10 10', 10") is mounted on a mother board (11) and has a compressible electrical connector (15). A daughter board (22) is slidably inserted into the connector body (10, 10', 10") perpendicularly of the mother board (11). A deflection means (34, 56) engages a side of the daughter board (22) and deflects the daughter board (22) away from the compressible electrical connector (15) to prevent damage thereto after the daughter board (22) is slidably inserted. When the daughter board (22) is fully inserted, a retaining means 28, 43, 69) exerts a lateral clamping force on the daughter board (22).
摘要:
A combination heat sink (18, 41, 43) and circuit interface comprises a metallic wafer (15) disposed between an integrated circuit (11) and a printed circuit board (14) in a land grid array package (10). A frame (13) for the integrated circuit (11) is nested within the heat sink (18, 41, 43) and a latch (30) is pivotably mounted on the frame (13) for retaining the overall package (10). The circuit interface comprises a plurality of flexible electrical connectors (19) mounted on the wafer (15).
摘要:
The invention is directed to an electronic assembly, such as a backplane assembly of the type including a mother board, a connector housing mounted on the mother board, and a daughter board slidably insertable into the connector housing for electrical interconnection to the mother board. The assembly comprises an elongated connector housing having a pair of parallelly disposed spaced apart housing members defining at least one slot therebetween for receiving the daughter board. A force generating member is disposed within the slot, where the force generating members comprises a pair of resilient, essentially L-shaped members. One leg of each of the L-shaped members is fixedly disposed between the mother board and the housing members, while the others of the legs upstand within the slot in a spaced apart relationship to receive the daughter board therebetween, the upstanding legs including at least one pair of opposing elastomeric members to apply a compressive pressure to said daughter board. Further, a flexible circuit element is mounted on the force generating member and is operatively disposed to electrically interconnect the daughter board to the mother board. A preferred feature thereof is the provision of a camming means on the upstanding legs to allow insertion of the daughter board without causing damage to the circuitry on the flexible circuit element, preferable in the form of a flat film.
摘要:
A pluggable connector system (10) has a male housing (11, 11', 11", 11"') snapped together with a female housing (12, 12', 12", 12"') thereby providing a quick-disconnect feature. One of the housings, or both, carries a flexible etched circuit (16). The flexible etched circuit (16) may engage another flexible etched circuit (16) or, via a suitable interface, may engage a printed circuit board (17) having at least one circuit pad (19) thereon. One embodiment of a suitable interface is a flexible electrical connector (21) having a plurality of circuit traces on an elastomeric core. In another embodiment, the flexible etched circuit (16) is backed up by resilient means (33, 35) and engages the circuit pad (19) directly. The means for releasably retaining the housings (11, 11', 11", 11"' and 12, 12', 12", 12"') comprises a pair of spring-loaded manually-releasable latches (24, 24', 25) or a pair of bifurcated latching ears (43, 44).
摘要:
A burn-in socket for integrated circuit chips has a clamping means actuated by a thermally-reactive resilient means, operative during the burn-in cycle itself, such that the chip frames are retained and good electrical contact with the chip leads is maintained during burn-in.
摘要:
An interface for connecting coplanar printed circuit ("PC") boards (10, 20) using a flexible jumper circuit (50) for bridging the PC boards (10, 20), a base (80) underlying the second PC board and integrally attached thereto, and a support housing (30) with compression plugs (60) which may be tightened against base (80) for securing the two PC boards (10, 20) and for compressing the flexible jumper circuit (50) against the two PC boards (10, 20). The interface is precision aligned by a plurality of guide pins (34) which protrude from support housing (30) and conform to guide holes in the two PC boards (10, 20) and the flexible jumper circuit (50). Guide pins (34) fix the relative positions of the boards (10, 20) and circuit (50) within their respective planes. The resilient compression plugs (60) maintain contact between the flexible jumper circuit (50) and the two PC boards (10, 20) despite irregularities in thickness, and the guide pins 34 maintain precision horizontal alignment between the contact pads (12, 22) on the two PC boards (10, 20) and the conductive traces (52) on the flexible jumper circuit (50).
摘要:
A docking station (10) slidably receives a device (12) to provide make, break or tap functions, respectively, in a circuit interface. The circuit interface includes a pair of connector housings (17, 18) provided with flexible (or compressible) electrical connectors (19, 20), respectively. A camming member (28, 29; 31, 32; 44) separates the connector housings (17, 18) as the device (12) is slidably inserted into the docking station (10), thereby assuring a substantially zero insertion force on the circuit interface. Preferably, the circuit interface is between the flexible electrical connectors (19, 20), a printed circuit board (13), and a flexible etched circuit (15). The flexible etched circuit (15) is provided with a stiffener (24) resiliently biased by springs (27).
摘要:
The invention is directed to an electronic docking connector for edge mounting an electronic device, such as a daughter board, to a mother board. The connector comprises a pair of housing members assembled to define an elongated slot planarly aligned with the edge of the mother board. Mounted therein is a pair of opposed force applying, resilient spring members operatively mounted for receiving and applying a compressive force against the electronic device. A flexible film member, containing electrical circuitry thereon, is also mounted within said housing members for electrically interconnecting corresponding circuitry on the mother board, and the electronic device. As an alternative, a dielectric insert is disposed between each spring member and its corresponding flexible film to reduce or eliminate cross talk therein.
摘要:
A unitary heat sink and connector housing (10, 10', 10", 10"') is disposed between a pair of electrical members, such as printed circuit boards (11, 12, 31) and/or flexible etched circuits (32) in an overall assembly used in a variety of high-performance miniaturized electronic products. One or more flexible electrical connectors (21, 25, 26, 29, 30) are mounted within the unitary heat sink and connector housing (10, 10', 10", 10"') and provide a circuit interface between respective circuit elements or pads (13, 14) on the printed circuit boards (11, 12, 31) and/or flexible etched circuits (32), respectively. The unitary heat sink and connector housing (10, 10', 10", 10"'), which preferably has heat-radiating fins (20), is made from a material which is thermally conductive but electrically non-conductive. Examples of such a material are anodized aluminum, silicon dioxide and beryllium oxide. Any suitable ceramic material could be used.