公开(公告)号：US5384433A

公开(公告)日：1995-01-24

申请号：US32723

申请日：1993-03-16

申请人： Robert Osann, Jr. ,  Jeffery A. Ausman ,  David R. Halbert

发明人： Robert Osann, Jr. ,  Jeffery A. Ausman ,  David R. Halbert

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H05K3/34 ,  H05K3/40

CPC分类号： H05K1/0246 ,  H05K1/0287 ,  H05K1/0231 ,  H05K1/181 ,  H05K2201/09309 ,  H05K2201/0949 ,  H05K2201/10022 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2203/1572 ,  H05K3/222 ,  H05K3/3447 ,  H05K3/4046 ,  Y02P70/611

摘要： A printed circuit board includes an array of conductive pads including component-mounting holes disposed on first and second surfaces thereon. An array of conductive attachment lands arranged in pairs of first and second attachment lands are disposed on the first and second surfaces. The first and second attachment lands are insulated from one another and separated by a distance selected to allow attachment of standard sized components therebetween on the first and second surfaces of said circuit board. First and second conductive power distribution planes are disposed on the first and second surfaces and are insulated from the conductive pads and the second attachment lands disposed thereon. The first attachment land of each pair on the first surface of the circuit board is electrically connected to the first power distribution plane and the first attachment land of each pair on the second surface of the circuit board is electrically connected to the second power distribution plane, and the second attachment land of each pair on the first and second surfaces of the circuit board electrically connected to one of the conductive pads.

摘要翻译： 印刷电路板包括导电焊盘的阵列，其包括设置在其上的第一和第二表面上的部件安装孔。 布置成成对的第一和第二附接平台的导电附着平台阵列设置在第一和第二表面上。 第一和第二附接平台彼此绝缘并且分开一定距离，以允许在所述电路板的第一和第二表面之间连接标准尺寸的部件。 第一和第二导电配电面设置在第一表面和第二表面上，并与导电焊盘和设置在其上的第二附接焊盘绝缘。 电路板的第一表面上的每一对的第一附着平台与第一配电面电连接，并且电路板的第二表面上的每一对的第一安装台电连接到第二配电面， 并且电路板的第一和第二表面上的每一对的第二附接平台电连接到一个导电焊盘。