公开(公告)号：US20240234230A1

公开(公告)日：2024-07-11

申请号：US18617040

申请日：2024-03-26

Applicant: Rohm Co., Ltd.

Inventor： Natsuki SAKAMOTO ,  Hiroyuki SHINKAI

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/3121 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/94 ,  H01L2224/32238 ,  H01L2224/94 ,  H01L2924/1815

Abstract: An electronic device includes an electronic component, a resin member covering the electronic component, and a conductive member supported by the resin member. The resin member includes a first resin side surface and a second resin side surface that intersect with each other. The conductive member includes a first corner terminal including a first exposed surface exposed from the first resin side surface and a second exposed surface exposed from the second resin side surface. The first corner terminal includes a first surface connected to the first exposed surface and the second exposed surface as viewed in a thickness direction of the resin member. The first surface is covered with the resin member.

公开(公告)号：US20230091632A1

公开(公告)日：2023-03-23

申请号：US17816826

申请日：2022-08-02

Applicant: ROHM CO., LTD.

Inventor： Satoshi KAGEYAMA ,  Hiroyuki SHINKAI ,  Yoshihisa TAKADA ,  Natsuki SAKAMOTO

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device includes: a resin layer having a resin main surface; a mounting wiring layer arranged on the resin main surface, and having a mounting wiring main surface facing the same side as the resin main surface and a mounting wiring back surface facing the side of the resin main surface; a semiconductor element including an element wiring layer which is mounted on the mounting wiring main surface, has an element wiring main surface facing the side of the resin layer, and is connected to the mounting wiring layer; and a sealing resin which seals the mounting wiring layer and the semiconductor element, wherein the mounting wiring main surface and the element wiring main surface are rough surfaces having a larger surface roughness than the mounting wiring back surface.

公开(公告)号：US20240112996A1

公开(公告)日：2024-04-04

申请号：US17768374

申请日：2020-10-19

Applicant: ROHM CO., LTD.

Inventor： Hiroshi OJI ,  Hiroyuki SHINKAI ,  Natsuki SAKAMOTO ,  Naoyuki SANO

IPC: H01L23/498 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L23/49811 ,  H01L23/3121 ,  H01L25/165 ,  H01L24/05

Abstract: A semiconductor device includes: a substrate having an obverse and a reverse face; wirings on the obverse face such as a first and a second drive wiring; a semiconductor element connected to the first and second drive wirings; a first drive conductor on the same side as the semiconductor element with respect to the substrate outside of the semiconductor element as viewed in a thickness direction and connected to the first drive wiring; a second drive conductor on the same side as the semiconductor element with respect to the substrate outside of the semiconductor element as viewed in the thickness direction and connected to the second drive wiring; and a sealing resin covering the wirings and the semiconductor element, while also covering the first and second drive conductor such that their faces opposite to the substrate in the thickness direction are exposed. The first and the second drive conductor are separated in a direction parallel to the obverse face. The first drive conductor is smaller in volume than the second drive conductor.