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    SEMICONDUCTOR DEVICE
    1.
    发明申请
    SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20220328407A1

    公开(公告)日：2022-10-13

    申请号：US17851313

    申请日：2022-06-28

    Applicant: ROHM CO., LTD.

    Inventor： Hideaki YANAGIDA ,  Yoshihisa TAKADA

    IPC: H01L23/528 ,  H01L23/532 ,  H01L23/00

    Abstract: There is provided a terminal that includes a first conductive layer; a wiring layer on the first conductive layer; a second conductive layer on the wiring layer; and a conductive bonding layer which is in contact with a bottom surface and a side surface of the first conductive layer, a side surface of the wiring layer, a portion of a side surface of the second conductive layer, and a portion of a bottom surface of the second conductive layer, wherein an end portion of the second conductive layer protrudes from an end portion of the first conductive layer and an end portion of the wiring layer, and wherein the conductive bonding layer is in contact with a bottom surface of the end portion of the second conductive layer.

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    3.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20230091632A1

    公开(公告)日：2023-03-23

    申请号：US17816826

    申请日：2022-08-02

    Applicant: ROHM CO., LTD.

    Inventor： Satoshi KAGEYAMA ,  Hiroyuki SHINKAI ,  Yoshihisa TAKADA ,  Natsuki SAKAMOTO

    IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

    Abstract: A semiconductor device includes: a resin layer having a resin main surface; a mounting wiring layer arranged on the resin main surface, and having a mounting wiring main surface facing the same side as the resin main surface and a mounting wiring back surface facing the side of the resin main surface; a semiconductor element including an element wiring layer which is mounted on the mounting wiring main surface, has an element wiring main surface facing the side of the resin layer, and is connected to the mounting wiring layer; and a sealing resin which seals the mounting wiring layer and the semiconductor element, wherein the mounting wiring main surface and the element wiring main surface are rough surfaces having a larger surface roughness than the mounting wiring back surface.

    SEMICONDUCTOR DEVICE
    4.
    发明申请
    SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20210035889A1

    公开(公告)日：2021-02-04

    申请号：US16939502

    申请日：2020-07-27

    Applicant: ROHM CO., LTD.

    Inventor： Satoshi KAGEYAMA ,  Yoshihisa TAKADA

    IPC: H01L23/488 ,  H01L23/00 ,  H01L23/04 ,  H01L23/12

    Abstract: There is provided a semiconductor device that includes a wiring layer having a main surface and a rear surface which face opposite sides in a thickness direction, a first insulating layer covering an entirety of the rear surface, a second insulating layer which is in contact with the main surface, a semiconductor element which faces the second insulating layer and is mounted on the wiring layer, and a sealing resin which is in contact with the second insulating layer and covers the semiconductor element, wherein surface roughness of the main surface is larger than surface roughness of the rear surface.

    SEMICONDUCTOR DEVICE
    5.
    发明公开
    SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20230317608A1

    公开(公告)日：2023-10-05

    申请号：US18327232

    申请日：2023-06-01

    Applicant: ROHM CO., LTD.

    Inventor： Hideaki YANAGIDA ,  Yoshihisa TAKADA

    IPC: H01L23/528 ,  H01L23/532 ,  H01L23/00

    CPC classification number: H01L23/5283 ,  H01L23/53233 ,  H01L23/53261 ,  H01L24/20

    Abstract: A terminal includes a first conductive layer; a wiring layer on the first conductive layer; a second conductive layer on the wiring layer; and a conductive bonding layer that is in contact with a bottom surface and a side surface of the first conductive layer, a side surface of the wiring layer, a portion of a side surface of the second conductive layer, and a portion of a bottom surface of the second conductive layer, wherein an end portion of the second conductive layer protrudes from an end portion of the first conductive layer and an end portion of the wiring layer, and wherein the conductive bonding layer is in contact with a bottom surface of the end portion of the second conductive layer.

    SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT PRODUCTION METHOD
    7.
    发明申请
    SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT PRODUCTION METHOD 有权

    公开(公告)号：US20220352105A1

    公开(公告)日：2022-11-03

    申请号：US17765265

    申请日：2020-09-29

    Applicant: ROHM CO., LTD.

    Inventor： Isamu NISHIMURA ,  Hiroyuki SHINKAI ,  Yoshihisa TAKADA ,  Hideaki YANAGIDA ,  Hirofumi TAKEDA

    IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L25/16

    Abstract: A semiconductor device includes a substrate, a wire portion, a bonding portion, a semiconductor element, and an encapsulation resin. The substrate includes substrate main and back surfaces facing in opposite directions. The wire portion includes a conductive layer formed on the substrate main surface. The bonding portion includes a first plated layer formed on an upper surface of the wire portion and a first solder layer formed on an upper surface of the first plated layer. The semiconductor element includes an element main surface facing the substrate main surface, an element electrode formed on the element main surface, and a second plated layer formed on a lower surface of the element electrode and bonded to the first solder layer. The encapsulation resin covers the semiconductor element. The bonding portion is larger than the element electrode as viewed in a thickness-wise direction that is perpendicular to the substrate main surface.

    TERMINAL AND SEMICONDUCTOR DEVICE
    8.
    发明申请
    TERMINAL AND SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20210098374A1

    公开(公告)日：2021-04-01

    申请号：US17003124

    申请日：2020-08-26

    Applicant: ROHM CO., LTD.

    Inventor： Hideaki YANAGIDA ,  Yoshihisa TAKADA

    IPC: H01L23/528 ,  H01L23/00 ,  H01L23/532

    Abstract: There is provided a terminal that includes a first conductive layer; a wiring layer on the first conductive layer; a second conductive layer on the wiring layer; and a conductive bonding layer which is in contact with a bottom surface and a side surface of the first conductive layer, a side surface of the wiring layer, a portion of a side surface of the second conductive layer, and a portion of a bottom surface of the second conductive layer, wherein an end portion of the second conductive layer protrudes from an end portion of the first conductive layer and an end portion of the wiring layer, and wherein the conductive bonding layer is in contact with a bottom surface of the end portion of the second conductive layer.

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