公开(公告)号：US09197194B2

公开(公告)日：2015-11-24

申请号：US13595893

申请日：2012-08-27

申请人： Ronald Eugene Reedy ,  Dan William Nobbe ,  Tero Tapio Ranta ,  Cheryl V. Liss ,  David Kovac

发明人： Ronald Eugene Reedy ,  Dan William Nobbe ,  Tero Tapio Ranta ,  Cheryl V. Liss ,  David Kovac

IPC分类号： H03H11/28 ,  H03H7/38 ,  H03H7/01 ,  H01F21/12

CPC分类号： H03K17/162 ,  H01F21/12 ,  H01G4/002 ,  H01G7/00 ,  H01L23/5223 ,  H01L27/0629 ,  H01L27/1203 ,  H01L28/60 ,  H03H7/0153 ,  H03H7/38 ,  H03H11/28 ,  H03J3/20 ,  H03J2200/10 ,  H03K17/102 ,  H03K17/687 ,  H03M1/1061 ,  H03M1/804

摘要： Methods and apparatuses for use in tuning reactance are described. Open loop and closed loop control for tuning of reactances are also described. Tunable inductors and/or tunable capacitors may be used in filters, resonant circuits, matching networks, and phase shifters. Ability to control inductance and/or capacitance in a circuit leads to flexibility in operation of the circuit, since the circuit may be tuned to operate under a range of different operating frequencies.

摘要翻译： 描述用于调谐电抗的方法和装置。 还描述了用于调谐电抗的开环和闭环控制。 可调电感器和/或可调谐电容器可用于滤波器，谐振电路，匹配网络和移相器。 控制电路中的电感和/或电容的能力导致电路工作的灵活性，因为可以将电路调谐到在不同工作频率的范围内工作。

公开(公告)号：US20130222075A1

公开(公告)日：2013-08-29

申请号：US13595893

申请日：2012-08-27

申请人： Ronald Eugene Reedy ,  Dan William Nobbe ,  Tero Tapio Ranta ,  Cheryl V. Liss ,  David Kovac

发明人： Ronald Eugene Reedy ,  Dan William Nobbe ,  Tero Tapio Ranta ,  Cheryl V. Liss ,  David Kovac

IPC分类号： H03H11/28

CPC分类号： H03K17/162 ,  H01F21/12 ,  H01G4/002 ,  H01G7/00 ,  H01L23/5223 ,  H01L27/0629 ,  H01L27/1203 ,  H01L28/60 ,  H03H7/0153 ,  H03H7/38 ,  H03H11/28 ,  H03J3/20 ,  H03J2200/10 ,  H03K17/102 ,  H03K17/687 ,  H03M1/1061 ,  H03M1/804

摘要： Methods and apparatuses for use in tuning reactance are described. Open loop and closed loop control for tuning of reactances are also described. Tunable inductors and/or tunable capacitors may be used in filters, resonant circuits, matching networks, and phase shifters. Ability to control inductance and/or capacitance in a circuit leads to flexibility in operation of the circuit, since the circuit may be tuned to operate under a range of different operating frequencies.

摘要翻译： 描述用于调谐电抗的方法和装置。 还描述了用于调谐电抗的开环和闭环控制。 可调电感器和/或可调谐电容器可用于滤波器，谐振电路，匹配网络和移相器。 控制电路中的电感和/或电容的能力导致电路工作的灵活性，因为电路可以被调谐到在不同工作频率范围内工作。

公开(公告)号：US20130154088A1

公开(公告)日：2013-06-20

申请号：US13528832

申请日：2012-06-20

申请人： James S. Cable ,  Anthony Mark Miscione ,  Ronald Eugene Reedy

发明人： James S. Cable ,  Anthony Mark Miscione ,  Ronald Eugene Reedy

IPC分类号： H01L27/12 ,  H01L21/78

CPC分类号： H01L27/1203 ,  H01L21/78 ,  H01L27/0694 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/11002 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/94 ,  H01L2924/15192 ,  H01L2224/11

摘要： Novel integrated circuits (SOI ICs), and methods for making and mounting the ICs are disclosed. In one embodiment, an IC comprises a first circuit layer of the IC formed from an active layer of an SOI wafer. The first circuit layer is coupled to a first surface of buffer layer, and a second surface of the buffer layer is coupled to a selected substrate comprising an insulating material. The selected substrate may be selected, without limitation, from the following types: sapphire, quartz, silicon dioxide glass, piezoelectric materials, and ceramics. A second circuit layer of the IC are formed, coupled to a second surface of the selected substrate. In one embodiment of a mounted IC, the first circuit layer is coupled to contact pads on a package substrate via solder bumps or copper pillars. The second circuit layer is coupled to contact pads on the package substrate via wire bonds.

摘要翻译： 公开了新型集成电路（SOI IC）以及制造和安装IC的方法。 在一个实施例中，IC包括由SOI晶片的有源层形成的IC的第一电路层。 第一电路层耦合到缓冲层的第一表面，并且缓冲层的第二表面耦合到包括绝缘材料的选定衬底。 所选择的基板可以选自但不限于以下类型：蓝宝石，石英，二氧化硅玻璃，压电材料和陶瓷。 形成IC的第二电路层，耦合到所选择的衬底的第二表面。 在安装的IC的一个实施例中，第一电路层通过焊料凸块或铜柱与封装衬底上的接触焊盘耦合。 第二电路层通过引线接合耦合到封装衬底上的接触焊盘。

公开(公告)号：US09947688B2

公开(公告)日：2018-04-17

申请号：US13528832

申请日：2012-06-20

申请人： James S. Cable ,  Anthony Mark Miscione ,  Ronald Eugene Reedy

发明人： James S. Cable ,  Anthony Mark Miscione ,  Ronald Eugene Reedy

IPC分类号： H01L21/00 ,  H01L21/36 ,  H01L21/20 ,  H01L27/12 ,  H01L27/06 ,  H01L21/78

CPC分类号： H01L27/1203 ,  H01L21/78 ,  H01L27/0694 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/11002 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/94 ,  H01L2924/15192 ,  H01L2224/11

摘要： Novel integrated circuits (SOI ICs), and methods for making and mounting the ICs are disclosed. In one embodiment, an IC comprises a first circuit layer of the IC formed from an active layer of an SOI wafer. The first circuit layer is coupled to a first surface of buffer layer, and a second surface of the buffer layer is coupled to a selected substrate comprising an insulating material. The selected substrate may be selected, without limitation, from the following types: sapphire, quartz, silicon dioxide glass, piezoelectric materials, and ceramics. A second circuit layer of the IC are formed, coupled to a second surface of the selected substrate. In one embodiment of a mounted IC, the first circuit layer is coupled to contact pads on a package substrate via solder bumps or copper pillars. The second circuit layer is coupled to contact pads on the package substrate via wire bonds.