公开(公告)号：US5171717A

公开(公告)日：1992-12-15

申请号：US647861

申请日：1991-01-30

申请人： Ronald F. Broom ,  Marcel Gasser ,  Christoph S. Harder ,  Ernst E. Latta ,  Albertus Oosenbrug ,  Heinz Richard ,  Peter Vettiger

发明人： Ronald F. Broom ,  Marcel Gasser ,  Christoph S. Harder ,  Ernst E. Latta ,  Albertus Oosenbrug ,  Heinz Richard ,  Peter Vettiger

IPC分类号： B28D5/00 ,  H01L21/301 ,  H01S5/00 ,  H01S5/02

CPC分类号： B28D5/0029 ,  H01S5/0202 ,  Y10T225/12

摘要： A method for cleaving semiconductor wafers, or segments thereof, which comprises placing the wafer, provided with scribe lines defining the planes where cleaving is to take place, inbetween a pair of flexible transport bands and guiding it around a curved, large radius surface thereby applying a bending moment. With a moment of sufficient magnitude, individual bars are broken off the wafer as this is advanced, the bars having front-and rear-end facets. On cleaving, each bar, while still pressed against the curved surface, is automatically separated whereby mutual damage of the facets of neighboring bars is prevented. For further handling, e.g. for the transport of the bars to an evaporation station for passivation layer deposition, provisions are made to keep the bars separated. Cleaving and the subsequent passivation coating can be carried out in-situ in a vacuum system to prevent facet contamination prior to applying the passivation.

摘要翻译： 一种用于切割半导体晶片或其部分的方法，其包括将设置有限定要进行裂开的平面的切割线的晶片放置在一对柔性传输带之间并将其引导到弯曲的大半径表面上，从而施加 一个弯曲的时刻。 有了足够的时刻，随着这个进步，单个的条被从晶片上分离出来，这些条具有前端和后端方面。 在切割时，每个杆在仍然压靠弯曲表面的同时被自动分离，从而防止相邻杆的小面的相互损坏。 为了进一步处理，例如 为了将棒运送到用于钝化层沉积的蒸发站，进行了保持棒分离的规定。 切割和随后的钝化涂层可以在真空系统中原位进行，以防止在施加钝化之前的小面污染。

公开(公告)号：US4995539A

公开(公告)日：1991-02-26

申请号：US406943

申请日：1989-09-13

申请人： Heinz Richard

发明人： Heinz Richard

IPC分类号： B26F3/00 ,  B28D5/00 ,  H01L21/301 ,  H01L21/304

CPC分类号： B26F3/002 ,  B28D5/0029 ,  B28D5/0052 ,  H01L21/304 ,  Y10T225/12 ,  Y10T225/325 ,  Y10T225/371 ,  Y10T225/386

摘要： A method and apparatus for breaking a scribed workpiece such as a semiconductor wafer is taught. Briefly stated, the semiconductor wafer is disposed between two elastomeric foils, one of which is adhesively attached to the side of the workpiece which is not scribed. The foils are stretched and a force is then applied to the sandwich so that the workpiece breaks along the scribed lines. Due to the elastomeric nature of the foils the broken pieces separate slightly and remain separated after breaking, thereby preventing damage to adjacent surfaces of the workpiece.

公开(公告)号：US06424442B1

公开(公告)日：2002-07-23

申请号：US08793994

申请日：1997-02-25

申请人： Fritz Gfeller ,  Heinz Richard ,  Beat Weiss

发明人： Fritz Gfeller ,  Heinz Richard ,  Beat Weiss

IPC分类号： H04B1000

CPC分类号： H04B10/1143 ,  H04B10/40

摘要： Disclosed are optical transmitter and transceiver modules for data communication. Such a transceiver module comprises an array of light emitting diodes mounted on a mounting base (140) being arranged in a regular and symmetrical manner in a dome-shaped housing (142). This housing (142) comprises diffusor means for source enlargement. In addition to the transmitter part consisting of said diodes, the transceiver module comprises a receiver. The receiver has four photodiodes (143) arranged below the mounting base (140). These photodiodes are tilted and face in different directions to receive light from all around the module. The photodiodes are protected by a thin wire mesh (145) which serves as Faraday cage to reduce electro magnetic interference. A substrate (144) for electronic circuitry in SMD-Technology is situated underneath the photodiodes (143).

摘要翻译： 公开了用于数据通信的光发射机和收发器模块。 这种收发器模块包括安装在安装基座（140）上的发光二极管阵列，其以规则和对称的方式布置在圆顶形壳体（142）中。 该壳体（142）包括用于放大源的扩散器装置。 除了由所述二极管组成的发射器部分之外，收发器模块还包括接收器。 接收器具有布置在安装基座（140）下方的四个光电二极管（143）。 这些光电二极管倾斜并面向不同的方向，以接收来自模块周围的光。 光电二极管由用作法拉第笼的细金属丝网（145）保护，以减少电磁干扰。 用于SMD技术中的电子电路的衬底（144）位于光电二极管（143）的下方。