摘要:
A media processing system for processing media having differing properties, the media processing system having a base. The base has a base radial alignment portion, a base vertical alignment portion, and a base retention portion. A set of removable media clamps is included, where each of the set of removable media clamps is adapted for the differing properties of the media, each removable media clamp has a removable media clamp radial alignment portion for engaging the base radial alignment portion and radially aligning the removable media clamp with the base, a removable media clamp vertical alignment portion for engaging the base vertical alignment portion and vertically aligning the removable media clamp with the base, and a media engagement portion for engaging the media. The retention portion is controllable by the media processing system to selectively retain and release a mounted one of the removable media clamps without manual intervention.
摘要:
In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target a radiation beam onto a surface; and a reflected radiation collecting assembly that collects radiation reflected from the surface, wherein the reflected radiation collecting assembly comprises a mirror to collect radiation reflected from the surface.
摘要:
In one embodiment, a system to measure defects on a surface of a wafer and an edge of the wafer using a single tool comprises a radial motor to move an optical head in a radial direction to detect defects at locations displaced from the edge of the wafer, and a rotational motor to rotate the optical head around the edge of the wafer to detect defects on the edge of the wafer.
摘要:
In one embodiment, a system to inspect the edge of a wafer, comprises an surface analyzer assembly, a first drive assembly to impart linear motion between the surface analyzer and a first surface of the wafer, and a second drive assembly to impart rotary motion between the surface analyzer and the wafer about an axis parallel to the first surface of the wafer.
摘要:
A system and method for performing a magnetic imaging, optical profiling, and measuring lubricant thickness and degradation, carbon wear, carbon thickness, and surface roughness of thin film magnetic disks and silicon wafers at angles that are not substantially Brewster's angle of the thin film (carbon) protective overcoat is provided. The system and method involve a focused optical light whose polarization can be switched between P or S polarization is incident at an angle to the surface of the thin film magnetic disk. This generates both reflected and scattered light that may be measured to determine various values and properties related to the surface of the disk, including identifying the Kerr-effect in reflected light for determination of point magnetic properties. In addition, the present invention can mark the position of an identified defect.
摘要:
An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a first and second waveplate, a polarizing beam splitter, a first detector, a focusing lens, a blocker, and a second detector. The radiating source irradiates the first waveplate generating circularly polarized source beam that irradiates a first position of on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. Reflected radiation from a sample is directed to the second waveplate generating linearly polarized beam that irradiates the polarizing beam splitter which directs a portion of the reflected radiation to the first detector. Scattered radiation from the sample is directed by the focusing lens to the second detector. Contemporaneous measurements by the first and second detectors are compared to differentiate.
摘要:
An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a blocker, a focusing lens, an aperture, and a detector. The radiating source irradiates a first position of on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a transparent sample. A portion of the source beam travels through the transparent sample to another surface. The blocker blocks scattered radiation originating at the other surface. Scattered radiation originating from the transparent sample is not redirected by the blocker and is focused by the focusing lens to a first focal plane. The focused scattered radiation passes through the aperture before irradiating the detector. The detector output an intensity measurement of the scattered radiation that irradiates the detector.
摘要:
In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target radiation onto an edge surface of a wafer, the radiation targeting assembly comprising a first expanded paraboloid or expanded ellipsoid reflector positioned adjacent the edge surface of the wafer, a reflected radiation collecting assembly that collects radiation reflected from the surface, a signal processing module to generate surface parameter data from the reflected radiation, and a defect detection module to analyze the surface parameter data to detect a defect on the surface.
摘要:
In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target a radiation beam onto a surface; and a reflected radiation collecting assembly that collects radiation reflected from the surface, wherein the reflected radiation collecting assembly comprises a mirror to collect radiation reflected from the surface.