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23 条记录 (耗时 0.028 秒)

    Transmissive liquid crystal cell with trench capacitor
    2.
    发明授权
    Transmissive liquid crystal cell with trench capacitor 失效
    带沟槽电容器的透射式液晶单元

    公开(公告)号：US6014189A

    公开(公告)日：2000-01-11

    申请号：US749746

    申请日：1996-11-15

    申请人： Russell Alan Budd ,  George Liang-Tai Chiu ,  Dale Jonathan Pearson

    发明人： Russell Alan Budd ,  George Liang-Tai Chiu ,  Dale Jonathan Pearson

    IPC分类号： G02F1/1362 ,  G02F1/1343

    CPC分类号： G02F1/136213 ,  G02F1/136286

    摘要： An apparatus and method for providing a display cell structure based on the transmissive liquid crystal technology with a useful aperture ratio even as the cell size shrinks to less than 20 microns. The invention overcomes a problem of the prior art wherein the fractional area transmitting the light of the conventional designs becomes unacceptably low due to the aperture reducing opaque storage capacitor. This reduction in aperture ratio is removed in this invention by hiding the trench capacitor below the row and column x,y lines. The cell storage capacitor is formed using a vertical trench capacitor in SOI. Although useful even in standard display sizes and configurations, the invention is particularly useful for head-mounted displays and/or optical projection displays at the UXGA form factor for both monochromatic and color displays. Alternate capacitor configurations are described.

    摘要翻译： 一种用于提供基于透射型液晶技术的显示单元结构的装置和方法，其具有有用孔径比，即使单元尺寸缩小到小于20微米。 本发明克服了现有技术的问题，其中透射传统设计的光的分数区域由于减小不透明存储电容器的孔径而变得不可接受地低。 在本发明中通过将沟槽电容器隐藏在行和列x，y线下方来消除开口率的减小。 在SOI中使用垂直沟槽电容器形成电池存储电容器。 尽管在标准显示器尺寸和配置中也是有用的，但本发明对于单色和彩色显示器的UXGA外形尺寸下的头戴式显示器和/或光学投影显示器特别有用。 描述备用电容器配置。

    Highly efficient OLED device
    3.
    发明授权
    Highly efficient OLED device 有权
    高效OLED器件

    公开(公告)号：US06603149B2

    公开(公告)日：2003-08-05

    申请号：US09881376

    申请日：2001-06-14

    申请人： Russell Alan Budd ,  George Liang-Tai Chiu ,  Richard Alan Haight

    发明人： Russell Alan Budd ,  George Liang-Tai Chiu ,  Richard Alan Haight

    IPC分类号： H01L3300

    CPC分类号： H01L51/5262

    摘要： An OLED device which is capable of utilizing light transmitted from the sides of the OLED as well as the surface of the OLED is provided. The OLED device comprises an OLED having a substrate surface and sides for emission of photons therethrough and at least one adjacent light-folding means, wherein said light-folding means collects and redirects photons emitted from the sides of the OLED into coincident paths of light which are substantially parallel to said photons emitted from said substrate surface.

    摘要翻译： 提供了能够利用从OLED的侧面传输的光以及OLED的表面的OLED器件。 OLED器件包括具有衬底表面和用于发射光子的侧面的OLED以及至少一个相邻的光折叠装置，其中所述光折叠装置收集并重定向从OLED的侧面发射的光子到重合的光路， 基本上平行于从所述衬底表面发射的所述光子。

    Transmissive cell for ultra small pixel applications
    4.
    发明授权
    Transmissive cell for ultra small pixel applications 失效
    用于超小像素应用的透射单元

    公开(公告)号：US5999234A

    公开(公告)日：1999-12-07

    申请号：US834183

    申请日：1997-04-15

    申请人： Russell Alan Budd ,  George Liang-Tai Chiu ,  Dale Jonathan Pearson

    发明人： Russell Alan Budd ,  George Liang-Tai Chiu ,  Dale Jonathan Pearson

    IPC分类号： G02F1/1334 ,  G02F1/1343 ,  G02F1/1362

    CPC分类号： G02F1/134363 ,  G02F1/1334 ,  G02F1/136213 ,  G02F2001/13347

    摘要： A method and structure is presented for a display with reduced size pixels while retaining the transmissive approach. This enables continued use the least expensive transmission optics available. In an embodiment, it employs back-end-of-the-line vertical cells built on top of the row and column x, y lines of the pixels. In a PDLC type display embodiment each vertical cell is filled with PDLC which operates in a normally black mode known as the PDLC reverse mode. When the pixel control voltage is set ON, the liquid crystal is perpendicular to the light path resulting in a light pass through providing a bright state. When the control voltage is set OFF, the liquid crystals are randomly oriented, only the scattered light goes through the cell, so the pixel is in its OFF state. PDLC used here has two advantages. Firstly, the PDLC requires no rubbing. It is difficult to rub individual cell walls. Secondly, the use of both polarizations by the PDLC increases its luminous efficiency. Various embodiments are described for implementing vertical active electrodes and common ground electrodes. Advantages are described for employing the vertical electrodes with various implementations of a hidden storage capacitor.

    摘要翻译： 为保持透射方式的像素尺寸减小的显示器提供了一种方法和结构。 这使得可以继续使用可用的最便宜的传输光学器件。 在一个实施例中，它使用构建在像素的行和列x，y行的顶部上的后端行垂直单元。 在PDLC型显示实施例中，每个垂直单元填充有PDLC，PDLC以常规黑模式工作，称为PDLC反向模式。 当像素控制电压设置为ON时，液晶垂直于光路，导致光通过，提供亮状态。 当控制电压设定为OFF时，液晶随机取向，只有散射光通过电池，因此像素处于关闭状态。 这里使用的PDLC有两个优点。 首先，PDLC不需要摩擦。 难以擦拭单个细胞壁。 其次，通过PDLC的两极化的使用增加了发光效率。 描述了用于实现垂直有源电极和公共接地电极的各种实施例。 描述了采用具有隐藏存储电容器的各种实施方式的垂直电极的优点。

    System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face
    6.
    发明授权
    System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face 有权
    在半导体或电介质晶片上制造的封装的系统，其一面上具有布线，延伸穿过晶片的通孔以及相对面上的外部连接

    公开(公告)号：US06593644B2

    公开(公告)日：2003-07-15

    申请号：US09838725

    申请日：2001-04-19

    申请人： George Liang-Tai Chiu ,  John Harold Magerlein

    发明人： George Liang-Tai Chiu ,  John Harold Magerlein

    IPC分类号： H01L23492

    CPC分类号： H01L23/49827 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A semiconductor or dielectric wafer with conducting vias is used as a substrate in an integrated circuit packaging structure, where high density inter and intra chip contacts and wiring are positioned on the substrate face on which the integrated circuitry is mounted, and external signal and power circuitry is contacted through the opposite face. Use of a substrate such as silicon permits the use of conventional silicon processes available in the art for providing high wiring density together with matching of the thermal expansion coefficient of any silicon chips in the integrated circuits. The use of vias through the substrate allows a high density of connections leaving the silicon substrate and provides short paths for the connections of power and signals.

    摘要翻译： 具有导电通孔的半导体或介电晶片用作集成电路封装结构中的基板，其中高密度片间和芯片间接触和布线位于其上安装集成电路的基板面上，以及外部信号和电源电路 通过相对面接触。 使用诸如硅的衬底允许使用本领域可获得的常规硅工艺来提供高布线密度以及集成电路中任何硅芯片的热膨胀系数的匹配。 使用通过基板的通孔允许离开硅衬底的高密度连接并且为功率和信号的连接提供短路径。

    Multipath Soldered Thermal Interface Between a Chip and its Heat Sink
    7.
    发明申请
    Multipath Soldered Thermal Interface Between a Chip and its Heat Sink 审中-公开
    芯片与散热片之间的多路焊接热接口

    公开(公告)号：US20080274349A1

    公开(公告)日：2008-11-06

    申请号：US12172778

    申请日：2008-07-14

    申请人： George Liang-Tai Chiu ,  Sung-Kwon Kang

    发明人： George Liang-Tai Chiu ,  Sung-Kwon Kang

    IPC分类号： B32B5/16 ,  B23K1/20 ,  H05K7/20

    CPC分类号： H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29347 ,  H01L2224/294 ,  H01L2224/32245 ,  H01L2224/8385 ,  H01L2924/14 ,  Y10T428/254 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

    摘要： The invention comprises a process for joining a first surface and a second surface where the first surface comprises an initially non-solderable surface which comprises coating the first surface with a solder-adhesion layer to produce a solder-adhesion layer on the first surface and providing a Thermal Interface Material (“TIM”) composition comprising solderable heat-conducting particles in a bondable resin matrix where at least some of the solderable heat-conducting particles comprise a solder surface. The TIM composition is placed between the first surface and the second surface to extend between and be contiguous with both the second surface and the solder-adhesion layer on the first surface. Sufficiently heating the TIM composition results in (a) soldering at least some of the solderable heat-conducting particles to one another; and (b) soldering at least some of the solderable heat-conducting particles to the solder-adhesion layer on the first surface. When the second surface comprises a solderable surface, the particles will also bond to it. When the second surface is not solderable, a solder adhesion layer can be placed on it. The process also includes adhesively bonding the resin matrix to the first surface and the second surface. The first surface can comprise an electronic device such as a semiconductor device and the second surface can comprise a heat sink, such as a solderable heat sink. The invention also comprises a process for improving the heat conductivity of a TIM, an article of manufacture made by the process, and a composition of matter comprising the TIM.

    摘要翻译： 本发明包括用于接合第一表面和第二表面的方法，其中第一表面包括最初不可焊接的表面，其包括用焊料粘附层涂覆第一表面以在第一表面上产生焊料粘附层，并提供 一种热粘合材料（“TIM”）组合物，其包含可粘合的树脂基体中的可焊接导热颗粒，其中至少一些可焊接导热颗粒包含焊料表面。 TIM组合物被放置在第一表面和第二表面之间，以在第一表面上与第二表面和焊料粘附层两者之间延伸并与之邻接。 足够加热TIM组合物导致（a）将至少一些可焊接导热颗粒彼此焊接; 和（b）将至少一些可焊接导热颗粒焊接到第一表面上的焊料粘附层。 当第二表面包括可焊接表面时，颗粒也将结合到其上。 当第二表面不可焊接时，可以在其上放置焊料粘附层。 该方法还包括将树脂基体粘合到第一表面和第二表面上。 第一表面可以包括诸如半导体器件的电子器件，并且第二表面可以包括诸如可焊接散热器的散热器。 本发明还包括用于改善TIM的导热性，由该方法制造的制品以及包含该TIM的物质组成的方法。

    Multipath soldered thermal interface between a chip and its heat sink
    9.
    发明授权
    Multipath soldered thermal interface between a chip and its heat sink 有权
    多路径焊接芯片与散热片之间的热界面

    公开(公告)号：US08679899B2

    公开(公告)日：2014-03-25

    申请号：US13226681

    申请日：2011-09-07

    申请人： George Liang-Tai Chiu ,  Sung-Kwon Kang

    发明人： George Liang-Tai Chiu ,  Sung-Kwon Kang

    IPC分类号： H01L21/44

    CPC分类号： H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29347 ,  H01L2224/294 ,  H01L2224/32245 ,  H01L2224/8385 ,  H01L2924/14 ,  Y10T428/254 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

    摘要： A Thermal Interface Material (“TIM”) composition of matter with improved heat conductivity comprises solderable heat-conducting particles in a bondable resin matrix and at least some of the solderable heat-conducting particles comprise a solder surface. Positioning the TIM between a first surface having a solder adhesion layer and a second surface, and then heating it results in soldering some of the solderable heat-conducting particles to one another; and some to the solder-adhesion layer on the first surface as well as adhesively bonding the resin matrix to the first surface and the second surface. The first surface can comprise an electronic device, e.g., a semiconductor device and the second surface a heat sink, such as a solderable heat sink. A product comprises an article of manufacture made by the process.

    摘要翻译： 具有改善的导热性的物质的热界面材料（“TIM”）组合物包括可粘合树脂基质中的可焊接导热颗粒，并且至少一些可焊接导热颗粒包含焊料表面。 将TIM定位在具有焊料粘附层的第一表面和第二表面之间，然后加热导致将一些可焊接的导热颗粒彼此焊接; 还有一些与第一表面上的焊料粘合层，以及将树脂基体粘合到第一表面和第二表面上。 第一表面可以包括电子器件，例如半导体器件，第二表面可以包括诸如可焊接散热器的散热器。 产品包括通过该方法制造的制品。

    Method and apparatus for integrating microlens array into a liquid crystal display device using a sacrificial substrate
    10.
    发明授权
    Method and apparatus for integrating microlens array into a liquid crystal display device using a sacrificial substrate 失效
    使用牺牲基板将微透镜阵列集成到液晶显示装置中的方法和装置

    公开(公告)号：US5929962A

    公开(公告)日：1999-07-27

    申请号：US17867

    申请日：1998-02-03

    申请人： George Liang-Tai Chiu ,  Fuad Elias Doany ,  Rama Nand Singh

    发明人： George Liang-Tai Chiu ,  Fuad Elias Doany ,  Rama Nand Singh

    IPC分类号： G02F1/1335 ,  G02F1/13 ,  G02F1/1333

    CPC分类号： G02F1/133526

    摘要： A method and apparatus is presented for transmissive liquid crystal display devices with increased apparent aperture ratios. The aperture ratio is increased by focusing light into the transparent area using a microlens array on a per pixel basis. The method includes the steps of forming a top substrate having a sacrificial substrate adhered to a first transmissive substrate, a transmissive electrode layer adhered to the first transmissive substrate in which a plurality of color filters are disposed, the top substrate further having a rubbing layer formed proximate to the transmissive electrode layer. Forming a bottom substrate comprising a second transmissive substrate and a thin film transistor array disposed within the second transmissive substrate. Disposing a sealing material on one of the top or bottom substrates so as to form an outline of display. Aligning and assembling the top and bottom substrates together such that the sealing material is sandwiched between the top and bottom substrates which are maintained at a constant separation of a few microns uniformly across the display with the help of spacer balls or posts and the rubbing layer is proximate to the thin film transistor array. Releasing the sacrificial substrate from the first transmissive substrate and adhering a microlens array to the first transmissive substrate. Lastly, filling the outline of sealing material with liquid crystal material and sealing the liquid crystal material. Also provided is an apparatus for carrying out the method of the present invention.

    摘要翻译： 本发明提供了一种具有增加的视在孔径比的透射型液晶显示装置的方法和装置。 通过在每像素的基础上使用微透镜阵列将光聚焦到透明区域来增加孔径比。 该方法包括以下步骤：形成具有粘附到第一透射基板的牺牲基板的顶部基板，附着到其上设置有多个滤色器的第一透射基板的透射电极层，顶部基板还具有形成的摩擦层 靠近透射电极层。 形成底部衬底，其包括第二透射衬底和设置在第二透射衬底内的薄膜晶体管阵列。 在一个顶部或底部基板上设置密封材料，以形成显示器的轮廓。 将顶部和底部基底对准和组装在一起，使得密封材料夹在顶部和底部基底之间，借助于间隔球或支柱将它们保持在跨越显示器的几微米的恒定分离，并且摩擦层是 靠近薄膜晶体管阵列。 从第一透射衬底上释放牺牲衬底并将微透镜阵列粘附到第一透射衬底上。 最后，用液晶材料填充密封材料的轮廓并密封液晶材料。 还提供了一种用于实施本发明的方法的装置。