Method and apparatus for thermal management of integrated circuits
    1.
    发明授权
    Method and apparatus for thermal management of integrated circuits 失效
    集成电路热管理方法和装置

    公开(公告)号:US06893902B2

    公开(公告)日:2005-05-17

    申请号:US10122613

    申请日:2002-04-11

    摘要: Method and apparatus for thermal management of an integrated circuit. A semiconductor device includes an integrated circuit and an integrated thermoelectric cooler formed on a common substrate. A semiconductor device is fabricated by forming an integrated circuit on a front side of the substrate and forming an integrated thermoelectric cooler on a back side of the substrate. A first thermal sink of semiconductor material capable of absorbing heat from the integrated circuit is formed on the back side of the substrate. N-type thermoelectric elements are formed on contacts formed on the first thermal sink. P-type thermoelectric elements are formed on contacts formed on a second thermal sink of semiconductor material capable of dissipating heat. The p-type and n-type thermoelectric elements are bonded to the contacts on the first and second thermal sinks, respectively, by a flip-chip soldering process. Using this method, semiconductor devices including an integrated circuit and integrated modules of thermoelectric elements are formed having cooling capacities corresponding to heat dissipated from different portions of the integrated circuit. As a result, substantially uniform temperature distribution across the integrated circuit can be achieved.

    摘要翻译: 集成电路的热管理方法和装置。 半导体器件包括形成在公共衬底上的集成电路和集成热电冷却器。 通过在基板的前侧形成集成电路并在基板的背面形成集成的热电冷却器来制造半导体器件。 在基板的背面形成能够从集成电路吸收热量的半导体材料的第一散热器。 N型热电元件形成在形成在第一散热器上的触点上。 P型热电元件形成在能够散热的半导体材料的第二散热器上形成的触点上。 分别通过倒装焊接工艺将p型和n型热电元件分别结合到第一和第二散热器上的触点。 使用该方法,形成包括集成电路的半导体器件和热电元件的集成模块,其具有对应于从集成电路的不同部分散热的散热能力。 结果,可以实现整个集成电路的基本均匀的温度分布。

    X-ray mask pellicles and their attachment in semiconductor manufacturing
    2.
    发明授权
    X-ray mask pellicles and their attachment in semiconductor manufacturing 失效
    X射线掩模防护薄膜及其在半导体制造中的应用

    公开(公告)号:US06192100B1

    公开(公告)日:2001-02-20

    申请号:US09335980

    申请日:1999-06-18

    IPC分类号: G21K500

    摘要: In the invention a pellicle mounting structural principle is provided whereby a membrane for protection of an X-ray mask is interchangeably positioned with proper spacing between the X-ray mask and the resist on the wafer in which the pattern produced by the X-ray exposure is to be formed. The mounting principle employs a combined assembly of, a membrane and spacer member subassembly together with a means for seectably separable retention to the supporting structural portion of the mask The principle accommodates membrane materials that may not be flexible and provides an ability to remove the membrane for cleaning or replacement and to removal and reassembly with ease in reestablishing the spacing with respect to the mask. The means for the selectably separable retention to the supporting structural portion of the mask involves the use of springs and elastomers, securing to the sides of the supporting structural mask ring and the bonding of the spacer member directly to the mask.

    摘要翻译: 在本发明中,提供了一种防护薄膜安装结构原理,其中用于保护X射线掩模的膜可互换地定位,其中X射线掩模和晶片上的抗蚀剂之间具有适当的间距,其中X射线曝光产生的图案 将要形成。 安装原理采用膜和间隔件子组件的组合组合以及用于可屏蔽地分离地保持到掩模的支撑结构部分的装置。该原理适应可能不柔性的膜材料并且提供去除膜的能力 清洁或更换,并轻松拆卸和重新组装,以重新建立相对于面罩的间距。 用于可选地可分离地保留到掩模的支撑结构部分的装置涉及使用弹簧和弹性体,固定到支撑结构掩模环的侧面并且将间隔构件直接结合到掩模。

    Color calibration of displays
    3.
    发明授权
    Color calibration of displays 有权
    显示器的颜色校准

    公开(公告)号:US06690383B1

    公开(公告)日:2004-02-10

    申请号:US09490545

    申请日:2000-01-24

    IPC分类号: G09G502

    摘要: The present invention provides methods and apparatus for the color calibration of displays. These methods are particularly useful for displays having properties different than those associated with cathode ray tubes (CRT). Some displays, for example liquid crystal displays (LCD), have a high luminance black, the chromas of their primaries are not independent of their luminance levels, the intensities of their primaries are not strictly monotonically increasing with respect to their RGB levels, the color additivity of their subpixels is affected by crosstalk or leakage and their color measurements are dependent on the view angle of the observer. Therefore, the usage of CRT methods is deficient for such displays. The methods and apparatus of the present invention overcome several deficiencies generally found in non-CRT display devices by employing techniques associated with the use of restricted ranges for the primaries, subtracting the color black from all color measurements, forming a modified display matrix and/or creating tables which correct errors due to the non-linearities or color leakages of these display devices. These enable images to be processed using algorithms of different complexity and precision.

    摘要翻译: 本发明提供了用于显示器的颜色校准的方法和装置。 这些方法对于具有与阴极射线管(CRT)相关的特性不同的性质的显示器特别有用。 一些显示器(例如液晶显示器(LCD))具有高亮度黑色,它们的原色的色度不依赖于它们的亮度级别,其基色的强度相对于它们的RGB等级不是严格单调增加,颜色 它们的子像素的加和性受串扰或泄漏的影响,并且它们的颜色测量取决于观察者的视角。 因此,CRT方法的使用对于这种显示器是不足的。 本发明的方法和装置克服了在非CRT显示装置中通常使用与使用限制范围的原色有关的技术的几个缺陷,从所有颜色测量中减去颜色黑色,形成修改后的显示矩阵和/或 创建由于这些显示设备的非线性或颜色泄漏而校正错误的表。 这些使得能够使用不同复杂度和精度的算法来处理图像。

    Laptop portable computer desk
    4.
    发明授权
    Laptop portable computer desk 失效
    笔记本便携式电脑桌

    公开(公告)号:US06496360B1

    公开(公告)日:2002-12-17

    申请号:US08877013

    申请日:1997-06-16

    IPC分类号: G06F116

    CPC分类号: A47B23/002

    摘要: A portable computer laptop desk is provided when attached to a structure that in turn is supported on web strapping that passes over the upper legs of the operator when in the seated position. The strapping is attached to foldable and telescopable side and center supports for the structure that slide into and fold over the structure forming a package comparable in size to the portable computer.

    摘要翻译: 当附接到结构上时,提供便携式计算机笔记本电脑桌面,该结构又在位于就座位置时经过操作者的上腿的卷筒纸捆扎上被支撑。 捆扎带连接到可折叠和可伸缩的侧面和中心支撑,用于结构滑动并折叠结构,形成与便携式计算机尺寸相当的包装。

    Focused particle beam processing for use in electronic apparatus manufacturing
    5.
    发明授权
    Focused particle beam processing for use in electronic apparatus manufacturing 失效
    用于电子设备制造的聚焦粒子束处理

    公开(公告)号:US06180296B2

    公开(公告)日:2001-01-30

    申请号:US09429060

    申请日:1999-10-29

    IPC分类号: G03F900

    摘要: A lithographically patterned three dimensional stencil type mask is formed on a substrate over a specific area that is to undergo processing. The three dimensional mask functionally provides an energy beam stencil at a precise height over the specific area. The stencil has surface properties that provide a resist function for any scattering of a focused particle beam that passes through an aperture or opening in the center of the stencil, and is formed using standard in the art additive and subtractive processes so that it can be removed after the particle beam processing. It has a particular advantage in an application where it is desired to have sub regions in a pixel area in a liquid crystal display that can provide different domains which operate to provide different pretilt states to the liquid crystal which in turn widens the viewing range of the display.

    摘要翻译: 在经过处理的特定区域上的基板上形成光刻图案的三维模板型掩模。 三维掩模功能地在特定区域上的精确高度提供能量束模板。 模板具有表面性质,其为穿过模板中心的孔或开口的聚焦粒子束的任何散射提供抗蚀剂功能,并且使用本领域的添加剂和减色过程中的标准形成,使得其可以被去除 粒子束处理后。 在其中期望在液晶显示器中的像素区域中具有亚区域的应用中具有特别的优点,该液晶显示器可以提供不同的域,这些区域的操作以向液晶提供不同的预倾斜状态,这进一步扩大了液晶显示器的观看范围 显示。

    Method and apparatus for thermal management of integrated circuits

    公开(公告)号:US06614109B2

    公开(公告)日:2003-09-02

    申请号:US09498826

    申请日:2000-02-04

    IPC分类号: H01L2334

    摘要: Method and apparatus for thermal management of an integrated circuit. A semiconductor device includes an integrated circuit and an integrated thermoelectric cooler formed on a common substrate. A semiconductor device is fabricated by forming an integrated circuit on a front side of the substrate and forming an integrated thermoelectric cooler on a back side of the substrate. A first thermal sink of semiconductor material capable of absorbing heat from the integrated circuit is formed on the back side of the substrate. N-type thermoelectric elements are formed on contacts formed on the first thermal sink. P-type thermoelectric elements are formed on contacts formed on a second thermal sink of semiconductor material capable of dissipating heat. The p-type and n-type thermoelectric elements are bonded to the contacts on the first and second thermal sinks, respectively, by a flip-chip soldering process. Using this method, semiconductor devices including an integrated circuit and integrated modules of thermoelectric elements are formed having cooling capacities corresponding to heat dissipated from different portions of the integrated circuit. As a result, substantially uniform temperature distribution across the integrated circuit can be achieved.