摘要:
A centralized power supply system for a multi-system on chip device includes: an external power supply for supplying power to the device; a centralized DC generator macro having generator components for receiving the external power supplied and generating therefrom one or more power supply voltages for use by surrounding system macros provided on the multi-system chip, the centralized DC generator macro further distributing the generated power supply voltages to respective system macros. A noise blocking structure is provided that surrounds the centralized DC generator system and isolates the centralized DC generator system from the surrounding system macros.
摘要:
A low-voltage, low-power DC voltage generator system is provided having two negative voltage pump circuits for generating voltages for operating negative wordline and substrate bias charge pump circuits, a reference generator for generating a reference voltage, and a two-stage cascaded positive pump system having a first stage pump circuit and a second stage pump circuit. The first stage converts a supply voltage to a higher voltage level, e.g., one volt to 1.5 volts, to be used for I/O drivers, and the second stage converts the output voltage from the first stage to a higher voltage level, e.g., from 1.5 volts to about 2.5 volts, for operating a boost wordline charge pump circuit. The DC voltage generator system further includes a micro pump circuit for providing a voltage level which is greater than one-volt to be used as reference voltages, even when an operating voltage of the DC voltage generator system is at or near one-volt. A one-volt negative voltage pump circuit is also included for pumping the voltages of at least one corresponding charge pump circuit, even when an operating voltage of the DC generator system is at or near one-volt. The DC voltage generator system is specifically designed to be implemented within battery-operated devices having at least one memory unit. The low-power consumption feature of the DC voltage generator system extends battery lifetime and data retention time of the cells of the at least one memory unit.
摘要:
A combined low-voltage, low-power band-gap reference and temperature sensor circuit is provided for providing a band-gap reference parameter and for sensing the temperature of a chip, such as an eDRAM memory unit or CPU chip, using the band-gap reference parameter. The combined sensor circuit is insensitive to supply voltage and a variation in the chip temperature. The power consumption of both circuits, i.e., the band-gap reference and the temperature sensor circuits, encompassing the combined sensor circuit is less than one &mgr;W. The combined sensor circuit can be used to monitor local or global chip temperature. The result can be used to (1) regulate DRAM array refresh cycle time, e.g., the higher the temperature, the shorter the refresh cycle time, (2) to activate an on-chip or off-chip cooling or heating device to regulate the chip temperature, (3) to adjust internally generated voltage level, and (4) to adjust the CPU (or microprocessor) clock rate, i.e., frequency, so that the chip will not overheat. The combined band-gap reference and temperature sensor circuit of the present invention can be implemented within battery-operated devices having at least one memory unit. The low-power circuits of the sensor circuit extend battery lifetime and data retention time of the cells of the at least one memory unit.
摘要:
A low-voltage, low-power DC voltage generator system is provided having two negative voltage pump circuits for generating voltages for operating negative wordline and substrate bias charge pump circuits, a reference generator for generating a reference voltage, and a two-stage cascaded positive pump system having a first stage pump circuit and a second stage pump circuit. The first stage converts a supply voltage to a higher voltage level, e.g., one volt to 1.5 volts, to be used for I/O drivers, and the second stage converts the output voltage from the first stage to a higher voltage level, e.g., from 1.5 volts to about 2.5 volts, for operating a boost wordline charge pump circuit. The DC voltage generator system further includes a micro pump circuit for providing a voltage level which is greater than one-volt to be used as reference voltages, even when an operating voltage of the DC voltage generator system is at or near one-volt. A one-volt negative voltage pump circuit is also included for pumping the voltages of at least one corresponding charge pump circuit, even when an operating voltage of the DC generator system is at or near one-volt. The DC voltage generator system is specifically designed to be implemented within battery-operated devices having at least one memory unit. The low-power consumption feature of the DC voltage generator system extends battery lifetime and data retention time of the cells of the at least one memory unit.
摘要:
A combined low-voltage, low-power band-gap reference and temperature sensor circuit is provided for providing a band-gap reference parameter and for sensing the temperature of a chip, such as an eDRAM memory unit or CPU chip, using the band-gap reference parameter. The combined sensor circuit is insensitive to supply voltage and a variation in the chip temperature. The power consumption of both circuits, i.e., the band-gap reference and the temperature sensor circuits, encompassing the combined sensor circuit is less than one μW. The combined sensor circuit can be used to monitor local or global chip temperature. The result can be used to (1) regulate DRAM array refresh cycle time, e.g., the higher the temperature, the shorter the refresh cycle time, (2) to activate an on-chip or off-chip cooling or heating device to regulate the chip temperature, (3) to adjust internally generated voltage level, and (4) to adjust the CPU (or microprocessor) clock rate, i.e., frequency, so that the chip will not overheat. The combined band-gap reference and temperature sensor circuit of the present invention can be implemented within battery-operated devices having at least one memory unit. The low-power circuits of the sensor circuit extend battery lifetime and data retention time of the cells of the at least one memory unit.
摘要:
Thermal cooling structures of diamond or diamond-like materials are provided for conducting heat away from semiconductor devices. A first silicon-on-insulator embodiment comprises a plurality of thermal paths, formed after shallow trench and device fabrication steps are completed, which extend through the buried oxide and provide heat dissipation through to the underlying bulk silicon substrate. The thermal conduction path material is preferably diamond which has high thermal conductivity with low electrical conductivity. A second diamond trench cooling structure, formed after device fabrication has been completed, comprises diamond shallow trenches disposed between the devices and extending through the buried oxide layer. An alternative diamond thermal cooling structure includes a diamond insulation layer deposited over the semiconductor devices in either an SOI or bulk silicon structure. Yet another embodiment comprises diamond sidewalls formed along the device walls in thermal contact with the device junctions to provide heat dissipation through the device junctions to underlying cooling structures. It is also proposed that the foregoing structures, and combinations of the foregoing structures, could be used in conjunction with other known cooling schemes.
摘要:
A memory system having a plurality of T-RAM cells arranged in an array is presented where each T-RAM cell has dual vertical devices and is fabricated over a SiC substrate. Each T-RAM cell has a vertical thyristor and a vertical transfer gate. The top surface of each thyristor is coplanar with the top surface of each transfer gate within the T-RAM array to provide a planar cell structure for the T-RAM array. A method is also presented for fabricating the T-RAM array having the vertical thyristors, the vertical transfer gates and the planar cell structure over the SiC substrate.
摘要:
Described is a method for making silicon on sapphire structures, and devices therefrom. The inventive method of forming integrated circuits on a sapphire substrate comprises the steps of providing a device layer on an oxide layer of a temporary substrate; bonding the device layer to a handling substrate; removing the temporary substrate to provide a structure containing the device layer between the oxide layer and the handling substrate; bonding a sapphire substrate to the oxide layer; removing the handling substrate from the structure; and annealing the final structure to provide a substrate comprising the oxide layer between the device layer and the sapphire substrate. The sapphire substrate may comprise bulk sapphire or may be a conventional substrate material with an uppermost sapphire layer.
摘要:
Apparatus and method for providing high dielectric constant decoupling capacitors for semiconductor structures. The high dielectric constant decoupling capacitor can be fabricated by depositing high dielectric constant material between adjacent conductors on the same level, between conductors in successive levels, or both, to thereby provide very large capacitance value without any area or reliability penalty.
摘要:
A method and apparatus for refreshing data in a dynamic random access memory (DRAM) cache memory in a computer system are provided to perform a data refresh operation without refresh penalty (e.g., delay in a processor). A data refresh operation is performed with respect to a DRAM cache memory by detecting a request address from a processor, stopping a normal refresh operation when the request address is detected, comparing the request address with TAG addresses stored in a TAG memory, generating refresh addresses to refresh data stored in the cache memory, each of which is generated based on an age of data corresponding to the refresh address, and performing a read/write operation on a wordline accessed by the request addresses and refreshing data on wordlines accessed by the refresh addresses, wherein the read/write operation and the refreshing of data are performed simultaneously.