公开(公告)号：USD606083S1

公开(公告)日：2009-12-15

申请号：US29328903

申请日：2008-12-03

申请人： Ryan Parker ,  Bryan T. Agnetta ,  Liang Chen ,  Xiaochun Tan

设计人： Ryan Parker ,  Bryan T. Agnetta ,  Liang Chen ,  Xiaochun Tan

公开(公告)号：USD606082S1

公开(公告)日：2009-12-15

申请号：US29328902

申请日：2008-12-03

申请人： Ryan Parker ,  Bryan T. Agnetta ,  Liang Chen ,  Xiaochun Tan

设计人： Ryan Parker ,  Bryan T. Agnetta ,  Liang Chen ,  Xiaochun Tan

公开(公告)号：USD606081S1

公开(公告)日：2009-12-15

申请号：US29328901

申请日：2008-12-03

申请人： Ryan Parker ,  Bryan T. Agnetta ,  Liang Chen ,  Xiaochun Tan

设计人： Ryan Parker ,  Bryan T. Agnetta ,  Liang Chen ,  Xiaochun Tan

公开(公告)号：US08008128B2

公开(公告)日：2011-08-30

申请号：US12728914

申请日：2010-03-22

申请人： Xiaochun Tan ,  Zhining Li ,  Xaiolan Jiang

发明人： Xiaochun Tan ,  Zhining Li ,  Xaiolan Jiang

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L29/0657 ,  H01L2221/68359 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/10158 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present invention include a method of packaging semiconductor devices. The method comprises the steps of molding a surface of a wafer, sawing the wafer into individual devices, attaching the individual semiconductor device to an adhesive surface, molding the exposed surface, and sawing the wafer into individual semiconductor devices. The step of molding forms a continuous molded layer. The step of sawing results in each individual semiconductor having a molded layer. This molded layer corresponds to a portion of the continuous molded layer. The step of attaching includes attaching the molded layer of the individual semiconductor devices to the adhesive surface. The step of molding the exposed area includes molding an exposed area above the adhesive surface. This forms a solid expanse of material. The step of sawing the wafer into individual semiconductor devices includes sawing the solid expanse of material.

摘要翻译： 本发明的实施例包括一种封装半导体器件的方法。 该方法包括以下步骤：将晶片的表面成型，将晶片锯成单独的装置，将各个半导体器件连接到粘合剂表面，模制暴露的表面，以及将晶片锯成单独的半导体器件。 模制步骤形成连续模塑层。 锯切的步骤导致具有模制层的每个单独的半导体。 该成型层对应于连续成型层的一部分。 附着步骤包括将各个半导体器件的模制层附着到粘合剂表面。 模制暴露区域的步骤包括模制粘合剂表面上方的暴露区域。 这形成了一个坚实的材料。 将晶片锯切成单个半导体器件的步骤包括锯切固体材料。

公开(公告)号：US20110281398A1

公开(公告)日：2011-11-17

申请号：US13188367

申请日：2011-07-21

申请人： Xiaochun Tan ,  Zhining Li ,  Xiaolan Jiang

发明人： Xiaochun Tan ,  Zhining Li ,  Xiaolan Jiang

IPC分类号： H01L21/56 ,  H01L21/782 ,  H01L21/60

CPC分类号： H01L21/6835 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L29/0657 ,  H01L2221/68359 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/10158 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present invention include a method of packaging semiconductor devices. The method comprises the steps of molding a surface of a wafer, sawing the wafer into individual devices, attaching the individual semiconductor device to an adhesive surface, molding the exposed surface, and sawing the wafer into individual semiconductor devices. The step of molding forms a continuous molded layer. The step of sawing results in each individual semiconductor having a molded layer. This molded layer corresponds to a portion of the continuous molded layer. The step of attaching includes attaching the molded layer of the individual semiconductor devices to the adhesive surface. The step of molding the exposed area includes molding an exposed area above the adhesive surface. This forms a solid expanse of material. The step of sawing the wafer into individual semiconductor devices includes sawing the solid expanse of material.

摘要翻译： 本发明的实施例包括一种封装半导体器件的方法。 该方法包括以下步骤：将晶片的表面成型，将晶片锯成单独的装置，将各个半导体器件连接到粘合剂表面，模制暴露的表面，以及将晶片锯成单独的半导体器件。 模制步骤形成连续模塑层。 锯切的步骤导致具有模制层的每个单独的半导体。 该成型层对应于连续成型层的一部分。 附着步骤包括将各个半导体器件的模制层附着到粘合剂表面。 模制暴露区域的步骤包括模制粘合剂表面上方的暴露区域。 这形成了一个坚实的材料。 将晶片锯切成单个半导体器件的步骤包括锯切固体材料。

公开(公告)号：US20090233401A1

公开(公告)日：2009-09-17

申请号：US12109635

申请日：2008-04-25

申请人： Xiaochun Tan ,  Zhining Li ,  Xiaolan Jiang

发明人： Xiaochun Tan ,  Zhining Li ,  Xiaolan Jiang

IPC分类号： H01L21/56

CPC分类号： H01L21/6835 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L29/0657 ,  H01L2221/68359 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/10158 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present invention include a method of packaging semiconductor devices. The method comprises the steps of molding a surface of a wafer, sawing the wafer into individual devices, attaching the individual semiconductor device to an adhesive surface, molding the exposed surface, and sawing the wafer into individual semiconductor devices. The step of molding forms a continuous molded layer. The step of sawing results in each individual semiconductor having a molded layer. This molded layer corresponds to a portion of the continuous molded layer. The step of attaching includes attaching the molded layer of the individual semiconductor devices to the adhesive surface. The step of molding the exposed area includes molding an exposed area above the adhesive surface. This forms a solid expanse of material. The step of sawing the wafer into individual semiconductor devices includes sawing the solid expanse of material.

摘要翻译： 本发明的实施例包括一种封装半导体器件的方法。 该方法包括以下步骤：将晶片的表面成型，将晶片锯成单独的装置，将各个半导体器件连接到粘合剂表面，模制暴露的表面，以及将晶片锯成单独的半导体器件。 模制步骤形成连续模塑层。 锯切的步骤导致具有模制层的每个单独的半导体。 该成型层对应于连续成型层的一部分。 附着步骤包括将各个半导体器件的模制层附着到粘合剂表面。 模制暴露区域的步骤包括模制粘合剂表面上方的暴露区域。 这形成了一个坚实的材料。 将晶片锯切成单个半导体器件的步骤包括锯切固体材料。

公开(公告)号：US07517726B1

公开(公告)日：2009-04-14

申请号：US12109617

申请日：2008-04-25

申请人： Xiaochun Tan ,  Jun Guo

发明人： Xiaochun Tan ,  Jun Guo

IPC分类号： H01L21/00

CPC分类号： H01L29/0657 ,  H01L21/56 ,  H01L23/3114 ,  H01L23/564 ,  H01L24/96 ,  H01L25/0655 ,  H01L2224/274 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00

摘要： In one embodiment the present invention includes a method of manufacturing a chip scale package. Embodiments of the present invention include sawing kerfs between semiconductor device boundaries on opposite sides of the wafer and filling the kerfs with mold compound. The devices may then be sawed into individual packaged devices encapsulated in mold compound. In one embodiment, kerfs on opposite sides of the wafer have different widths to create a step in the wafer boundary with the mold compound, which improves the integrity of the package. In one embodiment, a device and one or more neighboring devices are bonded together using bond wires to form a group of device that are encapsulated in mold compound.

摘要翻译： 在一个实施例中，本发明包括制造芯片级封装的方法。 本发明的实施例包括在晶片的相对侧上的半导体器件边界之间锯切切割并用模具化合物填充切口。 然后可以将这些装置锯成封装在模塑料中的单个包装装置。 在一个实施例中，晶片的相对侧上的切口具有不同的宽度，以在模具化合物的晶片边界中产生台阶，这提高了封装的完整性。 在一个实施例中，使用接合线将装置和一个或多个相邻装置结合在一起以形成封装在模具化合物中的一组装置。

公开(公告)号：US20100178733A1

公开(公告)日：2010-07-15

申请号：US12728914

申请日：2010-03-22

申请人： Xiaochun Tan ,  Zhining Li ,  Xaiolan Jiang

发明人： Xiaochun Tan ,  Zhining Li ,  Xaiolan Jiang

IPC分类号： H01L21/56

CPC分类号： H01L21/6835 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L29/0657 ,  H01L2221/68359 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/10158 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present invention include a method of packaging semiconductor devices. The method comprises the steps of molding a surface of a wafer, sawing the wafer into individual devices, attaching the individual semiconductor device to an adhesive surface, molding the exposed surface, and sawing the wafer into individual semiconductor devices. The step of molding forms a continuous molded layer. The step of sawing results in each individual semiconductor having a molded layer. This molded layer corresponds to a portion of the continuous molded layer. The step of attaching includes attaching the molded layer of the individual semiconductor devices to the adhesive surface. The step of molding the exposed area includes molding an exposed area above the adhesive surface. This forms a solid expanse of material. The step of sawing the wafer into individual semiconductor devices includes sawing the solid expanse of material.

摘要翻译： 本发明的实施例包括一种封装半导体器件的方法。 该方法包括以下步骤：将晶片的表面成型，将晶片锯成单独的装置，将各个半导体器件连接到粘合剂表面，模制暴露的表面，以及将晶片锯成单独的半导体器件。 模制步骤形成连续模塑层。 锯切的步骤导致具有模制层的每个单独的半导体。 该成型层对应于连续成型层的一部分。 附着步骤包括将各个半导体器件的模制层附着到粘合剂表面。 模制暴露区域的步骤包括模制粘合剂表面上方的暴露区域。 这形成了一个坚实的材料。 将晶片锯切成单个半导体器件的步骤包括锯切固体材料。

公开(公告)号：US07745261B2

公开(公告)日：2010-06-29

申请号：US12109597

申请日：2008-04-25

申请人： Xiaochun Tan ,  Jun Guo

发明人： Xiaochun Tan ,  Jun Guo

IPC分类号： H01L21/00

CPC分类号： H01L21/561 ,  H01L23/3114 ,  H01L2224/13 ,  H01L2924/10156

摘要： Embodiments of the present invention includes a method of assembling a chip scale package (CSP). The method comprises adding bumps, sawing the saw streets from the front of a wafer, molding the front of the wafer, grinding the back of the wafer, sawing the saw streets from the back of the wafer, molding the back of the wafer, and sawing between devices to form a plurality of packaged devices. Sawing the saw streets from the front of the wafer establishes a first cut. Molding the front of the wafer includes using a first mold compound such that the mold compound fills in the first cut. Sawing the saw streets from the back of the wafer establishes a second cut.

摘要翻译： 本发明的实施例包括一种组装芯片级封装（CSP）的方法。 该方法包括添加凸块，从晶片的前面锯锯切街道，模制晶片的前部，研磨晶片的背面，从晶片的后面锯锯切街道，模制晶片的背面，以及 在设备之间切割以形成多个封装的装置。 从晶圆正面看锯街道，首先切割。 模制晶片的前部包括使用第一模具化合物，使得模具化合物填充在第一切割中。 从晶圆的背面锯锯道，建立了第二次切割。

公开(公告)号：US07713784B2

公开(公告)日：2010-05-11

申请号：US12109635

申请日：2008-04-25

申请人： Xiaochun Tan ,  Zhining Li ,  Xiaolan Jiang

发明人： Xiaochun Tan ,  Zhining Li ,  Xiaolan Jiang

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L29/0657 ,  H01L2221/68359 ,  H01L2224/274 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/10158 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present invention include a method of packaging semiconductor devices. The method comprises the steps of molding a surface of a wafer, sawing the wafer into individual devices, attaching the individual semiconductor device to an adhesive surface, molding the exposed surface, and sawing the wafer into individual semiconductor devices. The step of molding forms a continuous molded layer. The step of sawing results in each individual semiconductor having a molded layer. This molded layer corresponds to a portion of the continuous molded layer. The step of attaching includes attaching the molded layer of the individual semiconductor devices to the adhesive surface. The step of molding the exposed area includes molding an exposed area above the adhesive surface. This forms a solid expanse of material. The step of sawing the wafer into individual semiconductor devices includes sawing the solid expanse of material.

摘要翻译： 本发明的实施例包括一种封装半导体器件的方法。 该方法包括以下步骤：将晶片的表面成型，将晶片锯成单独的装置，将各个半导体器件连接到粘合剂表面，模制暴露的表面，以及将晶片锯成单独的半导体器件。 模制步骤形成连续模塑层。 锯切的步骤导致具有模制层的每个单独的半导体。 该成型层对应于连续成型层的一部分。 附着步骤包括将各个半导体器件的模制层附着到粘合剂表面。 模制暴露区域的步骤包括模制粘合剂表面上方的暴露区域。 这形成了一个坚实的材料。 将晶片锯切成单个半导体器件的步骤包括锯切固体材料。