摘要:
In an apparatus for measuring thickness of a thin film, which is formed through a conductor, preventing the measurement from an error due to the curve or bend on a substrate surface or a moving surface of a stage, but without necessity of a large-scaled facility, an electric filed is applied between a probe 10 and a stage 8, so as to obtain an electrostatic capacitance of the substrate 3, an electrostatic capacitance of an insulating film, which is formed between the substrate 3, and an electrostatic capacitance defined starting from the substrate 3 to the thin film 4. The electrostatic capacitance between the substrate 3 and the thin film 4 is measured at plural numbers of places covering over the entire surface of the thin film 4. The probe 10 is so supported that the contact load “P” comes to be constant, by the probe 10 onto the thin film 4. A contact area of the probe 10 between the thin film 4 is calculated out through a predetermined equation, assuming the load “P” is constant. From respective electrostatic capacitances and the contact area measured, a distribution of thickness of the thin film 4 over the entire area thereof.
摘要:
A probe structure is provided in which secondary electrodes of a main base material and probes are formed can be electrically connected to electrodes in a substrate side even when a lot of probes are formed in a large area, so that a lot of LSIs within a wafer can be tested in one lot in a wafer test process, and an efficiency of the test process can be improved. In the probe structure, an interposer constituted by a high rigid material is arranged between the main base material having the probes formed therein and the substrate side, and the secondary electrodes of the main base material having the probes formed therein are electrically connected to the electrodes in the substrate side via the interposer.
摘要:
It is an object of the present invention to provide a fuel cell having a pressurizing mechanism which can optimize pressure applied to a membrane electrode assembly (MEA) working as a power-generating element to realize high-efficiency power generation and an electronic device equipped with the same. The fuel cell 10A comprises the membrane electrode assembly module 20 which consumes the liquid fuel 40 to generate power, and the fuel chamber 30 for supplying the liquid fuel 40 which it holds inside to the membrane electrode assembly module 20 from the aperture 31, wherein it is provided with the pressurizing member 60 on the membrane electrode assembly module 20, clamping member 53 for fixing the pressurizing member 60 and fuel chamber 30, and elastic member for applying a pressure on the membrane electrode assembly module 20 in its thickness direction, to solve the problems.
摘要:
It is an object of the present invention to provide a fuel cell which can supply a liquid fuel, without changing its composition, to every corner of the membrane electrode assemblies arranged two- dimensionally over a wide area, to generate power at a high efficiency. The fuel cell 10A comprises the membrane electrode assembly modules 20 which consume the liquid fuel 40 to generate power, and the fuel chamber 30 which holds the liquid fuel 40 inside and has the principal plane on which the membrane electrode assembly modules 20 are arranged, wherein the fuel chamber 30 is provided with the fuel injection hole 33 inside, through which the liquid fuel 40 is supplied under pressure from the outside, and the fuel supply gear 42 inside, which is located to come close to the membrane electrode assembly modules 20, the fuel supply gear 42 being provided, on the surface, with the fine pores 43 through which the liquid fuel 40 can pass.
摘要:
A packaging device for holding thereon a plurality of semiconductor devices to be inspected on an inspection device including a probe to be electrically connected to an electrode of each of the semiconductor devices, comprises, holes for respectively receiving detachably therein the semiconductor devices to keep a positional relationship among the semiconductor devices and a positional relationship between the packaging device and each of the semiconductor devices constant with a spacing between the semiconductor devices, in a direction perpendicular to a thickness direction of the semiconductor devices, and electrically conductive members adapted to be connected respectively to the electrodes of the semiconductor devices, and extending to an exterior of the packaging device so that the probe is connected to each of the electrically conductive members.
摘要:
The invention provides a probe structure in which secondary electrodes of a main base material in which probes are formed can be electrically connected to electrodes in a substrate side even when a lot of probes are formed in a large area, so that a lot of LSIs within a wafer can be tested in one lot in a wafer test process, whereby an efficiency of the test process can be improved. In the probe structure, an interposer constituted by a high rigid material is arranged between the main base material having the probes formed therein and the substrate side, and the secondary electrodes of the main base material having the probes formed therein are electrically connected to the electrodes in the substrate side via the interposer.
摘要:
A packaging device for holding thereon a plurality of semiconductor devices to be inspected on an inspection device including a probe to be electrically connected to an electrode of each of the semiconductor devices, comprises, holes for respectively receiving detachably therein the semiconductor devices to keep a positional relationship among the semiconductor devices and a positional relationship between the packaging device and each of the semiconductor devices constant with a spacing between the semiconductor devices, in a direction perpendicular to a thickness direction of the semiconductor devices, and electrically conductive members adapted to be connected respectively to the electrodes of the semiconductor devices, and extending to an exterior of the packaging device so that the probe is connected to each of the electrically conductive members.
摘要:
According to the present invention, there is provided a membrane electrode composite module including a membrane electrode composite formed by sandwiching both surfaces of an electrolyte membrane between gas diffusion electrodes, an anode current collecting plate having fuel flow holes through which fuel flows, and a cathode current collecting plate having oxygen flow holes through which oxygen flows, wherein both surfaces of the membrane electrode composite are sandwiched between the anode current collecting plate and the cathode current collecting plate, the membrane electrode composite module further including films made of a synthetic resin (a first film and a second film) which are a base of the anode current collecting plate and a base of the cathode current collecting plate.
摘要:
According to the present invention, there is provided a membrane electrode composite module including a membrane electrode composite formed by sandwiching both surfaces of an electrolyte membrane between gas diffusion electrodes, an anode current collecting plate having fuel flow holes through which fuel flows, and a cathode current collecting plate having oxygen flow holes through which oxygen flows, wherein both surfaces of the membrane electrode composite are sandwiched between the anode current collecting plate and the cathode current collecting plate, the membrane electrode composite module further including films made of a synthetic resin (a first film and a second film) which are a base of the anode current collecting plate and a base of the cathode current collecting plate.
摘要:
The conventional semiconductor element testing equipment is arranged to position each probe accurately and need a burdensome operation for fixing, and includes only a limited number of electrode pads and chips to be tested at a batch. An equipment for testing a semiconductor element is arranged to keep each of electrode pads formed on a semiconductor element to be tested in direct contact with each of probes formed on a first substrate composed of silicon, one of electric connecting substrates disposed in the equipment. On the first substrate, each probe is formed on a cantilever and a wire is routed from a tip of each probe along a tip of the cantilever to the electrode pad formed on an opposite surface to the probe forming surface through an insulating layer.