公开(公告)号：US06864568B2

公开(公告)日：2005-03-08

申请号：US10252546

申请日：2002-09-24

申请人： Ryuji Kohno ,  Hiroya Shimizu ,  Masatoshi Kanamaru ,  Atsushi Hosogane ,  Toshio Miyatake ,  Hideo Miura ,  Tatsuya Nagata ,  Yoshishige Endo ,  Masaaki Namba ,  Yuji Wada

发明人： Ryuji Kohno ,  Hiroya Shimizu ,  Masatoshi Kanamaru ,  Atsushi Hosogane ,  Toshio Miyatake ,  Hideo Miura ,  Tatsuya Nagata ,  Yoshishige Endo ,  Masaaki Namba ,  Yuji Wada

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R1/073 ,  H01L21/66 ,  H01L23/02

CPC分类号： G01R1/0483 ,  H01L2924/0002 ,  H01L2924/00

摘要： A packaging device for holding thereon a plurality of semiconductor devices to be inspected on an inspection device including a probe to be electrically connected to an electrode of each of the semiconductor devices, comprises, holes for respectively receiving detachably therein the semiconductor devices to keep a positional relationship among the semiconductor devices and a positional relationship between the packaging device and each of the semiconductor devices constant with a spacing between the semiconductor devices, in a direction perpendicular to a thickness direction of the semiconductor devices, and electrically conductive members adapted to be connected respectively to the electrodes of the semiconductor devices, and extending to an exterior of the packaging device so that the probe is connected to each of the electrically conductive members.

摘要翻译： 一种用于在其上保持要检查的多个待检查的半导体器件的封装装置，包括：电连接到每个半导体器件的电极的探针，包括：用于分别接收半导体器件中的可分离地接收的孔，以保持位置 半导体器件之间的关系以及在与半导体器件的厚度方向垂直的方向上半导体器件之间的间隔恒定的封装器件和每个半导体器件之间的位置关系以及适于分别连接的导电部件 并且延伸到包装装置的外部，使得探针连接到每个导电构件。

公开(公告)号：US06465264B1

公开(公告)日：2002-10-15

申请号：US09654612

申请日：2000-09-01

申请人： Ryuji Kohno ,  Hiroya Shimizu ,  Masatoshi Kanamaru ,  Atsushi Hosogane ,  Toshio Miyatake ,  Hideo Miura ,  Tatsuya Nagata ,  Yoshishige Endo ,  Masaaki Namba ,  Yuji Wada

发明人： Ryuji Kohno ,  Hiroya Shimizu ,  Masatoshi Kanamaru ,  Atsushi Hosogane ,  Toshio Miyatake ,  Hideo Miura ,  Tatsuya Nagata ,  Yoshishige Endo ,  Masaaki Namba ,  Yuji Wada

IPC分类号： G01R3126

CPC分类号： G01R1/0483 ,  H01L2924/0002 ,  H01L2924/00

摘要： A packaging device for holding thereon a plurality of semiconductor devices to be inspected on an inspection device including a probe to be electrically connected to an electrode of each of the semiconductor devices, comprises, holes for respectively receiving detachably therein the semiconductor devices to keep a positional relationship among the semiconductor devices and a positional relationship between the packaging device and each of the semiconductor devices constant with a spacing between the semiconductor devices, in a direction perpendicular to a thickness direction of the semiconductor devices, and electrically conductive members adapted to be connected respectively to the electrodes of the semiconductor devices, and extending to an exterior of the packaging device so that the probe is connected to each of the electrically conductive members.

摘要翻译： 一种用于在其上保持要检查的多个待检查的半导体器件的封装装置，包括：电连接到每个半导体器件的电极的探针，包括：用于分别接收半导体器件中的可分离地接收的孔，以保持位置 半导体器件之间的关系以及在与半导体器件的厚度方向垂直的方向上半导体器件之间的间隔恒定的封装器件和每个半导体器件之间的位置关系以及适于分别连接的导电部件 并且延伸到包装装置的外部，使得探针连接到每个导电构件。

公开(公告)号：US06977514B2

公开(公告)日：2005-12-20

申请号：US10625566

申请日：2003-07-24

申请人： Ryuji Kohno ,  Tatsuya Nagata ,  Hiroya Shimizu ,  Toshio Miyatake ,  Hideo Miura

发明人： Ryuji Kohno ,  Tatsuya Nagata ,  Hiroya Shimizu ,  Toshio Miyatake ,  Hideo Miura

IPC分类号： G01R1/073 ,  H01L21/66 ,  G01R31/28

CPC分类号： G01R1/07378

摘要： A probe structure is provided in which secondary electrodes of a main base material and probes are formed can be electrically connected to electrodes in a substrate side even when a lot of probes are formed in a large area, so that a lot of LSIs within a wafer can be tested in one lot in a wafer test process, and an efficiency of the test process can be improved. In the probe structure, an interposer constituted by a high rigid material is arranged between the main base material having the probes formed therein and the substrate side, and the secondary electrodes of the main base material having the probes formed therein are electrically connected to the electrodes in the substrate side via the interposer.

摘要翻译： 提供了一种探针结构，其中形成主基材和探针的二次电极可以在基板侧电连接到基板侧的电极，即使在大面积上形成大量的探针，使得晶片内的大量LSI 可以在晶片测试过程中一次性测试，并且可以提高测试过程的效率。 在探针结构中，由具有高刚性材料的插入体配置在其中形成有探针的主基材和基板侧之间，并且其中形成有探针的主基材的二次电极电连接到电极 在基板侧经由插入件。

公开(公告)号：US06614246B1

公开(公告)日：2003-09-02

申请号：US09648452

申请日：2000-08-28

申请人： Ryuji Kohno ,  Tatsuya Nagata ,  Hiroya Shimizu ,  Toshio Miyatake ,  Hideo Miura

发明人： Ryuji Kohno ,  Tatsuya Nagata ,  Hiroya Shimizu ,  Toshio Miyatake ,  Hideo Miura

IPC分类号： G01R1073

CPC分类号： G01R1/07378

摘要： The invention provides a probe structure in which secondary electrodes of a main base material in which probes are formed can be electrically connected to electrodes in a substrate side even when a lot of probes are formed in a large area, so that a lot of LSIs within a wafer can be tested in one lot in a wafer test process, whereby an efficiency of the test process can be improved. In the probe structure, an interposer constituted by a high rigid material is arranged between the main base material having the probes formed therein and the substrate side, and the secondary electrodes of the main base material having the probes formed therein are electrically connected to the electrodes in the substrate side via the interposer.

摘要翻译： 本发明提供了一种探针结构，其中形成探针的主要基底材料的二次电极即使在大面积形成大量探针的情况下也可以与衬底侧的电极电连接，从而使大量的LSIs 可以在晶片测试过程中一次性地测试晶片，从而可以提高测试过程的效率。 在探针结构中，由具有高刚性材料的插入体配置在其中形成有探针的主基材和基板侧之间，并且其中形成有探针的主基材的二次电极电连接到电极 在基板侧经由插入件。

公开(公告)号：US06496023B1

公开(公告)日：2002-12-17

申请号：US09722484

申请日：2000-11-28

申请人： Masatoshi Kanamaru ,  Yoshishige Endo ,  Takanorr Aono ,  Ryuji Kohno ,  Toshio Miyatake ,  Hideyuki Aoki ,  Naoto Ban

发明人： Masatoshi Kanamaru ,  Yoshishige Endo ,  Takanorr Aono ,  Ryuji Kohno ,  Toshio Miyatake ,  Hideyuki Aoki ,  Naoto Ban

IPC分类号： G01R3102

CPC分类号： G01R1/07357 ,  Y10S977/874

摘要： A structure is provided such that a plural cantilevers are formed on a first board formed of silicon, probes are respectively formed on the individual cantilevers at positions each offset perpendicularly to a longitudinal center line of the cantilever, and wiring connected continuously from each probe to a secondary electrode pad portion through an insulating layer. A structure is alternatively adopted such that by using a both-ends supported beam formed of silicon as the beam, each probe is formed at a position offset toward a supported portion side of the both-ends supported beam.

摘要翻译： 提供一种结构，使得在由硅形成的第一板上形成多个悬臂，在各个悬臂分别在垂直于悬臂的纵向中心线偏移的位置处形成探针，并且从每个探针连续连接到每个探针 次级电极焊盘部分穿过绝缘层。 可替代地采用结构，使得通过使用由硅形成的两端支撑梁作为梁，每个探针形成在朝向两端支撑梁的支撑部分侧偏移的位置。

公开(公告)号：US06774654B2

公开(公告)日：2004-08-10

申请号：US10316828

申请日：2002-12-12

申请人： Masatoshi Kanamaru ,  Yoshishige Endo ,  Takanorr Aono ,  Ryuji Kohno ,  Toshio Miyatake ,  Hideyuki Aoki ,  Naoto Ban

发明人： Masatoshi Kanamaru ,  Yoshishige Endo ,  Takanorr Aono ,  Ryuji Kohno ,  Toshio Miyatake ,  Hideyuki Aoki ,  Naoto Ban

IPC分类号： G01R3102

CPC分类号： G01R1/07357 ,  Y10S977/874

摘要： A semiconductor inspecting apparatus having a plurality of electrical connection boards arranged in the inspecting apparatus and a plurality of probes respectively provided on a plurality of beams formed on a first board of said plurality of electrical connection boards, the probes being adapted to be individually brought into contact with a plurality of electrode pads of a semiconductor device for inspection, so as to inspect the semiconductor device while establishing electrical connection therebetween. A one-end supported beam is used as each of the beams, and each of the probes is formed at a portion shifted in a rectangular direction to a center line of a longitudinal direction of the one-end supported beam.

摘要翻译： 一种具有布置在检查装置中的多个电连接板和分别设置在形成在所述多个电连接板的第一板上的多个梁上的多个探针的半导体检查装置，所述探针适于单独地进入 与用于检查的半导体器件的多个电极焊盘接触，以便在其间建立电连接的同时检查半导体器件。 使用一端支撑梁作为每个梁，并且每个探针形成在沿着矩形方向偏移到一端支撑梁的纵向方向的中心线的部分。

公开(公告)号：US06885208B2

公开(公告)日：2005-04-26

申请号：US10218596

申请日：2002-08-15

申请人： Toshio Miyatake ,  Tatsuya Nagata ,  Hiroya Shimizu ,  Ryuji Kohno ,  Hideyuki Aoki

发明人： Toshio Miyatake ,  Tatsuya Nagata ,  Hiroya Shimizu ,  Ryuji Kohno ,  Hideyuki Aoki

IPC分类号： G01R31/28 ,  G01R31/26 ,  G11C11/419 ,  G11C29/04 ,  H01L21/66 ,  H01L21/822 ,  H01L23/544 ,  H01L23/58 ,  H01L27/04

CPC分类号： H01L22/32 ,  G11C29/04 ,  G11C29/1201 ,  G11C2029/1206 ,  H01L22/34 ,  H01L2224/05554

摘要： A semiconductor device includes a quadrangular semiconductor substrate and a self test circuit formed on the semiconductor substrate. A plurality of pads are formed on the semiconductor substrate, which pads are coupled at least to the self test circuit. The semiconductor substrate includes four rectangular or square regions which each include a respective corner of the quadrangle, and at least two of the pads are respectively located on diagonally opposite ones of the regions from one another.

摘要翻译： 半导体器件包括四边形半导体衬底和形成在半导体衬底上的自测电路。 多个焊盘形成在半导体衬底上，这些焊盘至少耦合到自测电路。 半导体衬底包括四个矩形或正方形区域，每个区域包括四边形的相应角部，并且至少两个衬垫分别位于彼此相对的一个区域上。

公开(公告)号：US20060097606A1

公开(公告)日：2006-05-11

申请号：US11270616

申请日：2005-11-10

申请人： Toshio Miyatake ,  Juichi Enyama

发明人： Toshio Miyatake ,  Juichi Enyama

IPC分类号： H02K3/46 ,  H02K15/14

CPC分类号： H02K3/505 ,  Y10T29/49009

摘要： A generator and a method of manufacturing the generator, which can suppress a lowering of tension of a bind ring caused by an initial deformation during assembly and changes with the lapse of time during long-term operation, and can prevent a lowering of the support function. The generator includes a coil assembled in a groove formed in an iron core of a rotor and a bind ring for fixing a coil end of the coil, which is projected outward of the iron core, to a coil support. A restraint member is disposed on at least one of opposite axial ends of the bind ring to restrain the relevant end from deforming.

摘要翻译： 发电机和发电机的制造方法，其能够抑制由组装时的初始变形引起的接合环的张力下降以及长时间运转中随时间的变化的变化，并且可以防止支撑功能的降低 。 发电机包括组装在形成在转子的铁芯中的槽中的线圈和用于固定线圈的线圈端的绑定环，该线圈端部从铁芯的外侧突出到线圈支撑件。 约束构件设置在绑环的相对轴向端部中的至少一个上，以限制相关端部的变形。

公开(公告)号：US07432628B2

公开(公告)日：2008-10-07

申请号：US11270616

申请日：2005-11-10

申请人： Toshio Miyatake ,  Juichi Enyama

发明人： Toshio Miyatake ,  Juichi Enyama

IPC分类号： H02K3/46

CPC分类号： H02K3/505 ,  Y10T29/49009

摘要： A generator and a method of manufacturing the generator, which can suppress a lowering of tension of a bind ring caused by an initial deformation during assembly and changes with the lapse of time during long-term operation, and can prevent a lowering of the support function. The generator includes a coil assembled in a groove formed in an iron core of a rotor and a bind ring for fixing a coil end of the coil, which is projected outward of the iron core, to a coil support. A restraint member is disposed on at least one of opposite axial ends of the bind ring to restrain the relevant end from deforming.

摘要翻译： 发电机和发电机的制造方法，其能够抑制由组装时的初始变形引起的接合环的张力下降以及长时间运转中随时间的变化的变化，并且可以防止支撑功能的降低 。 发电机包括组装在形成在转子的铁芯中的槽中的线圈和用于固定线圈的线圈端的绑定环，该线圈端部从铁芯的外侧突出到线圈支撑件。 约束构件设置在绑环的相对轴向端部中的至少一个上，以限制相关端部的变形。