公开(公告)号：US20170077898A1

公开(公告)日：2017-03-16

申请号：US15232116

申请日：2016-08-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Soo PARK ,  Jea Shik SHIN ,  Sang Uk SON ,  Yeong Gyu LEE ,  Moon Chul LEE ,  Duck Hwan KIM ,  Chul Soo KIM

IPC: H03H9/05 ,  H03H9/205 ,  H03H9/13 ,  H03H9/54

Abstract: An acoustic wave resonator includes a substrate; a resonating part disposed on a first surface of the substrate and including a first electrode, a piezoelectric layer, and a second electrode; and a cap disposed on the first surface of the substrate and including an accommodating part accommodating the resonating part. The resonating part is configured to be operated by either one or both of a signal output from a first device substrate disposed facing a second surface of the substrate on an opposite side of the substrate from the first surface of the substrate and a signal output from a second device substrate disposed on the cap.

Abstract translation: 声波谐振器包括基板; 设置在所述基板的第一表面上并包括第一电极，压电层和第二电极的谐振部分; 以及盖，其设置在所述基板的所述第一表面上，并且包括容纳所述共振部的容纳部。 谐振部分被配置为由从衬底的与衬底的第一表面相对的一侧面朝向衬底的第二表面布置的第一器件衬底输出的信号中的一个或两个来操作，以及从衬底的第一表面输出的信号 设置在盖上的第二装置基板。

公开(公告)号：US20160204761A1

公开(公告)日：2016-07-14

申请号：US14932109

申请日：2015-11-04

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Moon Chul LEE ,  Duck Hwan KIM ,  Yeong Gyu LEE ,  Chul Soo KIM ,  Jie Ai YU ,  Sang Uk SON

IPC: H03H9/17 ,  H03H9/54

CPC classification number: H03H9/0514 ,  H03H3/02 ,  H03H9/0504 ,  H03H9/173 ,  H03H2003/021

Abstract: There are provided an acoustic resonator and a method of manufacturing the same. The acoustic resonator includes a resonance part including a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrodes. The acoustic resonator also includes a substrate disposed below the resonance part and including a via hole penetrating through the substrate and a connection conductor disposed in the via hole and connected to at least one of the first and second electrodes.

Abstract translation: 提供了一种声谐振器及其制造方法。 声谐振器包括共振部分，其包括第一电极，第二电极和布置在第一和第二电极之间的压电层。 声谐振器还包括设置在谐振部分下方并且包括穿透基板的通孔和布置在通孔中并连接到第一和第二电极中的至少一个的连接导体的基板。

公开(公告)号：US20160163954A1

公开(公告)日：2016-06-09

申请号：US14925230

申请日：2015-10-28

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jea Shik SHIN ,  Sang Uk SON ,  Yeong Gyu LEE ,  Moon Chul LEE ,  Ho Soo PARK ,  Duck Hwan KIM ,  Chul Soo KIM

IPC: H01L41/047 ,  H01L41/18 ,  H01L41/29

CPC classification number: H03H9/173 ,  H03H3/02 ,  H03H2003/021

Abstract: An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonance part including a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrodes; and a substrate disposed below the resonance part. The piezoelectric layer is disposed on a flat surface of the first electrode.

Abstract translation: 提供一种声谐振器及其制造方法。 声谐振器包括共振部分，其包括第一电极，第二电极和布置在第一和第二电极之间的压电层; 以及设置在共振部下方的基板。 压电层设置在第一电极的平坦表面上。

公开(公告)号：US20160164487A1

公开(公告)日：2016-06-09

申请号：US14885604

申请日：2015-10-16

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jea Shik SHIN ,  Moon Chul LEE ,  Chul Soo KIM

IPC: H03H9/58 ,  H03H9/02 ,  H03H9/205

CPC classification number: H03H9/605 ,  H03H9/173 ,  H03H9/58

Abstract: A bulk acoustic wave filter may include: a first resonator part including one or more first bulk acoustic wave resonators connected between a signal port for transmitting or receiving a signal and a node connected to an antenna port; and a second resonator part including one or more second bulk acoustic wave resonators connected between the signal port and a ground, wherein a quality factor (IF) value of the one or more first bulk acoustic wave resonators is less than a IF value of the one or more second bulk acoustic wave resonators.

Abstract translation: 体声波滤波器可以包括：第一谐振器部分，包括连接在用于发送或接收信号的信号端口与连接到天线端口的节点之间的一个或多个第一体声波谐振器; 以及包括连接在所述信号端口和地之间的一个或多个第二体声波谐振器的第二谐振器部分，其中所述一个或多个第一体声波谐振器的质量因子（IF）值小于所述第一体声波谐振器的IF值 或更多的第二体声波谐振器。

公开(公告)号：US20170244381A1

公开(公告)日：2017-08-24

申请号：US15276055

申请日：2016-09-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： June Kyoo LEE ,  Chul Soo KIM ,  Won Kyu JEUNG

IPC: H03H9/19 ,  H01L41/29 ,  H01L41/047

Abstract: There are provided an acoustic resonator module, and a method of manufacturing the same. An acoustic resonator module includes a resonating part disposed on a substrate and an inductor electrically connected to the resonating part, and having at least a portion disposed to be spaced apart from the substrate.

公开(公告)号：US20160079956A1

公开(公告)日：2016-03-17

申请号：US14638529

申请日：2015-03-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sang Uk SON ,  Duck Hwan KIM ,  Jea Shik SHIN ,  Yeong Gyu LEE ,  Chul Soo KIM ,  Moon Chul LEE ,  Ho Soo PARK ,  Jie Ai YU

IPC: H03H9/54 ,  H03H9/02 ,  H03H3/02 ,  H03H3/04 ,  H03H9/17

CPC classification number: H03H9/02086 ,  H03H3/02 ,  H03H3/04 ,  H03H9/173 ,  H03H2003/0414

Abstract: There is provided an acoustic resonator including: a resonance part including a first electrode, a second electrode, and a piezoelectric layer interposed between the first and second electrodes; and a substrate provided below the resonance part, wherein the substrate includes at least one via hole penetrating through the substrate and a connective conductor formed in the via hole and connected to at least one of the first and second electrodes. Therefore, reliability of the connective conductor formed in the substrate may be secured.

Abstract translation: 提供了一种声谐振器，包括：谐振部分，包括第一电极，第二电极和介于第一和第二电极之间的压电层; 以及设置在谐振部件下方的基板，其中，所述基板包括贯穿所述基板的至少一个通孔以及形成在所述通孔中并连接到所述第一和第二电极中的至少一个的连接导体。 因此，可以确保形成在基板中的连接导体的可靠性。

公开(公告)号：US20160301380A1

公开(公告)日：2016-10-13

申请号：US15007725

申请日：2016-01-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Chul LEE ,  Yeong Gyu LEE ,  Chul Soo KIM ,  Jea Shik SHIN ,  Duck Hwan KIM ,  Sang Uk SON

IPC: H03H9/54 ,  H03H9/17 ,  H03H9/02

CPC classification number: H03H9/02133 ,  H03H9/173 ,  H03H9/587 ,  H03H9/605

Abstract: A bulk acoustic wave resonator including a substrate; an air cavity formed on the substrate; and a resonating part formed on the air cavity and comprising a first electrode, a piezoelectric layer, and a second electrode which are sequentially laminated, wherein a cross section of the air cavity has a short side, a long side opposing the short side, a first lateral side and a second lateral side connecting the short side and the long side to each other, the first and second lateral sides are inclined, and a surface roughness of the first electrode, the piezoelectric layer, the second electrode, or any combination thereof is between 1 nm and 100 nm.

Abstract translation: 一种包括衬底的体声波谐振器; 形成在基板上的空气腔; 以及谐振部，其形成在所述空气腔上并且包括依次层叠的第一电极，压电层和第二电极，其中所述空气腔的横截面具有短边，与所述短边相对的长边， 第一侧面和第二侧面将短边和长边彼此连接，第一和第二横向侧倾斜，并且第一电极，压电层，第二电极或其任何组合的表面粗糙度 在1nm和100nm之间。