-
公开(公告)号:US20190199319A1
公开(公告)日:2019-06-27
申请号:US16292715
申请日:2019-03-05
发明人: Tae Yoon KIM , Yeong Gyu LEE , Moon Chul LEE , Jae Chang LEE , Duck Hwan KIM
CPC分类号: H03H9/131 , H03H3/02 , H03H9/1007
摘要: A resonator package and a method of manufacturing the same are provided. The method of manufacturing a resonator package involves etching a lower electrode with a hardmask, in which only a portion of a thickness of the lower electrode is etched to shape the lower electrode.
-
公开(公告)号:US20170077898A1
公开(公告)日:2017-03-16
申请号:US15232116
申请日:2016-08-09
发明人: Ho Soo PARK , Jea Shik SHIN , Sang Uk SON , Yeong Gyu LEE , Moon Chul LEE , Duck Hwan KIM , Chul Soo KIM
摘要: An acoustic wave resonator includes a substrate; a resonating part disposed on a first surface of the substrate and including a first electrode, a piezoelectric layer, and a second electrode; and a cap disposed on the first surface of the substrate and including an accommodating part accommodating the resonating part. The resonating part is configured to be operated by either one or both of a signal output from a first device substrate disposed facing a second surface of the substrate on an opposite side of the substrate from the first surface of the substrate and a signal output from a second device substrate disposed on the cap.
摘要翻译: 声波谐振器包括基板; 设置在所述基板的第一表面上并包括第一电极,压电层和第二电极的谐振部分; 以及盖,其设置在所述基板的所述第一表面上,并且包括容纳所述共振部的容纳部。 谐振部分被配置为由从衬底的与衬底的第一表面相对的一侧面朝向衬底的第二表面布置的第一器件衬底输出的信号中的一个或两个来操作,以及从衬底的第一表面输出的信号 设置在盖上的第二装置基板。
-
公开(公告)号:US20160035960A1
公开(公告)日:2016-02-04
申请号:US14642054
申请日:2015-03-09
发明人: Moon Chul LEE , Jea Shik SHIN , Young Gyu LEE , Ho Soo PARK , Duck Hwan KIM
IPC分类号: H01L41/047 , H01L41/332
CPC分类号: H03H9/173 , H03H2003/021
摘要: An acoustic resonator is provided in which loss of acoustic waves in a transverse direction may be reduced through a cavity formed in an acoustic resonance unit including a first electrode, a piezoelectric layer, and a second electrode, and in which acoustic waves in a longitudinal direction may be reduced by forming an air gap between the acoustic resonance unit and a substrate. Whereby, a quality factor may be improved.
摘要翻译: 提供一种声谐振器,其中可以通过在包括第一电极,压电层和第二电极的声共振单元中形成的空腔来减小横向的声波损失,并且其中沿纵向的声波 可以通过在声共振单元和基板之间形成气隙来减小。 因此,可以改善品质因素。
-
公开(公告)号:US20170174503A1
公开(公告)日:2017-06-22
申请号:US15091057
申请日:2016-04-05
发明人: Moon Chul LEE , Duck Hwan KIM , Yeong Gyu LEE , Jae Chang LEE , Tae Yoon KIM , Kyong Bok MIN
CPC分类号: B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81C1/00269 , B81C2203/0118 , H01L21/561 , H01L23/10 , H01L23/3114
摘要: A wafer level package includes a wafer member having inner cavities in which circuit elements are disposed, element wall members disposed on an internal surface of the wafer member and enclosing element sections in which the circuit elements are disposed, and clearance wall members disposed on external surfaces of the element wall members and dividing a space between the element sections into clearance sections.
-
公开(公告)号:US20160079956A1
公开(公告)日:2016-03-17
申请号:US14638529
申请日:2015-03-04
发明人: Sang Uk SON , Duck Hwan KIM , Jea Shik SHIN , Yeong Gyu LEE , Chul Soo KIM , Moon Chul LEE , Ho Soo PARK , Jie Ai YU
CPC分类号: H03H9/02086 , H03H3/02 , H03H3/04 , H03H9/173 , H03H2003/0414
摘要: There is provided an acoustic resonator including: a resonance part including a first electrode, a second electrode, and a piezoelectric layer interposed between the first and second electrodes; and a substrate provided below the resonance part, wherein the substrate includes at least one via hole penetrating through the substrate and a connective conductor formed in the via hole and connected to at least one of the first and second electrodes. Therefore, reliability of the connective conductor formed in the substrate may be secured.
摘要翻译: 提供了一种声谐振器,包括:谐振部分,包括第一电极,第二电极和介于第一和第二电极之间的压电层; 以及设置在谐振部件下方的基板,其中,所述基板包括贯穿所述基板的至少一个通孔以及形成在所述通孔中并连接到所述第一和第二电极中的至少一个的连接导体。 因此,可以确保形成在基板中的连接导体的可靠性。
-
公开(公告)号:US20160344367A1
公开(公告)日:2016-11-24
申请号:US15058713
申请日:2016-03-02
发明人: Tae Yoon KIM , Yeong Gyu LEE , Moon Chul LEE , Jae Chang LEE , Duck Hwan KIM
CPC分类号: H03H9/131 , H03H3/02 , H03H9/1007
摘要: A resonator package and a method of manufacturing the same are provided. The method of manufacturing a resonator package involves etching a lower electrode with a hardmask, in which only a portion of a thickness of the lower electrode is etched to shape the lower electrode.
摘要翻译: 提供了一种谐振器封装及其制造方法。 制造谐振器封装的方法包括用硬掩模蚀刻下电极,其中仅蚀刻下电极的厚度的一部分以使下电极成形。
-
公开(公告)号:US20160329481A1
公开(公告)日:2016-11-10
申请号:US14991110
申请日:2016-01-08
发明人: Tae Yoon KIM , Yeong Gyu LEE , Moon Chul LEE , Jae Chang LEE , Duck Hwan KIM
IPC分类号: H03H9/54 , H01L41/047
CPC分类号: H03H9/1014
摘要: A bulk acoustic wave resonator includes a resonating part comprising a first electrode, a piezoelectric layer, and a second electrode sequentially laminated, wherein the resonating part is disposed on a substrate; and a cap comprising a groove part configured to accommodate the resonating part, a frame bonded to the substrate by a bonding agent, and a permeation preventing part configured to block the bonding agent from permeating into the groove part from the frame.
摘要翻译: 一种体声波谐振器包括:谐振部分,包括第一电极,压电层和顺序层压的第二电极,其中所述谐振部分设置在基板上; 以及帽,其包括构造成容纳所述共振部的槽部,通过接合剂与所述基板接合的框架,以及防止粘结剂从所述框架向所述槽部渗透的防渗透部。
-
公开(公告)号:US20160204761A1
公开(公告)日:2016-07-14
申请号:US14932109
申请日:2015-11-04
发明人: Moon Chul LEE , Duck Hwan KIM , Yeong Gyu LEE , Chul Soo KIM , Jie Ai YU , Sang Uk SON
CPC分类号: H03H9/0514 , H03H3/02 , H03H9/0504 , H03H9/173 , H03H2003/021
摘要: There are provided an acoustic resonator and a method of manufacturing the same. The acoustic resonator includes a resonance part including a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrodes. The acoustic resonator also includes a substrate disposed below the resonance part and including a via hole penetrating through the substrate and a connection conductor disposed in the via hole and connected to at least one of the first and second electrodes.
摘要翻译: 提供了一种声谐振器及其制造方法。 声谐振器包括共振部分,其包括第一电极,第二电极和布置在第一和第二电极之间的压电层。 声谐振器还包括设置在谐振部分下方并且包括穿透基板的通孔和布置在通孔中并连接到第一和第二电极中的至少一个的连接导体的基板。
-
公开(公告)号:US20160163954A1
公开(公告)日:2016-06-09
申请号:US14925230
申请日:2015-10-28
发明人: Jea Shik SHIN , Sang Uk SON , Yeong Gyu LEE , Moon Chul LEE , Ho Soo PARK , Duck Hwan KIM , Chul Soo KIM
IPC分类号: H01L41/047 , H01L41/18 , H01L41/29
CPC分类号: H03H9/173 , H03H3/02 , H03H2003/021
摘要: An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonance part including a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrodes; and a substrate disposed below the resonance part. The piezoelectric layer is disposed on a flat surface of the first electrode.
摘要翻译: 提供一种声谐振器及其制造方法。 声谐振器包括共振部分,其包括第一电极,第二电极和布置在第一和第二电极之间的压电层; 以及设置在共振部下方的基板。 压电层设置在第一电极的平坦表面上。
-
10.
公开(公告)号:US20160315244A1
公开(公告)日:2016-10-27
申请号:US14994848
申请日:2016-01-13
IPC分类号: H01L41/107 , H03H9/17 , H01L41/083 , H03H3/02 , H01L41/29 , H01L41/312
CPC分类号: H03H9/17 , H03H3/02 , H03H9/1014 , H03H9/173
摘要: In examples, there is provided a bulk acoustic wave resonator including a substrate; a resonating part including a first electrode, a piezoelectric layer, and a second electrode, laminated on an upper surface of the substrate, a cap bonded to the substrate by a bonding agent; and a sealing layer formed on an externally exposed surface of the bonding agent. This structure provides for a bulk acoustic wave resonator with improved reliability.
摘要翻译: 在实施例中,提供了包括基板的体声波谐振器; 包括层叠在基板的上表面上的第一电极,压电层和第二电极的共振部,通过接合剂与基板接合的盖; 以及形成在接合剂的外露面上的密封层。 该结构提供了具有改进的可靠性的体声波谐振器。
-
-
-
-
-
-
-
-
-