公开(公告)号：US20140152980A1

公开(公告)日：2014-06-05

申请号：US13772491

申请日：2013-02-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gyu Seok KIM ,  Hee Suk CHUNG ,  Suk Jin HAM ,  Dong Yong KIM ,  Yong Choon PARK ,  Mi Yang KIM ,  Tae Yoon KIM

IPC: G01N1/28

CPC classification number: G01N1/28 ,  G01M99/002 ,  G01N3/60 ,  G01N2203/0023 ,  G01N2203/0282 ,  G01N2203/0647

Abstract: There are provided an inspection device for substrate deformation at high temperatures and an inspection method for substrate deformation at high temperatures, the inspection device for substrate deformation at high temperatures, including a crucible including an internal space, an inspection hole disposed in an upper portion thereof so as to inspect the internal space, and a heating unit heating the internal space, an indenter tip disposed in the crucible such that a substrate fixed to the internal space is warped, and an inspection unit disposed above the crucible so as to inspect a cross-section of the substrate.

Abstract translation: 在高温下设置基板变形检查装置和高温基板变形检查方法，高温基板变形检查装置，包括内部空间的坩埚，设置在其上部的检查孔 检查内部空间，加热单元加热内部空间，设置在坩埚中的压头，使得固定在内部空间的基板翘曲;以及检查单元，其设置在坩埚上方，以检查十字 切片的底物。

公开(公告)号：US20250089165A1

公开(公告)日：2025-03-13

申请号：US18673686

申请日：2024-05-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seong Hun NA ,  Dong Yong KIM ,  Mi Geum KIM ,  Mi Jung PARK ,  Yong Su LEE ,  Ho Seung JANG ,  Sang Ik CHO ,  Sung HAN ,  Sung Hoon KIM

IPC: H05K1/11 ,  H05K1/03

Abstract: A printed circuit board includes a glass layer, a through-hole penetrating through the glass layer, a seed layer provided along an inner wall of the through-hole, and a through-via disposed on the seed layer and filling the through-hole. The seed layer includes a carbon-based conductive material.

公开(公告)号：US20150253909A1

公开(公告)日：2015-09-10

申请号：US14341096

申请日：2014-07-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gyu Seok KIM ,  Hee Suk CHUNG ,  Dong Yong KIM ,  Dek Gin YANG ,  Mi Yang KIM ,  Tae Young KIM

IPC: G06F3/047

CPC classification number: G06F3/047

Abstract: Embodiments of the invention provide a touch sensor including a base substrate, and an electrode pattern formed on the base substrate. The electrode pattern is formed by continuously connecting one or more unit patterns, and each unit pattern has closed figures formed to be irregularly arranged therein.

Abstract translation: 本发明的实施例提供一种触摸传感器，其包括基底基板和形成在基底基板上的电极图案。 电极图案通过连续地连接一个或多个单元图案而形成，并且每个单元图案具有形成为不规则地布置在其中的封闭图形。