公开(公告)号：US20250089165A1

公开(公告)日：2025-03-13

申请号：US18673686

申请日：2024-05-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seong Hun NA ,  Dong Yong KIM ,  Mi Geum KIM ,  Mi Jung PARK ,  Yong Su LEE ,  Ho Seung JANG ,  Sang Ik CHO ,  Sung HAN ,  Sung Hoon KIM

IPC: H05K1/11 ,  H05K1/03

Abstract: A printed circuit board includes a glass layer, a through-hole penetrating through the glass layer, a seed layer provided along an inner wall of the through-hole, and a through-via disposed on the seed layer and filling the through-hole. The seed layer includes a carbon-based conductive material.

公开(公告)号：US20210035929A1

公开(公告)日：2021-02-04

申请号：US16655284

申请日：2019-10-17

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seung Wook PARK ,  Jae Chang LEE ,  Seong Hun NA ,  Jae Hyun JUNG

IPC: H01L23/66 ,  H03H9/02 ,  H03H9/64

Abstract: A semiconductor package includes a main substrate, a resonator device disposed above the main substrate, a wiring portion connected to the resonator device, an electrical connection structure connected to the wiring portion and the main substrate, an encapsulant encapsulating the resonator device and the electrical connection structure, and a heat dissipation member bonded to and mounted on the resonator device. A cavity is provided in the resonator device, and is formed between the resonance portion and a resonator device substrate provided in the resonator device.

公开(公告)号：US20240128136A1

公开(公告)日：2024-04-18

申请号：US18110478

申请日：2023-02-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Wook PARK ,  Seong Hun NA ,  Jae Hyun JUNG ,  Kwang Su KIM ,  Sung Jun LEE ,  Yong Suk KIM ,  Dong Hyun PARK

IPC: H01L23/10 ,  H01L21/48 ,  H01L23/043

CPC classification number: H01L23/10 ,  H01L21/4817 ,  H01L23/043

Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.

公开(公告)号：US20200177155A1

公开(公告)日：2020-06-04

申请号：US16540480

申请日：2019-08-14

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seung Wook PARK ,  Tae Kyung LEE ,  Seong Hun NA ,  Jae Chang LEE ,  Jae Hyun JUNG

IPC: H03H9/10 ,  H03H9/05 ,  H01L41/09 ,  H01L41/053 ,  H03H3/02 ,  H03H9/60 ,  H03H9/58 ,  H01L41/047 ,  H03H9/17

Abstract: A bulk-acoustic resonator module includes: a module substrate; a bulk-acoustic resonator connected to the module substrate by a connection terminal and disposed spaced apart from the module substrate; and a sealing portion sealing the bulk-acoustic resonator. The bulk-acoustic resonator includes a resonating portion disposed opposite to an upper surface of the module substrate. A space is disposed between the resonating portion and the upper surface of the module substrate.

公开(公告)号：US20170077900A1

公开(公告)日：2017-03-16

申请号：US15190286

申请日：2016-06-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seung Wook PARK ,  Christian ROMERO ,  Seong Hun NA ,  Tae Sung JEONG

IPC: H03H9/54 ,  H03H3/08 ,  H03H9/72 ,  H03H3/02 ,  H03H9/64 ,  H03H9/70

CPC classification number: H03H9/105 ,  H01L41/23 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H03H3/02 ,  H03H3/08 ,  H03H9/02913 ,  H03H9/02992 ,  H03H9/0504 ,  H03H9/059 ,  H03H9/1014 ,  H03H9/1071 ,  H03H9/1078 ,  H03H9/1092 ,  H03H9/706 ,  H03H9/725 ,  H01L2924/00012

Abstract: An acoustic wave device includes a substrate comprising one surface on which an acoustic wave generator and at least one ground pad are included; a support component formed of an insulating material and disposed on the substrate along a circumference of the acoustic wave generator; and a shielding member electrically connected to the ground pad and blocking reception or emission of electromagnetic waves at the acoustic wave generator.

Abstract translation: 声波装置包括：衬底，其包括一个表面，声波发生器和至少一个接地焊盘包括在该表面上; 由绝缘材料形成并沿着声波发生器的圆周设置在基板上的支撑部件; 以及屏蔽构件，其电连接到接地焊盘并阻止在声波发生器处的电磁波的接收或发射。

公开(公告)号：US20230179170A1

公开(公告)日：2023-06-08

申请号：US17859534

申请日：2022-07-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Wook PARK ,  Seong Hun NA ,  Jae Hyun JUNG ,  Sung HAN ,  Jang Ho PARK

IPC: H03H9/10 ,  H03H3/02 ,  H03H9/17

CPC classification number: H03H9/105 ,  H03H3/02 ,  H03H9/173 ,  H03H2003/021

Abstract: An acoustic wave resonator package includes an acoustic resonator comprising an acoustic wave generator on a surface of a substrate, a cover member disposed over the acoustic wave generator, a bonding member, disposed between the substrate and the cover member, to bond the substrate and the cover member to each other, and a wiring layer, disposed along surfaces of the cover member, connected to the acoustic resonator. Among the surfaces of the cover member, bonding surfaces to which the bonding member and the wiring layer are bonded at least partially have a roughness Rz in a range of 70 nm to 3.5 µm.

公开(公告)号：US20210313954A1

公开(公告)日：2021-10-07

申请号：US16936807

申请日：2020-07-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seung Wook PARK ,  Jae Hyun JUNG ,  Jae Chang LEE ,  Dae Hun JEONG ,  Sang Uk SON ,  Seong Hun NA

IPC: H03H9/13 ,  H03H9/17 ,  H03H9/02

Abstract: A bulk-acoustic wave resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the first electrode; a second electrode disposed to cover at least a portion of the piezoelectric layer; a metal pad connected to the first electrode and the second electrode; and a connection member connected an upper surface of the metal pad. A lower end portion of the connection member includes a tapered portion decreasing in a diameter in a direction toward a lower end of the connection member, and an angle between an inclined surface of the tapered portion and the upper surface of the metal pad is 45° to 80°.

公开(公告)号：US20190140616A1

公开(公告)日：2019-05-09

申请号：US15996790

申请日：2018-06-04

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seung Wook PARK ,  Jae Hyun JUNG ,  Seong Hun NA

IPC: H03H9/10 ,  H03H3/007

Abstract: An acoustic wave device includes a substrate, a support portion and a protective member. The substrate has an acoustic wave generator formed on a surface thereof. The support portion is disposed on the surface of the substrate, and includes an accommodating space configured to accommodate the acoustic wave generator. The protective member is coupled to the support portion and disposed to be spaced apart from the acoustic wave generator by a predetermined interval. The protective member is disposed in a seating groove formed in the support portion.

公开(公告)号：US20180159505A1

公开(公告)日：2018-06-07

申请号：US15675137

申请日：2017-08-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD

Inventor： Jae Hyun JUNG ,  Seung Wook PARK ,  Seong Hun NA

IPC: H03H9/10 ,  H03H9/17 ,  H01L41/047 ,  H03H9/25 ,  H03H9/64 ,  H03H9/05 ,  H03H9/02

CPC classification number: H03H9/1092 ,  H01L41/047 ,  H01L41/053 ,  H03H9/02228 ,  H03H9/0576 ,  H03H9/059 ,  H03H9/1071 ,  H03H9/172 ,  H03H9/25 ,  H03H9/6426

Abstract: An acoustic wave filter device includes a filter disposed on a substrate, a wall member disposed on the substrate and surrounding the filter, a cap member disposed on the wall member and bounding an internal space with the wall member; and a support member disposed on the cap member. The support member is disposed above the internal space and includes a bump disposed on the cap member.

公开(公告)号：US20220200565A1

公开(公告)日：2022-06-23

申请号：US17475716

申请日：2021-09-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Kyung LEE ,  Seung Wook PARK ,  Seong Hun NA ,  Jae Hyun JUNG ,  Yeong Gyu LEE ,  Moon Chul LEE ,  Jin Suk SON ,  Jae Goon AUM

IPC: H03H9/10 ,  H03H9/05 ,  H03H9/17

Abstract: A bulk-acoustic wave resonator package includes a package substrate; a cover bonded to the package substrate; an acoustic wave resonator accommodated in an accommodation space defined by the package substrate and the cover; a conductive wire disposed in the accommodation space to electrically connect the acoustic wave resonator to the package substrate; and a bonding portion to fixedly couple the acoustic wave resonator to the package substrate. The bonding portion includes an adhesive member including silicon.