公开(公告)号：US20240164028A1

公开(公告)日：2024-05-16

申请号：US18218753

申请日：2023-07-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seon Ha Kang ,  Seung Eun Lee ,  Yong Hoon Kim

IPC: H05K3/46 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/12

CPC classification number: H05K3/4688 ,  H05K1/03 ,  H05K1/115 ,  H05K3/0017 ,  H05K3/1258 ,  H05K2201/09045 ,  H05K2203/0574

Abstract: A printed circuit board including a first insulating layer; a plurality of first circuit patterns respectively disposed on the first insulating layer; and a plurality of second circuit patterns respectively disposed on the first insulating layer and respectively having a thickness, thinner than a thickness of each of the plurality of first circuit patterns. At least one of the plurality of first circuit patterns and at least one of the plurality of second circuit patterns are alternately and repeatedly arranged, and a method for manufacturing the printed circuit board, are provided.

公开(公告)号：US10217709B2

公开(公告)日：2019-02-26

申请号：US15668351

申请日：2017-08-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seon Ha Kang ,  Myung Sam Kang

IPC: H01L23/02 ,  H01L23/538 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/10

Abstract: The present disclosure relates to a semiconductor package, and more particularly, to a fan-out semiconductor package in which connection terminals may extend outwardly of a region in which a semiconductor chip is disposed. In the fan-out semiconductor package, a circuit density of a redistribution layer may be increased even in a limited area.

公开(公告)号：US09514880B2

公开(公告)日：2016-12-06

申请号：US14460022

申请日：2014-08-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jeong Woo Park ,  Seon Ha Kang ,  Oh Hi Lee

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/24 ,  H01F27/02 ,  H01F41/04 ,  H01F17/00

CPC classification number: H01F41/041 ,  H01F17/0013 ,  H01F41/046 ,  H01F2017/0066 ,  Y10T29/49071

Abstract: Embodiments of the invention provide a coil unit for a thin film inductor, a manufacturing method of a coil unit for a thin film inductor, a thin film inductor, and a manufacturing method of a thin film inductor. According to an embodiment, there is provided a coil unit for a thin film inductor. The coil unit includes an insulator having a dual insulating layer of different materials, and coil patterns respectively embedded in upper and lower surfaces of the insulator. The coil patterns include a coil pattern formed of a plurality of plating layers.

Abstract translation: 本发明的实施例提供一种用于薄膜电感器的线圈单元，薄膜电感器的线圈单元的制造方法，薄膜电感器和薄膜电感器的制造方法。 根据实施例，提供了一种用于薄膜电感器的线圈单元。 线圈单元包括具有不同材料的双重绝缘层的绝缘体和分别嵌入绝缘体的上表面和下表面的线圈图案。 线圈图案包括由多个镀层形成的线圈图案。

公开(公告)号：US09899136B2

公开(公告)日：2018-02-20

申请号：US15395075

申请日：2016-12-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sa Yong Lee ,  Myung Sam Kang ,  Tae Hong Min ,  Seon Ha Kang ,  Mi Sun Hwang ,  Il Jong Seo

IPC: H01F5/00 ,  H01F27/255 ,  H01F27/28 ,  H01F27/29 ,  H01F41/04 ,  H01F41/10 ,  H01F41/12

CPC classification number: H01F27/255 ,  H01F5/00 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/2804 ,  H01F27/29 ,  H01F27/292 ,  H01F41/046 ,  H01F41/10 ,  H01F41/122 ,  H01F2017/048 ,  H01F2027/2809

Abstract: A coil component includes a body portion, a coil portion, and an electrode portion. The body portion includes a magnetic material, the coil portion is disposed in the body portion, and the electrode portion is disposed on the body portion and electrically connected to the coil portion. The coil portion includes a first coil layer in which a plurality of conductors having a planar spiral shape are stacked, a second coil layer in which a plurality of conductors having a planar spiral shape are stacked, and a first bump disposed between the first and second coil layers to electrically connect the first and second coil layers to each other. The first coil layer and the second coil layer are electrically connected to each other through the first bump to form a single coil having coil turns adjacent to each other in horizontal and vertical directions.

公开(公告)号：US20140090245A1

公开(公告)日：2014-04-03

申请号：US14099714

申请日：2013-12-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Mi Sun HWANG ,  Myung Sam KANG ,  Ok Tae KIM ,  Seon Ha Kang ,  Gil Yong SHIN ,  Kil Yong YUN ,  Min Jung CHO

IPC: H05K3/46

CPC classification number: H05K3/4685 ,  H05K3/0097 ,  H05K3/205 ,  H05K3/421 ,  H05K2201/0376 ,  H05K2203/0152 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: In accordance with various embodiments, there is provided a method of manufacturing a printed circuit board, the method including the steps of preparing a first carrier including a first pattern formed on one side thereof, preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof, pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates, attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other, and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

Abstract translation: 根据各种实施例，提供一种制造印刷电路板的方法，所述方法包括以下步骤：制备包括在其一侧上形成的第一图案的第一载体，制备第二载体，所述第二载体包括第一阻焊层和 第二图案顺序地形成在其一侧上，按压第一载体和第二载体，使得第一图案嵌入绝缘层的一侧，并且第二图案嵌入绝缘层的另一侧，然后移除第一图案 载体和第二载体以制造两个基板，使用粘合层将两个基板彼此附接，使得第一阻焊层彼此面对，并且形成用于将绝缘层中的第一图案与第二图案连接的通孔， 在设置有第一图案的绝缘层上形成第二阻焊剂，然后除去粘合层。

公开(公告)号：US11638346B2

公开(公告)日：2023-04-25

申请号：US17205268

申请日：2021-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seon Ha Kang ,  Yong Hoon Kim

IPC: H05K1/18 ,  H05K1/02 ,  H05K9/00 ,  H01L25/065 ,  H01L23/552 ,  H01L23/498 ,  H01L21/48 ,  H05K3/10 ,  H05K3/28 ,  H01L21/56 ,  H05K3/16

Abstract: A component package includes a printed circuit board; a first electronic component disposed in a first region on the printed circuit board; a second electronic component disposed in a second region on the printed circuit board; and a metal wall disposed on the printed circuit board and spatially partitioning the first region and the second region on a plane. The metal wall is directly connected to the printed circuit board.

公开(公告)号：US20220005765A1

公开(公告)日：2022-01-06

申请号：US17083901

申请日：2020-10-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Moon Hee Yi ,  Yong Hoon Kim ,  Yun Je Ji ,  Seon Ha Kang

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498

Abstract: A substrate structure may include a printed circuit board including a first recess and a first junction pad disposed on a lower surface of the first recess; a first electronic component package disposed in the first recess, and including a first substrate and a first electronic device module disposed on at least one surface of the first substrate; and a first external junction portion connecting the first electronic component package and the first junction pad.