公开(公告)号：US20240170330A1

公开(公告)日：2024-05-23

申请号：US18206885

申请日：2023-06-07

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Chanhoon Ko ,  Sanghoon Kim ,  Young Kuk Ko ,  Chulmin Lee ,  Inhwan Oh ,  Kyounghee Lim ,  Sohyun Bae

IPC分类号： H01L21/768 ,  H01L23/528

CPC分类号： H01L21/76894 ,  H01L23/5283

摘要： A substrate including: an insulation layer; a conductive layer disposed on the insulation layer; and a via hole configured to include a lower hole disposed in a first portion of the insulation layer and an upper hole disposed in a second portion of the insulating layer and connected to the lower hole, wherein a width of the upper hole is greater than that of the lower hole, at least a portion of the upper hole of the insulation layer has a width that is substantially equal to that of the upper hole of the conductive layer, and a first angle formed between a first direction that is parallel to a lower surface of the insulating layer and a sidewall of the lower hole and a second angle formed between the first direction and a sidewall of the upper hole are different from each other.

公开(公告)号：US20240292529A1

公开(公告)日：2024-08-29

申请号：US18399156

申请日：2023-12-28

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Inhwan Oh ,  Sanghoon Kim ,  Chulmin Lee ,  Chanhoon Ko ,  Kyounghee Lim ,  Sohyun Bae

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/06

CPC分类号： H05K1/0298 ,  H05K1/111 ,  H05K3/06 ,  H05K2201/10378 ,  H05K2201/10734

摘要： The disclosed circuit board includes: a substrate portion that includes a first insulation layer and a first wiring layer buried by the first insulation layer, and a first element mounting portion and a second element mounting portion disposed on an upper surface of the substrate portion; a first protective layer disposed on the substrate portion; and an auxiliary layer that is disposed to overlap at least a part of a boundary area including a region between the first element mounting portion and the second element mounting portion, and has higher strength than the first protective layer.

公开(公告)号：US20240170420A1

公开(公告)日：2024-05-23

申请号：US18202519

申请日：2023-05-26

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Chanhoon Ko ,  Chulmin Lee ,  Inhwan Oh ,  Kyounghee Lim ,  Sohyun Bae ,  Sanghoon Kim

IPC分类号： H01L23/00

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L2224/0346 ,  H01L2224/03632 ,  H01L2224/05572

摘要： A substrate includes: a first insulating layer; a second insulating layer disposed on the first insulating layer; and a via hole including a lower hole formed in the first insulating layer, and an upper hole formed in the second insulating layer and connected to the lower hole, in which a width of an upper side of the lower hole is larger than a width of a lower side of the lower hole, and a width of an upper side of the upper hole is larger than a width of a lower side of the upper hole.