-
公开(公告)号:US10897002B2
公开(公告)日:2021-01-19
申请号:US15824194
申请日:2017-11-28
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Dae Hun Jeong , Sang Uk Son , Tae Yoon Kim , Dae Ho Kim
IPC: H01L41/047 , H03H9/02 , H01L41/22 , H03H3/02 , H03H9/17 , H03H9/54 , H01L41/187
Abstract: An acoustic resonator includes a resonant portion including a piezoelectric layer disposed between a first electrode and a second electrode, and a frame portion disposed along an outer edge of the second electrode. The frame portion includes three reflective portions reflecting lateral waves generated in the resonant portion.
-
公开(公告)号:US10892737B2
公开(公告)日:2021-01-12
申请号:US16388979
申请日:2019-04-19
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Won Han , Tae Yoon Kim , Sang Uk Son , Chang Hyun Lim
Abstract: A bulk-acoustic wave resonator includes a substrate; a membrane layer forming a cavity with the substrate; a first electrode at least partially disposed on an upper portion of the cavity including an end portion that is thicker than other portions of the first electrode; an insertion layer including a first portion disposed adjacent to from the end portion of the first electrode and a second portion disposed on an upper portion of the first electrode; a piezoelectric layer disposed to cover the insertion layer; and a second electrode disposed on an upper portion of the piezoelectric layer.
-
公开(公告)号:US10756703B2
公开(公告)日:2020-08-25
申请号:US15635551
申请日:2017-06-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Tae Yoon Kim , Tae Kyung Lee , Sung Min Cho , Sang Kee Yoon , Moon Chul Lee
IPC: H01L41/053 , H01L41/09 , H03H9/17 , H03H9/02
Abstract: A bulk acoustic wave resonator includes: a support part disposed on a substrate; a layer disposed on the support part, wherein an air cavity is formed between the support part, the substrate and the layer; and a frame extending along the layer, within the air cavity, and spaced apart from the support part.
-
公开(公告)号:US10756700B2
公开(公告)日:2020-08-25
申请号:US15638809
申请日:2017-06-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Sung Han , Jae Chang Lee , Won Han , Tae Yoon Kim , Jong Woon Kim , Tae Kyung Lee , Moon Chul Lee , Tae Hun Lee , Sung Min Cho , In Young Kang
Abstract: A bulk acoustic wave resonator device includes: a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed over a portion of the lower electrode; an upper electrode disposed on the piezoelectric layer; and a shape control layer covering an edge of a cavity disposed between the substrate and the lower electrode, wherein tensile stress is applied to the shape control layer during formation of the shape control layer.
-
公开(公告)号:US10367471B2
公开(公告)日:2019-07-30
申请号:US15058713
申请日:2016-03-02
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Tae Yoon Kim , Yeong Gyu Lee , Moon Chul Lee , Jae Chang Lee , Duck Hwan Kim
Abstract: A resonator package and a method of manufacturing the same are provided. The method of manufacturing a resonator package involves etching a lower electrode with a hardmask, in which only a portion of a thickness of the lower electrode is etched to shape the lower electrode.
-
公开(公告)号:US09879998B2
公开(公告)日:2018-01-30
申请号:US15010770
申请日:2016-01-29
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Jong Woon Kim , Won Han , Tae Yoon Kim
IPC: G01C19/5712
CPC classification number: G01C19/5712
Abstract: An angular velocity sensor includes a mass body; a first frame provided outside of the mass body; a first flexible part connecting the mass body and the first frame to each other; a second flexible part connecting the mass body and the first frame to each other; a second frame provided outside of the first frame; a third flexible part connecting the first frame and the second frame to each other; and a fourth flexible part connecting the first frame and the second frame to each other, wherein the mass body is fixed to the first frame by the second flexible part so as to be rotation-displaceable and translation-displaceable, and the first frame is connected to the second frame by the fourth flexible part so as to be rotation-displaceable.
-
公开(公告)号:US12184265B2
公开(公告)日:2024-12-31
申请号:US16292715
申请日:2019-03-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Tae Yoon Kim , Yeong Gyu Lee , Moon Chul Lee , Jae Chang Lee , Duck Hwan Kim
Abstract: A resonator package and a method of manufacturing the same are provided. The method of manufacturing a resonator package involves etching a lower electrode with a hardmask, in which only a portion of a thickness of the lower electrode is etched to shape the lower electrode.
-
公开(公告)号:US11323088B2
公开(公告)日:2022-05-03
申请号:US16989129
申请日:2020-08-10
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Tae Kyung Lee , Tae Yoon Kim , Sang Kee Yoon , Chang Hyun Lim , Jong Woon Kim , Moon Chul Lee
Abstract: An acoustic wave resonator includes a resonating part disposed on and spaced apart from a substrate by a cavity, the resonating part including a membrane layer, a first electrode, a piezoelectric layer, and a second electrode that are sequentially stacked. 0 Å≤ΔMg≤170 Å may be satisfied, ΔMg being a difference between a maximum thickness and a minimum thickness of the membrane layer disposed in the cavity.
-
公开(公告)号:US11057017B2
公开(公告)日:2021-07-06
申请号:US15996921
申请日:2018-06-04
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor: Tae Yoon Kim , Won Han , Chang Hyun Lim
Abstract: A bulk-acoustic wave resonator includes a substrate; a lower electrode formed on the substrate, and at least a portion of the lower electrode is formed on a cavity; a piezoelectric layer formed on the lower electrode; an upper electrode formed on the piezoelectric layer; a membrane layer formed below the lower electrode and forming the cavity together with the substrate; and a protruding portion formed on the membrane layer and further formed in the cavity in a direction that extends away from the membrane layer.
-
公开(公告)号:US10958239B2
公开(公告)日:2021-03-23
申请号:US15797224
申请日:2017-10-30
Applicant: Samsung Electro-Mechanics Co., Ltd
Inventor: Tae Yoon Kim , Moon Chul Lee , Yoon Sok Park
Abstract: A bulk acoustic wave resonator includes: support members disposed between air cavities; a resonant part including a first electrode, a piezoelectric layer, and a second electrode sequentially disposed above the air cavities and on the support members; and a wiring electrode connected either one or both of the first electrode and the second electrode, and disposed above one of the air cavities, wherein a width of an upper surface of the support members is greater than a width of a lower surface of the support members, and side surfaces of the support members connecting the upper surface and the lower surface to each other are inclined.
-
-
-
-
-
-
-
-
-