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公开(公告)号:US11943538B2
公开(公告)日:2024-03-26
申请号:US17732976
申请日:2022-04-29
发明人: Hwajoong Jung , Bongchan Kim , Kwangseok Byon , Taehwan Kim , Hyungjin Rho , Jaeheung Park , Jonghun Won
摘要: Disclosed is an electronic device including a camera module enabling a movable member (e.g., a circuit board) having an image sensor disposed thereon to move for an image stabilization function and including a connecting member that provides electrical connection of the image sensor, and an electronic device including the camera module.
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2.
公开(公告)号:US10772048B2
公开(公告)日:2020-09-08
申请号:US16411815
申请日:2019-05-14
发明人: Jisun Yoon , Hanseok Kim , Byoungha Yi , Bongchan Kim , Intaek Lee
IPC分类号: H04W72/04 , H04W52/34 , H04W52/18 , H04W28/08 , H04W52/14 , H04W52/24 , H04W52/36 , H04W52/40
摘要: A method and device for real time transmission power control in a wireless communication system are provided. The method includes receiving transmission power control related information from at least one base station, generating transmission power control information for load balancing of the at least one base station based on the transmission power control related information, and controlling the transmission power of the at least one base station based on the transmission power control information.
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3.
公开(公告)号:US10292118B2
公开(公告)日:2019-05-14
申请号:US14699210
申请日:2015-04-29
发明人: Jisun Yoon , Hanseok Kim , Byoungha Yi , Bongchan Kim , Intaek Lee
摘要: A method and device for real time transmission power control in a wireless communication system are provided. The method includes receiving transmission power control related information from at least one base station, generating transmission power control information for load balancing of the at least one base station based on the transmission power control related information, and controlling the transmission power of the at least one base station based on the transmission power control information.
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公开(公告)号:US20240223900A1
公开(公告)日:2024-07-04
申请号:US18605219
申请日:2024-03-14
发明人: Hyungjin RHO , Bongchan Kim , Kangseok Byon , Hyosang An , Jonghun Won
CPC分类号: H04N23/687 , H01F7/081 , H01F7/121 , H04N23/51 , H04N23/54
摘要: A camera module includes: a camera housing; at least one lens aligned along an optical axis; a first printed circuit board (PCB) including an image sensor disposed on a surface of the first PCB; a carrier member configured to guide the first PCB in a first direction parallel to the optical axis and a second direction crossing the optical axis; and a driving member including: at least one coil; at least one magnet at least partially facing the at least one coil; and a plurality of guide balls, wherein the driving member is configured to move the carrier member in the first direction and the second direction based on rotations of the plurality of guide balls.
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公开(公告)号:US11025890B2
公开(公告)日:2021-06-01
申请号:US16697295
申请日:2019-11-27
发明人: Songha Choi , Donghoon Kim , Bongchan Kim , Byeonghoon Park
IPC分类号: H04N13/271 , H04N13/254 , G01S17/89 , H04N13/239 , G06T7/50 , H04N13/00
摘要: In embodiments, an electronic device may include a first camera disposed on one surface of the electronic device, a second camera disposed on the one surface, a depth sensor disposed on the one surface, and a processor configured to: cause the first camera to acquire a first one or more images of an external object, and generate depth information of the external object using a selected one of the first camera and second camera or the depth sensor, the selected one based on color information or texture pattern information corresponding to the external object in the first one or more images.
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公开(公告)号:US12108132B2
公开(公告)日:2024-10-01
申请号:US17727296
申请日:2022-04-22
发明人: Jaeheung Park , Kwangseok Byon , Hwajoong Jung , Bongchan Kim , Taehwan Kim , Hyungjin Rho , Kihuk Lee
CPC分类号: H04N23/55 , G02B27/646 , H04N23/54
摘要: An electronic device including a camera module is provided. The camera module includes a lens assembly including a lens, a lens holder in which the lens assembly is fixedly disposed, a sensor carrier that includes an image sensor at least partially aligned with an optical axis of the lens and a circuit board electrically connected with the image sensor and that moves in a first axial direction perpendicular to the optical axis and a second axial direction perpendicular to the optical axis and the first axial direction, a fixed substrate adjacent to the sensor carrier and fixed in a specified position, and a connecting member that extends from the circuit board to the fixed substrate and that extends to surround at least three interconnected edges of the circuit board when viewed in a direction of the optical axis.
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公开(公告)号:US12058426B2
公开(公告)日:2024-08-06
申请号:US17678941
申请日:2022-02-23
发明人: Hyungjin Rho , Kwangseok Byon , Bongchan Kim , Jaeheung Park , Hyosang An , Kihuk Lee
CPC分类号: H04N23/51 , H04N23/54 , H04N23/55 , G02B27/646 , G03B13/36
摘要: An electronic device according to an embodiment of the disclosure includes: a housing and a camera module, at least part of which is disposed in the housing. The camera module includes a camera housing, a sensor assembly including an image sensor and is fixed to the camera housing, and a lens unit, at least part of which is accommodated in a space formed by the camera housing and the sensor assembly, the lens unit being configured such that all or part of the lens unit moves relative to the camera housing and the sensor assembly. The lens unit includes a lens assembly including a lens, a first carrier to which the lens assembly is coupled, a second carrier in which the first carrier is accommodated to be movable in a direction perpendicular to an optical axis of the lens, a stopper coupled to the second carrier to cover at least part of the first carrier, and a first damper, at least part of which is disposed between the stopper and the first carrier.
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公开(公告)号:US11238279B2
公开(公告)日:2022-02-01
申请号:US16289910
申请日:2019-03-01
发明人: Woontahk Sung , Hwayong Kang , Jongsun Kim , Kihuk Lee , Bongchan Kim
摘要: According to various embodiments, an electronic device may include a first light emitter comprising first light emitting circuitry configured to output light of a first wave bandwidth, a second light emitter comprising second light emitting circuitry configured to output light of a second wave bandwidth, a camera including an image sensor configured to arrange one or more first pixels for sensing the light corresponding to the first wave bandwidth and the second wave bandwidth and one or more second pixels for sensing the light corresponding to the second wave bandwidth, and a processor. The processor may be configured to control the electronic device to output the first wave bandwidth light using a first light source and the second wave bandwidth light using a second light source, and a control circuit electrically coupled to the image sensor and connected to an application processor through a designated interface. The control circuit may be configured to obtain image data of an external object using the camera from the first wave bandwidth light and the second wave bandwidth light reflected from the external object, to generate first image data of the external object using a difference between first pixel data corresponding to the one or more first pixels and second pixel data corresponding to the one or more second pixels of the image data, to generate second image data of the external object by binning the second pixel data corresponding to the one or more second pixels of the image data, and to transmit the first image data and the second image data to the processor through the designated interface, wherein the processor is configured to generate authentication information based on the first image data and to generate depth information using the second image data.
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公开(公告)号:US09818699B2
公开(公告)日:2017-11-14
申请号:US15065850
申请日:2016-03-09
发明人: Young-Ja Kim , Bongchan Kim
CPC分类号: H01L23/552 , H01L21/561 , H01L21/78 , H01L23/3128 , H01L24/97 , H01L2224/16227 , H01L2224/48227 , H01L2224/97 , H01L2924/15311 , H01L2924/15313 , H01L2924/3025 , H01L2224/81 , H01L2224/85
摘要: Provided is a method of fabricating a semiconductor package. The method includes providing a substrate including a plurality of semiconductor chips; forming a mold layer covering the semiconductor chips; forming a first shielding layer on the mold layer; cutting the mold layer and the first shielding layer to form trenches between the semiconductor chips; and forming a second shielding layer to fill the trenches.
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