公开(公告)号：US20180198022A1

公开(公告)日：2018-07-12

申请号：US15725438

申请日：2017-10-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Kyu Sung ,  Jae Yoon Kim ,  Tae Hun Kim ,  Gam Han Yong ,  Dong Yeoul Lee ,  Su Yeol Lee

IPC: H01L33/08 ,  H01L33/38 ,  H01L33/20

CPC classification number: H01L33/08 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/382 ,  H01L33/46

Abstract: A semiconductor light emitting device including a floating conductive pattern is provided. The semiconductor light emitting device includes a first semiconductor layer including a recessed region and a protruding region, an active layer and a second semiconductor layer disposed on the protruding region, a contact structure disposed on the second semiconductor layer, a lower insulating pattern covering the first semiconductor layer and the contact structure, and having first and second openings, a first conductive pattern disposed on the lower insulating pattern and extending into the first opening, a second conductive pattern disposed on the lower insulating pattern and extending into the second opening, and a floating conductive pattern disposed on the lower insulating pattern. The first and second conductive patterns and the floating conductive pattern have the same thickness on the same plane.

公开(公告)号：US20150102373A1

公开(公告)日：2015-04-16

申请号：US14314650

申请日：2014-06-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Hyun Lee ,  Dong Hyuck Kam ,  Yong Tae Kim ,  Gam Han Yong ,  Seung Jae Lee ,  Seong Deok Hwang

IPC: H01L33/50 ,  H01L33/58 ,  H01L33/00

CPC classification number: H01L33/50 ,  H01L33/005 ,  H01L33/0095 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012 ,  H01L2924/00

Abstract: There is provided a light emitting diode (LED) package. The LED package includes a package body. The LED package also includes an LED chip mounted on the package body. The LED package further includes a side inclined portion disposed to enclose side surfaces of the LED chip, including a light transmission material and having an upwardly inclined surface. The LED package also includes a wavelength conversion layer disposed on a top surface of the LED chip and the inclined surface of the side inclined portion.

Abstract translation: 提供了一种发光二极管（LED）封装。 LED封装包括封装体。 LED封装还包括安装在封装体上的LED芯片。 LED封装还包括设置为包围LED芯片的侧表面的侧倾部，包括透光材料并具有向上倾斜的表面。 LED封装还包括设置在LED芯片的顶表面上的波长转换层和侧倾斜部分的倾斜表面。