Abstract:
An analog-to-digital conversion device and analog-to-digital conversion method thereof are provided. The analog-to-digital conversion device includes an analog circuit configured to output an analog input signal, and an analog-to-digital converter configured to receive the analog input signal and configured to outputting a digital output signal corresponding to the analog input signal with the use of first and second capacitor arrays, each of the first and second capacitor arrays including a first capacitor having a calibration capacitor connected thereto and a second capacitor having no calibration capacitor connected thereto, wherein the analog-to-digital converter is configured to calibrate the capacitance of the first capacitor by providing a first calibration voltage to the calibration capacitor and is configured to output the digital output signal corresponding to the analog input signal with the use of the calibrated capacitance of the first capacitor.
Abstract:
A method of manufacturing a semiconductor device may include forming split gate structures including a floating gate electrode layer and a control gate electrode layer in a cell region of a substrate including the cell region and a logic region adjacent to the cell region. The method may include sequentially forming a first gate insulating film and a metal gate film in the logic region and the cell region, removing the metal gate film from at least a portion of the cell region and the logic region, forming a second gate insulating film on the first gate insulating film from which the metal gate film has been removed, forming a gate electrode film on the logic region and the cell region, and forming a plurality of memory cell elements disposed in the cell region and a plurality of circuit elements disposed in the logic region.
Abstract:
A light emitting device includes: a support unit; a luminous element mounted on the support unit; and a wavelength conversion unit formed on the support unit to cover the luminous element and configured as an encapsulant containing first light wavelength converters emitting light having a relatively long wavelength and second light wavelength converters emitting light having a relatively short wavelength, wherein the wavelength conversion unit includes a first mixture region adjacent to the luminous element and a second mixture region above the first mixture region, a relatively large amount of first light wavelength converters are distributed in the first mixture region, and a relatively large amount of second light wavelength converters are distributed in the second mixture region.
Abstract:
An adhesive film and a display member including the same are disclosed. The adhesive film is formed of an adhesive composition including: a copolymer of a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer; and nanoparticles. The adhesive film has a creep at −20° C. of about 50 μm to about 100 μm and a gel fraction of about 50% to about 75%.
Abstract:
An adhesive film and a display member including the same are disclosed. The adhesive film is formed of an adhesive composition including: a copolymer of a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer; and nanoparticles. The adhesive film has a creep at −20° C. of about 50 μm to about 100 μm and a gel fraction of about 50% to about 75%.
Abstract:
An adhesive film and a display member including the same are disclosed. The adhesive film is formed of an adhesive composition including: a copolymer of a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer; and nanoparticles. The adhesive film has a creep at −20° C. of about 50 μm to about 100 μm and a gel fraction of about 50% to about 75%.
Abstract:
There is provided a light emitting diode (LED) package. The LED package includes a package body. The LED package also includes an LED chip mounted on the package body. The LED package further includes a side inclined portion disposed to enclose side surfaces of the LED chip, including a light transmission material and having an upwardly inclined surface. The LED package also includes a wavelength conversion layer disposed on a top surface of the LED chip and the inclined surface of the side inclined portion.
Abstract:
A wavelength-converted light emitting diode (LED) chip is provided. The wavelength-converted LED chip includes an LED chip and a wavelength-converted layer. The LED chip emits light in a predetermined wavelength region. The wavelength-converted layer is formed of a resin containing phosphor bodies of at least one kind which convert a portion of the light emitted from the LED chip into light in a different wavelength region. The wavelength-converted layer is formed on an upper surface of the LED chip, and has a convex meniscus-shaped upper surface.
Abstract:
A wavelength-converted light emitting diode (LED) chip is provided. The wavelength-converted LED chip includes an LED chip and a wavelength-converted layer. The LED chip emits light in a predetermined wavelength region. The wavelength-converted layer is formed of a resin containing phosphor bodies of at least one kind which convert a portion of the light emitted from the LED chip into light in a different wavelength region. The wavelength-converted layer is formed on an upper surface of the LED chip, and has a convex meniscus-shaped upper surface.
Abstract:
An adhesive film, an optical member including the same, and an optical display including the same are disclosed. The adhesive film has a folding evaluation parameter 1 of about 900% to about 1,300% at 25° C., as calculated by Equation 1 and a folding evaluation parameter 2 of about 40% to about 95% at 60° C., as calculated by Equation 2, and includes a hydroxyl group-containing (meth)acrylic copolymer.