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1.发明申请PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME 审中-公开包装式封装类型半导体封装及其制造方法公开(公告)号：US20130200524A1
公开(公告)日：2013-08-08
申请号：US13660584
申请日：2012-10-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seungchan Han , Hyun-Cheol Kim
IPC: H01L23/48
CPC classification number: H01L23/3107 , H01L23/49811 , H01L23/49827 , H01L23/49833 , H01L24/16 , H01L24/48 , H01L24/73 , H01L25/105 , H01L25/50 , H01L2224/131 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06541 , H01L2225/1023 , H01L2225/1058 , H01L2225/1088 , H01L2924/00014 , H01L2924/12042 , H01L2924/1434 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/00012 , H01L2924/00 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A method of forming a semiconductor package may include providing a first package including a first semiconductor chip mounted on a first package substrate having a via-hole and molded by a first mold layer, providing a second package including a second semiconductor chip mounted on a second package substrate having a connection pad and molded by a second mold layer, stacking the first package on the second package to vertically align the via-hole with the connection pad, forming a through-hole penetrating the first and second packages and exposing the connection pad, and forming an electrical connection part in the through-hole. The electrical connection part may electrically connect the first package and the second package to each other.
Abstract translation: 形成半导体封装的方法可以包括提供第一封装，其包括安装在第一封装基板上的第一半导体芯片，该第一封装基板具有通孔并由第一模具层模制，提供包括安装在第二模具上的第二半导体芯片的第二封装 封装基板，具有连接焊盘并由第二模具层模制，将第一封装堆叠在第二封装上以将通孔垂直对准连接焊盘，形成贯穿第一和第二封装的通孔并暴露连接焊盘 并且在所述通孔中形成电连接部。 电连接部分可以将第一包装和第二包装彼此电连接。
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Patent Agency Ranking
公开(公告)号：US20150192355A1
公开(公告)日：2015-07-09
申请号：US14590454
申请日：2015-01-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yong Woo Joo , Byoung-jae Cho , Hyun-Cheol Kim , Bong-Keun Lim
CPC classification number: F25D29/005 , F25D23/065 , F25D23/067 , F25D2400/40 , H01R9/16 , H01R13/514 , H01R13/74 , H05K5/0247
Abstract: Provided is a refrigerator which is capable of reducing a quantity of deformation of a body by improving rigidity of the body that is lowered due to a thickness of insulation reduced to increase an internal capacity of the body, using a reinforcement structure, and in which an electric apparatus box in which electric apparatus components for controlling an operation of the refrigerator are accommodated, is disposed in a hinge cover disposed in the front of an upper portion of a body so that spatial utility can be improved and when a fire breaks out in components inside the electric apparatus box, a reinforcement plate formed of a steel material is disposed in the electric apparatus box so as to prevent the fire from being spread toward an outside of the electric apparatus box.
Abstract translation: 本发明提供一种冰箱，其能够通过提高使用增强结构减少由于绝缘体的厚度而降低的主体的刚性来增加身体的内部能力，从而减少身体的变形，并且其中 电容器盒，其中容纳用于控制冰箱操作的电气设备部件，设置在设置在主体上部前部的铰链盖中，使得可以改善空间效用，并且当组件中的火灾发生时 在电气设备箱体的内部，在电气设备箱内配置有由钢材构成的加强板，以防止火蔓延到电气设备箱的外部。
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3.发明申请APPARATUS AND METHOD FOR RECEIVING MULTIPATH SIGNALS IN WIRELESS COMMUNICATION SYSTEM 有权用于在无线通信系统中接收多路信号的装置和方法公开(公告)号：US20130294548A1
公开(公告)日：2013-11-07
申请号：US13886151
申请日：2013-05-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyun-Cheol Kim , Myung-Kwang Byun , Yu-Suk Yun , Sung-Kwon Jo
IPC: H04B1/10
CPC classification number: H04B1/10 , H04B1/712 , H04L25/0224
Abstract: Provided are an apparatus and method for receiving a multipath signal in a wireless communication system. The apparatus includes a weighting block for receiving an estimated channel gain value output from a channel estimator and outputting an estimated weighted channel gain value and a compensator unit for receiving the estimated weighted channel gain value, reflecting the weight, and compensating, for an estimated channel gain.
Abstract translation: 提供了一种用于在无线通信系统中接收多径信号的装置和方法。 该装置包括：加权块，用于接收从信道估计器输出的估计信道增益值，并输出估计加权信道增益值;以及补偿单元，用于接收所估计的加权信道增益值，反映权重，并补偿估计信道 获得。
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公开(公告)号：US09970704B2
公开(公告)日：2018-05-15
申请号：US14590454
申请日：2015-01-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yong Woo Joo , Byoung-jae Cho , Hyun-Cheol Kim , Bong-Keun Lim
CPC classification number: F25D29/005 , F25D23/065 , F25D23/067 , F25D2400/40 , H01R9/16 , H01R13/514 , H01R13/74 , H05K5/0247
Abstract: Provided is a refrigerator which is capable of reducing a quantity of deformation of a body by improving rigidity of the body that is lowered due to a thickness of insulation reduced to increase an internal capacity of the body, using a reinforcement structure, and in which an electric apparatus box in which electric apparatus components for controlling an operation of the refrigerator are accommodated, is disposed in a hinge cover disposed in the front of an upper portion of a body so that spatial utility can be improved and when a fire breaks out in components inside the electric apparatus box, a reinforcement plate formed of a steel material is disposed in the electric apparatus box so as to prevent the fire from being spread toward an outside of the electric apparatus box.
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公开(公告)号：US20160225339A1
公开(公告)日：2016-08-04
申请号：US14982660
申请日：2015-12-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyun-Cheol Kim , Young-Gwan Kim , Ji-Yun Kim , Keon-Joo Lee , You Sub Jung
CPC classification number: G09G5/006 , G06T1/20 , G09G3/20 , G09G3/2096 , G09G5/14 , G09G2300/023 , G09G2320/041 , G09G2330/045 , G09G2340/0435
Abstract: A method for processing images includes displaying a first image rendered by a graphic processing unit on a display panel, collecting at least one temperature data of at least one measurement point of the display panel or a host device, and adaptively adjusting an updating frequency of a second image based on the collected at least one temperature data. The second image is to be displayed on the display panel subsequent to the first image.
Abstract translation: 一种处理图像的方法包括在显示面板上显示由图形处理单元呈现的第一图像，收集显示面板或主机设备的至少一个测量点的至少一个温度数据，以及自适应地调整显示面板的更新频率 基于收集的至少一个温度数据的第二图像。 第二张图像将在第一张图像之后显示在显示面板上。
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6.发明授权Apparatus and method for receiving multipath signals in wireless communication system 有权在无线通信系统中接收多径信号的装置和方法公开(公告)号：US09356633B2
公开(公告)日：2016-05-31
申请号：US13886151
申请日：2013-05-02
Applicant: Samsung Electronics Co., Ltd
Inventor： Hyun-Cheol Kim , Myung-Kwang Byun , Yu-Suk Yun , Sung-Kwon Jo
CPC classification number: H04B1/10 , H04B1/712 , H04L25/0224
Abstract: Provided are an apparatus and method for receiving a multipath signal in a wireless communication system. The apparatus includes a weighting block for receiving an estimated channel gain value output from a channel estimator and outputting an estimated weighted channel gain value and a compensator unit for receiving the estimated weighted channel gain value, reflecting the weight, and compensating, for an estimated channel gain.
Abstract translation: 提供了一种用于在无线通信系统中接收多径信号的装置和方法。 该装置包括：加权块，用于接收从信道估计器输出的估计信道增益值，并输出估计加权信道增益值;以及补偿单元，用于接收所估计的加权信道增益值，反映权重，并补偿估计信道 获得。
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