公开(公告)号：US20250060787A1

公开(公告)日：2025-02-20

申请号：US18937655

申请日：2024-11-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungho LEE ,  Youngsun LEE ,  Jiwon KIM ,  Kwanghee RYU ,  Jungchul AN ,  Chulhyo YOON ,  Seungki CHOI

IPC: G06F1/16 ,  G06F3/0354 ,  G06F3/041 ,  H04M1/02

Abstract: An electronic device may include: a first housing; a second housing; a hinge structure; a display; and a sensor panel, wherein the sensor panel comprises: a support layer which comprises a polymer inclusive material and is in contact with an adhesive material arranged on at least one of a first surface of the first housing and a third surface of the second housing; a shielding layer arranged on the support layer; a first insulating layer arranged on the shielding layer; a first conductive pattern arranged on the first insulating layer; a second insulating layer arranged on the first conductive pattern; a second conductive pattern arranged on the second insulating layer; and a third insulating layer arranged on the second conductive pattern and facing one surface of the display, wherein the thickness of at least one of the first insulating layer and the third insulating layer is greater than the thickness of the second insulating layer.

公开(公告)号：US20230326847A1

公开(公告)日：2023-10-12

申请号：US18334546

申请日：2023-06-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungmin HWANG ,  Jiwon KIM ,  Jaeho AHN ,  Joonsung LIM ,  Sukkang SUNG

IPC: H01L23/522 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L23/5223 ,  H01L23/5226 ,  H01L23/5227 ,  H01L23/5228 ,  H01L24/20 ,  H01L24/24 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/2105 ,  H01L2224/24146 ,  H01L2924/1431 ,  H01L2924/14511 ,  H10B43/27

Abstract: A semiconductor device includes lower circuit patterns on a lower substrate; lower bonding patterns on the lower circuit patterns, the lower bonding patterns including a conductive material and being electrically connected to the lower circuit patterns; upper bonding patterns on and contacting the lower bonding patterns, and including a conductive material; a passive device on the upper bonding patterns, and including a conductive material and contacting one of the upper bonding patterns; a gate electrode structure on the passive device, and including gate electrodes spaced apart from each other in a first direction, each of which extends in a second direction, and extension lengths in the second direction of the gate electrodes increasing from a lowermost level toward an uppermost level in a stepwise manner; a channel extending through at least a portion of the gate electrode structure; and an upper substrate on the channel.

公开(公告)号：US20230079171A1

公开(公告)日：2023-03-16

申请号：US17990319

申请日：2022-11-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eunji KIM ,  Koanmo KIM ,  Jiwon KIM ,  Boyoung LEE ,  Jaehong LEE ,  Joonseop OH

IPC: G06V10/24 ,  G06T19/00 ,  G06T9/00

Abstract: The present disclosure relates to a server, an electronic device and their methods of transmitting or receiving image content. In one embodiment, a method performed by the server includes obtaining sensor information including orientation information detected by the electronic device connected to the server; obtaining state information regarding the server and the electronic device; identifying a size of a first partial image and a position of the first partial image, based on the sensor information and the state information; generating a first frame by encoding the first partial image, based on the identified size of the first partial image or identified position of the first partial image; and transmitting the generated first frame to the electronic device.

公开(公告)号：US20220375959A1

公开(公告)日：2022-11-24

申请号：US17552812

申请日：2021-12-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangdon LEE ,  Jiwon KIM ,  Sung-Min HWANG ,  Sukkang SUNG

IPC: H01L27/11578 ,  H01L27/1157 ,  H01L27/11573

Abstract: Disclosed are a three-dimensional semiconductor memory device and an electronic system including the same. The device includes a substrate, a cell array structure provided on the substrate to include a plurality of stacked electrodes spaced apart from each other, an uppermost one of the electrodes being a first string selection line, a vertical channel structure provided to penetrate the cell array structure and connected to the substrate, a conductive pad provided in an upper portion of the vertical channel structure, a bit line on the cell array structure, a bit line contact electrically connecting the bit line to the conductive pad, and a cutting structure penetrating the first string selection line. The cutting structure penetrates a portion of the conductive pad. A bottom surface of the bit line contact includes first and second bottom surfaces in contact with the conductive pad and the cutting structure, respectively.

公开(公告)号：US20210225739A1

公开(公告)日：2021-07-22

申请号：US16989017

申请日：2020-08-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woosung YANG ,  Jiyoung KIM ,  Jiwon KIM

IPC: H01L23/48 ,  H01L27/11582

Abstract: A semiconductor device includes a substrate including a cell region and a connection region. The connection region includes a plurality of pad regions and a through electrode region. A horizontal conductive layer is on the substrate. A supporter is on the horizontal conductive layer. The supporter includes a first portion in the cell region, a second portion in the plurality of pad regions, and a third portion in the through electrode region. A connection conductive layer is between the first portion and the horizontal conductive layer. A connection mold layer is between the third portion and the horizontal conductive layer. A first buried insulation layer passing through the third portion, the connection mold layer, and the horizontal conductive layer is provided. A stacked structure is on the substrate. A through electrode passing through the first buried insulation layer is provided.

公开(公告)号：US20210180976A1

公开(公告)日：2021-06-17

申请号：US16759796

申请日：2018-11-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wonjun LEE ,  Minkoo KANG ,  Jiwon KIM ,  Won LEE ,  Myojin BANG ,  Sangwon SHIM ,  Younghak OH ,  Sunyoung YI ,  Yonggu LEE ,  Kyuok CHOI

IPC: G01C21/36 ,  G06F3/01 ,  G06F3/0481 ,  G06F3/0488 ,  H04M1/72454

Abstract: Various embodiments of the disclosure provide a method and apparatus for providing a vibration in an electronic device. According to various embodiments of the disclosure, an electronic device may include a memory including instructions stored therein, and at least one processor, wherein the at least one processor coupled to the memory is configured to execute the stored instructions for detecting an event for a user's input related to a direction, identifying a vibration pattern having directivity, in response to the detected event, and providing a vibration having directivity by driving the one or more vibration devices, based on the vibration pattern.

公开(公告)号：US20210149193A1

公开(公告)日：2021-05-20

申请号：US17091591

申请日：2020-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyehoon LEE ,  Jigwang KIM ,  Jiwon KIM ,  Jaemin SOH ,  Sanghoon LEE ,  Daesu CHOI

IPC: G02B27/01 ,  G02F1/1335

Abstract: A display apparatus includes a light source array in which a plurality of light sources emitting light by a local dimming are arranged, a color conversion layer comprising color conversion particles that convert the emitted light into light of a certain color, and configured to emit white light by using the converted light, a display panel configured to generate an image by using the white light, and a selective transmission member arranged between the light source array and the color conversion layer. The selective transmission member is configured to transmit the light to the color conversion layer, and avoid transmitting the light in the color conversion layer to the light source array.

公开(公告)号：US20210098478A1

公开(公告)日：2021-04-01

申请号：US16858983

申请日：2020-04-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Min HWANG ,  Woosung YANG ,  Joon-Sung LIM ,  Jiyoung KIM ,  Jiwon KIM

IPC: H01L27/11556 ,  H01L27/11582 ,  G11C5/02 ,  G11C5/06 ,  H01L23/528

Abstract: Disclosed is a three-dimensional semiconductor memory device including a substrate including a cell array region and a connection region, a stack including first and second stacks sequentially stacked on the substrate, the stack having a staircase structure on the connection region, each of the first and second stacks including conductive patterns vertically stacked on the substrate, and contact plugs disposed on the connection region and respectively coupled to the conductive patterns. A bottom surface of each contact plug is located between top and bottom surfaces of a corresponding conductive pattern. In each stack, a recess depth of each contact plug varies monotonically in a stacking direction of the conductive patterns, when measured from a top surface of a corresponding conductive pattern. The contact plugs coupled to an uppermost conductive pattern of the first stack and a lowermost conductive pattern of the second stack have discrete recess depths.

公开(公告)号：US20200006949A1

公开(公告)日：2020-01-02

申请号：US16444409

申请日：2019-06-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keumsu SONG ,  Kwangseob KIM ,  Kihyun KIM ,  Dongzo KIM ,  Jiwon KIM ,  Jihye KIM ,  Yunjeong NOH ,  Changhak O ,  Hyungkoo CHUNG ,  Mincheol HA ,  Jongchul HONG ,  Yongsang YUN

IPC: H02J5/00 ,  H01F17/00 ,  H01F38/14 ,  H02J50/12 ,  H02J50/40 ,  H02J7/02 ,  H04B5/00 ,  H02J50/70

Abstract: An electronic device is provided. The electronic device includes a coil unit, a power transmission circuit electrically connected to the coil unit, and a control circuit configured to wirelessly transmit power using the coil unit, and the coil unit may include a first coil. The first coil may include a first layer wound in a first shape by a first number of turns, and a second layer extending from the first layer and wound in a second shape by a second number of turns, and the second layer may be disposed above the first layer to overlap the first layer.

公开(公告)号：US20190267849A1

公开(公告)日：2019-08-29

申请号：US16283182

申请日：2019-02-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mincheol HA ,  Changhak O ,  Kwangseob KIM ,  Dongzo KIM ,  Jiwon KIM ,  Jongchul HONG ,  Kihyun KIM ,  Yunjeong NOH ,  Jaewan PARK ,  Hyungkoo CHUNG ,  Jihye KIM ,  Keumsu SONG ,  Yongsang YUN ,  Sangmoo HWANGBO

IPC: H02J50/60 ,  H02J50/12 ,  H02J7/02 ,  H02J50/80

Abstract: Various embodiments related to electronic devices are set forth herein. According to an embodiment, an electronic device comprises a coil, a power transmitting circuit electrically connected with the coil, a sensing circuit, and a control circuit. The control circuit is configured to wirelessly output, using the power transmitting circuit, a first designated power through the coil to an external electronic device, and identify, using the sensing circuit, first energy detected at the coil due to a foreign object of the electronic device. The control circuit is further configured to, when a magnitude of the energy falls within a first designated range, output, using the power transmitting circuit, a second designated power to the external electronic device, and when the magnitude of the energy falls within a second designated range, abstain from outputting the power to the external electronic device using the power transmitting circuit. Other embodiments are possible as well.