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公开(公告)号：US12119437B2
公开(公告)日：2024-10-15
申请号：US17533949
申请日：2021-11-23
发明人： Soonwon Jeong , Yeonjun Sung , Jongho Lim , Joonwoo Jeon , Hanna Heo , Hyongsik Won , Sangbok Yun
CPC分类号： H01L33/644 , H01L25/0753 , H01L25/162 , H01L33/62 , H01L24/48 , H01L24/49 , H01L25/167 , H01L33/505 , H01L2224/48137 , H01L2224/48175 , H01L2224/49109 , H01L2924/12035 , H01L2924/12041
摘要： A light emitting device package includes a first molding member surrounding a heat dissipation frame, a first electrode frame, and a second electrode frame; a first semiconductor light emitting device on the heat dissipation frame and having first and second pads; a second semiconductor light emitting device on the heat dissipation frame and having first and second pads; a wavelength conversion layer on the first and second semiconductor light emitting structures; a first bonding wire connected to the first pad of the first semiconductor light emitting device and the first electrode frame; a second bonding wire connected to the second pad of the second semiconductor light emitting device and the second electrode frame; and an inter-chip bonding wire connecting the second pad of the first semiconductor light emitting device to the first pad of the second semiconductor light emitting device.
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公开(公告)号：US12132159B2
公开(公告)日：2024-10-29
申请号：US17567671
申请日：2022-01-03
发明人： Jongho Lim , Myoungsu Chae , Yeonjun Sung , Hyongsik Won , Joonwoo Jeon , Soonwon Jeong
摘要： A light-emitting diode (LED) package includes a package substrate, an LED chip disposed on a first surface of the package substrate, and a first external connection pad and a second external connection pad disposed on a second surface of the package substrate opposite the first surface. The first external connection pad includes a first side, a second side, a third side and a fourth side, the first side being parallel to the second side, and the third side being parallel to the fourth side. The first side is spaced farther from a center of the package substrate than the second side. A length of the first side is shorter than a length of the second side.
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公开(公告)号：US20220223774A1
公开(公告)日：2022-07-14
申请号：US17567671
申请日：2022-01-03
发明人： Jongho LIM , Myoungsu Chae , Yeonjun Sung , Hyongsik Won , Joonwoo Jeon , Soonwon Jeong
IPC分类号： H01L33/62 , F21V19/00 , H05K1/11 , H01L25/13 , F21S41/141 , F21S43/14 , F21W106/00
摘要： A light-emitting diode (LED) package includes a package substrate, an LED chip disposed on a first surface of the package substrate, and a first external connection pad and a second external connection pad disposed on a second surface of the package substrate opposite the first surface. The first external connection pad includes a first side, a second side, a third side and a fourth side, the first side being parallel to the second side, and the third side being parallel to the fourth side. The first side is spaced farther from a center of the package substrate than the second side. A length of the first side is shorter than a length of the second side.
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公开(公告)号：US20220209088A1
公开(公告)日：2022-06-30
申请号：US17533949
申请日：2021-11-23
发明人： Soonwon JEONG , Yeonjun Sung , Jongho Lim , Joonwoo Jeon , Hanna Heo , Hyongsik Won , Sangbok Yun
IPC分类号： H01L33/64 , H01L25/075 , H01L33/62 , H01L25/16
摘要： A light emitting device package includes a first molding member surrounding a heat dissipation frame, a first electrode frame, and a second electrode frame; a first semiconductor light emitting device on the heat dissipation frame and having first and second pads; a second semiconductor light emitting device on the heat dissipation frame and having first and second pads; a wavelength conversion layer on the first and second semiconductor light emitting structures; a first bonding wire connected to the first pad of the first semiconductor light emitting device and the first electrode frame; a second bonding wire connected to the second pad of the second semiconductor light emitting device and the second electrode frame; and an inter-chip bonding wire connecting the second pad of the first semiconductor light emitting device to the first pad of the second semiconductor light emitting device.
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