公开(公告)号：US20250031507A1

公开(公告)日：2025-01-23

申请号：US18905645

申请日：2024-10-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongho LIM ,  Myoungsu CHAE ,  Yeonjun SUNG ,  Hyongsik WON ,  Joonwoo JEON ,  Soonwon JEONG

IPC: H01L33/62 ,  H05K1/11

Abstract: A light-emitting diode (LED) package includes a package substrate, an LED chip disposed on a first surface of the package substrate, and a first external connection pad and a second external connection pad disposed on a second surface of the package substrate opposite the first surface. The first external connection pad includes a first side, a second side, a third side and a fourth side, the first side being parallel to the second side, and the third side being parallel to the fourth side. The first side is spaced farther from a center of the package substrate than the second side. A length of the first side is shorter than a length of the second side.

公开(公告)号：US20230155086A1

公开(公告)日：2023-05-18

申请号：US17943299

申请日：2022-09-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongho LIM ,  Jaehyuk LIM ,  Hosik JUN ,  Hyojeong KANG ,  Yonggi CHO

IPC: H01L33/60 ,  H01L25/16 ,  H01L33/00 ,  H01L33/50 ,  H01L33/58

CPC classification number: H01L33/60 ,  H01L25/167 ,  H01L33/0095 ,  H01L33/50 ,  H01L33/58 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light-emitting diode (LED) package includes a substrate including an insulating material; upper pads on an upper surface of the substrate; a side surface molding layer covering the upper surface of the substrate and side surfaces of the upper pads; an LED chip on the upper surface of the substrate and electrically connected to the upper pads; a fluorescent layer on the LED chip; and a reflection molding layer on the substrate and covering the LED chip, the reflection molding layer including white silicon, wherein the reflection molding layer exposes a portion of side surfaces of the fluorescent layer.

公开(公告)号：US20220223774A1

公开(公告)日：2022-07-14

申请号：US17567671

申请日：2022-01-03

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Jongho LIM ,  Myoungsu Chae ,  Yeonjun Sung ,  Hyongsik Won ,  Joonwoo Jeon ,  Soonwon Jeong

IPC: H01L33/62 ,  F21V19/00 ,  H05K1/11 ,  H01L25/13 ,  F21S41/141 ,  F21S43/14 ,  F21W106/00

Abstract: A light-emitting diode (LED) package includes a package substrate, an LED chip disposed on a first surface of the package substrate, and a first external connection pad and a second external connection pad disposed on a second surface of the package substrate opposite the first surface. The first external connection pad includes a first side, a second side, a third side and a fourth side, the first side being parallel to the second side, and the third side being parallel to the fourth side. The first side is spaced farther from a center of the package substrate than the second side. A length of the first side is shorter than a length of the second side.