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    Semiconductor light-emitting devices and methods of manufacturing the same
    2.
    发明授权
    Semiconductor light-emitting devices and methods of manufacturing the same 有权

    公开(公告)号：US10121939B2

    公开(公告)日：2018-11-06

    申请号：US15626410

    申请日：2017-06-19

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Seong-seok Yang ,  Jin-bock Lee ,  Jung-hee Kwak ,  Jung-kyu Park ,  Jung-sung Kim

    IPC: H01L33/44 ,  H01L33/36

    Abstract: A semiconductor light-emitting device may include an emission structure, a protection pattern layer on a limited region of the emission structure, and an insulating pattern layer on the emission structure. The protection pattern layer may expose a separate remaining region of the emission structure, and the first insulating pattern layer may cover at least the remaining region of the emission structure. The insulating layer may include an opening that exposes at least a portion of a surface of the protection pattern layer, such that the emission structure remains covered by at least one of the insulating layer and the protection pattern layer.

    LIGHT EMITTING DEVICE
    3.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开

    公开(公告)号：US20200006611A1

    公开(公告)日：2020-01-02

    申请号：US16359470

    申请日：2019-03-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min-gu Ko ,  Jung-hee Kwak ,  Young-ho Ryoo ,  Seong-seok Yang ,  Sang-seok Lee ,  Seung-wan Chae

    IPC: H01L33/62 ,  H01L33/32 ,  H01L33/40 ,  H01L27/15

    Abstract: A light emitting device includes a substrate extending in a first direction and a second direction, first through fourth light emitting structures spaced apart from each other in the first and second direction and arranged in a matrix form on the substrate, a plurality of first interconnection layer structures connecting the first light emitting structure to the second light emitting structure, a second interconnection layer structure connecting the second light emitting structure to the third light emitting structure, and a plurality of third interconnection layer structures connecting the third light emitting structure to the fourth light emitting structure.

    Light emitting device
    4.
    发明授权
    Light emitting device 有权

    公开(公告)号：US11069845B2

    公开(公告)日：2021-07-20

    申请号：US16359470

    申请日：2019-03-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min-gu Ko ,  Jung-hee Kwak ,  Young-ho Ryoo ,  Seong-seok Yang ,  Sang-seok Lee ,  Seung-wan Chae

    IPC: H01L33/32 ,  H01L33/62 ,  H01L27/15 ,  H01L33/40

    Abstract: A light emitting device includes a substrate extending in a first direction and a second direction, first through fourth light emitting structures spaced apart from each other in the first and second direction and arranged in a matrix form on the substrate, a plurality of first interconnection layer structures connecting the first light emitting structure to the second light emitting structure, a second interconnection layer structure connecting the second light emitting structure to the third light emitting structure, and a plurality of third interconnection layer structures connecting the third light emitting structure to the fourth light emitting structure.

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