MEMORY DEVICE AND OPERATING METHOD THEREOF
    1.
    发明公开

    公开(公告)号:US20240257843A1

    公开(公告)日:2024-08-01

    申请号:US18230951

    申请日:2023-08-07

    CPC classification number: G11C7/02 G11C7/1057 G11C7/14

    Abstract: The present disclosure provides for memory apparatuses and systems including noise cancellation circuits, and operating methods thereof. In some embodiments, a memory device includes a first pad, a memory cell plane comprising a plurality of memory cells, a page buffer circuit, and a noise cancellation circuit. The page buffer circuit is configured to sense the memory cell plane, and identify, based on the sensing of the memory cell plane, a state stored in a memory cell of the plurality of memory cells, according to a ground voltage. The noise cancellation circuit is configured to receive a first ground voltage from the first pad, determine a reference voltage based on the first ground voltage, generate a second ground voltage that offsets a noise voltage, based on the reference voltage, and output the second ground voltage to the page buffer circuit.

    VOLTAGE GENERATION CIRCUIT AND SEMICONDUCTOR MEMORY DEVICE INCLUDING THE SAME

    公开(公告)号:US20240274212A1

    公开(公告)日:2024-08-15

    申请号:US18241621

    申请日:2023-09-01

    CPC classification number: G11C29/12005 G11C7/04 G11C29/028 G11C29/1201

    Abstract: A voltage generation circuit includes a current generation circuit, a slope trimming circuit and an offset trimming circuit. The current generation circuit is connected between an input voltage node and an output node that outputs a complementary to absolute temperature (CTAT) output voltage that decreases as an operation temperature increases. The current generation circuit generates a reference current flowing through the output node, the reference current having a constant magnitude regardless of the operation temperature. The slope trimming circuit is connected between the output node and an intermediate node. The slope trimming circuit adjusts a slope of the CTAT output voltage based on a first trimming code. The offset trimming circuit is connected between the intermediate node and a ground voltage node. The offset trimming circuit configured to adjust an offset voltage of the CTAT output voltage based on a second trimming code.

    RESISTIVE MEMORY DEVICE
    5.
    发明申请

    公开(公告)号:US20220310698A1

    公开(公告)日:2022-09-29

    申请号:US17526262

    申请日:2021-11-15

    Abstract: A resistive memory device includes: memory cells overlapping one another in a vertical direction within a cell array region and each including a switching element and a variable resistive element; first conductive lines each being connected to the switching element; a second conductive line connected to the variable resistive element and conductive pads arranged in a connection region and connected to respective one ends of the first conductive lines, respectively, and having different lengths in the second horizontal direction. A lower conductive pad from among the conductive pads includes a first portion covered by an upper conductive pad, and a second portion not covered by the upper conductive pad, and a thickness of each of the first and second portions in the vertical direction is greater than a thickness of each of the first conductive lines in the vertical direction.

    RESISTIVE MEMORY DEVICES AND METHODS OF OPERATING RESISTIVE MEMORY DEVICES

    公开(公告)号:US20210098064A1

    公开(公告)日:2021-04-01

    申请号:US16848149

    申请日:2020-04-14

    Abstract: A resistive memory device includes a memory cell array of resistive memory cells connected to word and bit lines, each bay of the memory cell array including K tiles; a write/read circuit connected to the memory cell array through a row decoder and a column decoder, the write/read circuit being configured to perform a write operation in a target tile of the memory cell array, the write/read circuit comprising write drivers corresponding to the bays; a control voltage generator configured to generate first and second control voltages based on a reference current; and a control circuit configured to control the write/read circuit and the control voltage generator. A first write driver that corresponds to a first bay of the bays is configured to provide the target tile with a write current corresponding to a physical position of a selected memory cell of the target tile in the memory cell array.

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