公开(公告)号：US20130221485A1

公开(公告)日：2013-08-29

申请号：US13734322

申请日：2013-01-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YONGHOON KIM ,  Seung Hwan Kim ,  Heeseok Lee

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01L28/40 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K3/4608 ,  H05K2201/0979 ,  H05K2201/10015

Abstract: A wiring board includes a metal core including a first surface and a second surface facing each other and a first portion and a second portion disposed on the first and second surfaces, respectively. The first and second portions each include a plurality of insulating layers and a plurality of wiring layers stacked in an alternating manner. At least one capacitor is disposed in at least one interior region. The at least one capacitor includes first and second electrodes. The at least one interior region exposes a portion of the metal core and a portion of at least one of the first and second portions adjacent to the metal core and at least one first via electrically connects one of the wiring layers of the first portion with the first and second electrodes.

Abstract translation: 布线板包括金属芯，该金属芯包括彼此面对的第一表面和第二表面，以及分别设置在第一表面和第二表面上的第一部分和第二部分。 第一和第二部分各自包括交替堆叠的多个绝缘层和多个布线层。 至少一个电容器设置在至少一个内部区域中。 所述至少一个电容器包括第一和第二电极。 所述至少一个内部区域暴露所述金属芯的一部分，并且所述第一和第二部分中的至少一个的一部分与所述金属芯相邻，并且至少一个第一通孔将所述第一部分的所述布线层中的一个与 第一和第二电极。

公开(公告)号：US20130214396A1

公开(公告)日：2013-08-22

申请号：US13660424

申请日：2012-10-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YONGHOON KIM

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14335 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package includes a first package including a first wiring board and at least one first semiconductor chip mounted on the first wiring board, a second package stacked on the first package. The second package includes a second wiring board and at least one second semiconductor chip mounted on the second wiring board. The semiconductor package further includes at least one connection terminal connecting a plurality of signal lines of the first and second wiring boards, respectively, with each other. The semiconductor package further includes at least one ground terminal connecting a plurality of ground lines of the first and second wiring boards, respectively, with each other, and includes a side surface, and a shielding member covering a top surface and a side surface of a structure including the first and second packages and the shielding member is disposed on the at least one ground terminal.

Abstract translation: 半导体封装包括第一封装，第一封装包括第一布线板和安装在第一布线板上的至少一个第一半导体芯片，堆叠在第一封装上的第二封装。 第二封装包括第二布线板和安装在第二布线板上的至少一个第二半导体芯片。 半导体封装还包括分别将第一和第二布线板的多个信号线彼此连接的至少一个连接端子。 半导体封装还包括至少一个接地端子，其分别将第一和第二布线板的多个接地线彼此连接，并且包括侧表面，以及覆盖第一和第二布线板的顶表面和侧表面的屏蔽构件 包括第一和第二封装和屏蔽构件的结构设置在至少一个接地端子上。