公开(公告)号：US11848255B2

公开(公告)日：2023-12-19

申请号：US16904648

申请日：2020-06-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YoungJoon Lee ,  Sunwon Kang

IPC: H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L25/10 ,  H01L23/31 ,  H01L23/15 ,  H01L23/48 ,  H01L23/14

CPC classification number: H01L23/49541 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L23/145 ,  H01L23/15 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/16 ,  H01L24/31 ,  H01L24/45 ,  H01L24/73 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/15311 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/15311 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/73204 ,  H01L2224/32225 ,  H01L2224/16225 ,  H01L2924/00012

Abstract: Disclosed are semiconductor package structure and semiconductor modules including the same. The semiconductor module includes a circuit board, a first semiconductor package over the circuit board, and a connection structure on the circuit board and connecting the circuit board and the first semiconductor package. The first semiconductor package includes a first package substrate. A difference in coefficient of thermal expansion between the connection structure and the circuit board may be less than a difference in coefficient of thermal expansion between the circuit board and the first package substrate.

公开(公告)号：US10720382B2

公开(公告)日：2020-07-21

申请号：US16029770

申请日：2018-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YoungJoon Lee ,  Sunwon Kang

IPC: H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L25/10 ,  H01L23/31 ,  H01L23/15 ,  H01L23/48 ,  H01L23/14

Abstract: Disclosed are semiconductor package structure and semiconductor modules including the same. The semiconductor module includes a circuit board, a first semiconductor package over the circuit board, and a connection structure on the circuit board and connecting the circuit board and the first semiconductor package. The first semiconductor package includes a first package substrate. A difference in coefficient of thermal expansion between the connection structure and the circuit board may be less than a difference in coefficient of thermal expansion between the circuit board and the first package substrate.

公开(公告)号：US20190164870A1

公开(公告)日：2019-05-30

申请号：US16029770

申请日：2018-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YoungJoon Lee ,  Sunwon Kang

IPC: H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31

Abstract: Disclosed are semiconductor package structure and semiconductor modules including the same. The semiconductor module includes a circuit board, a first semiconductor package over the circuit board, and a connection structure on the circuit board and connecting the circuit board and the first semiconductor package. The first semiconductor package includes a first package substrate. A difference in coefficient of thermal expansion between the connection structure and the circuit board may be less than a difference in coefficient of thermal expansion between the circuit board and the first package substrate.