METHOD AND COMPOSITION FOR ELECTROLESS NICKEL AND COBALT DEPOSITION
    3.
    发明申请
    METHOD AND COMPOSITION FOR ELECTROLESS NICKEL AND COBALT DEPOSITION 有权
    电沉积镍和钴沉积的方法和组合

    公开(公告)号:US20140353160A1

    公开(公告)日:2014-12-04

    申请号:US13909455

    申请日:2013-06-04

    申请人: SANCHEM, INC.

    发明人: John W. Bibber

    IPC分类号: C25D3/12

    摘要: An electroless plating bath composition of matter and corresponding method are described. The plating bath is an aqueous solution including an amino acid having at least one amino moiety and at least one carboxylic acid moiety or a polypeptide thereof, and having a molar ratio of amino moieties to carboxylic acid moieties of 1 or greater, a nickel-containing or a cobalt-containing salt, and a boron-containing reducing agent. The composition of matter is used in a method of electroless nickle-boron and cobalt-boron coating of substrates.

    摘要翻译: 描述了一种物质的无电镀浴组合物和相应的方法。 电镀浴是包含具有至少一个氨基部分和至少一个羧酸部分或其多肽并且氨基部分与羧酸部分的摩尔比为1或更大的氨基酸的水溶液,含镍的 或含钴盐和含硼还原剂。 物质的组成用于基板的无电镀镍硼和钴 - 硼涂层的方法中。

    Method and composition for electroless nickel and cobalt deposition
    4.
    发明授权
    Method and composition for electroless nickel and cobalt deposition 有权
    无电镍和钴沉积的方法和组成

    公开(公告)号:US09376755B2

    公开(公告)日:2016-06-28

    申请号:US13909455

    申请日:2013-06-04

    申请人: SANCHEM, INC.

    发明人: John W. Bibber

    摘要: An electroless plating bath composition of matter and corresponding method are described. The plating bath is an aqueous solution including an amino acid having at least one amino moiety and at least one carboxylic acid moiety or a polypeptide thereof, and having a molar ratio of amino moieties to carboxylic acid moieties of 1 or greater, a nickel-containing or a cobalt-containing salt, and a boron-containing reducing agent. The composition of matter is used in a method of electroless nickle-boron and cobalt-boron coating of substrates.

    摘要翻译: 描述了一种无电镀浴组合物及相应的方法。 电镀浴是包含具有至少一个氨基部分和至少一个羧酸部分或其多肽并且氨基部分与羧酸部分的摩尔比为1或更大的氨基酸的水溶液,含镍的 或含钴盐和含硼还原剂。 物质的组成用于基板的无电镀镍硼和钴 - 硼涂层的方法中。