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公开(公告)号:US10115820B2
公开(公告)日:2018-10-30
申请号:US15370193
申请日:2016-12-06
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Chao Feng Yeh , TianChen Dong
IPC: H01L21/762 , H01L21/764 , H01L29/06 , H01L29/78 , H01L23/528 , H01L29/66 , H01L27/24 , H01L45/00 , H01L27/11582
Abstract: A method is provided that includes forming a first vertically-oriented transistor above a substrate, the first vertically-oriented transistor comprising a first sidewall gate disposed in a first direction, forming a second vertically-oriented transistor above the substrate, the second vertically-oriented transistor including a second sidewall gate disposed in the first direction, and forming an air gap chamber above the substrate disposed between the first sidewall gate and the second sidewall gate, and extending in the first direction, the air gap chamber including an air gap.
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2.
公开(公告)号:US10290681B2
公开(公告)日:2019-05-14
申请号:US15711075
申请日:2017-09-21
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Chao Feng Yeh , Jongsun Sel , Zhen Chen
IPC: H01L29/792 , H01L27/24 , H01L45/00
Abstract: Doped semiconductor strips, a planar insulating spacer layer, a gate conductor material layer, and a dielectric cap layer are formed over a substrate. A two-dimensional array of openings is formed through the dielectric cap layer and the gate electrode material layer. Gate dielectrics are formed in the two-dimensional array of openings, and vertical semiconductor channels are formed on each of the gate dielectrics. Gate divider rail structures are formed through the gate conductor material layer. The gate divider rail structures divide the gate conductor material layer into a one-dimensional array of gate electrode lines. Each of the gate electrode lines includes a one-dimensional array of openings arranged along a horizontal direction to form a two-dimensional array of hole-type surrounding gate vertical field effect transistors.
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公开(公告)号:US10355129B2
公开(公告)日:2019-07-16
申请号:US16016219
申请日:2018-06-22
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Chao Feng Yeh , TianChen Dong
IPC: H01L29/78 , H01L29/66 , H01L27/11582 , H01L27/1157 , H01L29/06 , H01L23/528 , H01L27/24 , H01L45/00 , H01L27/22
Abstract: A method is provided that includes forming a first vertically-oriented transistor above a substrate, the first vertically-oriented transistor comprising a first sidewall gate disposed in a first direction, forming a second vertically-oriented transistor above the substrate, the second vertically-oriented transistor including a second sidewall gate disposed in the first direction, and forming an air gap chamber above the substrate disposed between the first sidewall gate and the second sidewall gate, and extending in the first direction, the air gap chamber including an air gap.
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公开(公告)号:US10707314B2
公开(公告)日:2020-07-07
申请号:US15720490
申请日:2017-09-29
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Seje Takaki , Jongsun Sel , Hisakazu Otoi , Chao Feng Yeh
IPC: H01L29/788 , H01L29/417 , H01L27/02 , H01L27/11 , H01L27/24 , H01L45/00 , H01L29/78 , H01L29/66
Abstract: A stack including doped semiconductor strips, a one-dimensional array of gate electrode strips, and a dielectric matrix layer is formed over a substrate. A two-dimensional array of openings is formed through the dielectric matrix layer and the one-dimensional array of gate electrode strips. A two-dimensional array of tubular gate electrode portions is formed in the two-dimensional array of openings. Each of the tubular gate electrode portions is formed directly on a respective one of the gate electrode strips. Gate dielectrics are formed on inner sidewalls of the tubular gate electrode portions. Vertical semiconductor channels are formed within each of the gate dielectrics by deposition of a semiconductor material. A two-dimensional array of vertical field effect transistors including surrounding gate electrodes is formed.
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公开(公告)号:US20180301556A1
公开(公告)日:2018-10-18
申请号:US16016219
申请日:2018-06-22
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Chao Feng Yeh , TianChen Dong
IPC: H01L29/78 , H01L29/66 , H01L29/06 , H01L23/528 , H01L45/00 , H01L27/24 , H01L27/11582
CPC classification number: H01L29/7827 , H01L23/528 , H01L27/1157 , H01L27/11582 , H01L27/2454 , H01L27/249 , H01L29/0649 , H01L29/6656 , H01L29/66666 , H01L45/04 , H01L45/06 , H01L45/1226 , H01L45/1233 , H01L45/141 , H01L45/146 , H01L45/147 , H01L45/16
Abstract: A method is provided that includes forming a first vertically-oriented transistor above a substrate, the first vertically-oriented transistor comprising a first sidewall gate disposed in a first direction, forming a second vertically-oriented transistor above the substrate, the second vertically-oriented transistor including a second sidewall gate disposed in the first direction, and forming an air gap chamber above the substrate disposed between the first sidewall gate and the second sidewall gate, and extending in the first direction, the air gap chamber including an air gap.
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6.
公开(公告)号:US10079267B1
公开(公告)日:2018-09-18
申请号:US15632773
申请日:2017-06-26
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Chao Feng Yeh , Tian Chen Dong
CPC classification number: H01L27/2454 , H01L27/249 , H01L45/16
Abstract: A gate dielectric layer and a gate electrode layer are formed around semiconductor pillars. The gate electrode layer is patterned to remove top portions that protrude above the semiconductor pillars and divided into multiple strips. Each strip constitutes a gate electrode line including a horizontal layer portion and a plurality of surrounding portions that entirely laterally surround respective channel regions of the semiconductor pillars to form wrap gate vertical select field effect transistors. Vertical stacks of memory elements and alternating layer stacks including a vertically alternating sequence of insulating strips and electrically conductive word line strips are formed above the vertical field effect transistors. Vertical bit lines can be formed inside the vertical stacks of memory elements.
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公开(公告)号:US20180158947A1
公开(公告)日:2018-06-07
申请号:US15370193
申请日:2016-12-06
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Chao Feng Yeh , TianChen Dong
IPC: H01L29/78 , H01L29/06 , H01L23/528 , H01L29/66 , H01L27/24 , H01L45/00 , H01L27/11582
CPC classification number: H01L29/7827 , H01L23/528 , H01L27/1157 , H01L27/11582 , H01L27/228 , H01L27/2454 , H01L27/249 , H01L29/0649 , H01L29/6656 , H01L29/66666 , H01L45/04 , H01L45/06 , H01L45/1226 , H01L45/1233 , H01L45/141 , H01L45/146 , H01L45/147 , H01L45/16
Abstract: A method is provided that includes forming a first vertically-oriented transistor above a substrate, the first vertically-oriented transistor comprising a first sidewall gate disposed in a first direction, forming a second vertically-oriented transistor above the substrate, the second vertically-oriented transistor including a second sidewall gate disposed in the first direction, and forming an air gap chamber above the substrate disposed between the first sidewall gate and the second sidewall gate, and extending in the first direction, the air gap chamber including an air gap.
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