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1.发明申请公开(公告)号：US20210351058A1
公开(公告)日：2021-11-11
申请号：US16867818
申请日：2020-05-06
发明人： Shoichi MURAKAMI , Shigeru NAKATSUKA , Syo FUKATA , Yusuke OSAWA , Shigehiro FUJINO , Masaaki HIGASHITANI
IPC分类号： H01L21/683 , H01L21/67 , H01L21/687 , H01J37/32
摘要： An apparatus includes an electrostatic chuck and located within a vacuum enclosure. A plurality of conductive plates can be embedded in the electrostatic chuck, and a plurality of plate bias circuits can be configured to independently electrically bias a respective one of the plurality of conductive plates. Alternatively or additionally, a plurality of spot lamp zones including a respective set of spot lamps can be provided between a bottom portion of the vacuum enclosure and a backside surface of the electrostatic chuck. The plurality of conductive plates and/or the plurality of spot lamp zones can be employed to locally modify chucking force and to provide local temperature control.
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2.发明申请公开(公告)号：US20210348272A1
公开(公告)日：2021-11-11
申请号：US16868787
申请日：2020-05-07
发明人： Shoichi MURAKAMI , Shigeru NAKATSUKA , Syo FUKATA , Yusuke OSAWA , Shigehiro FUJINO , Masaaki HIGASHITANI
IPC分类号： C23C16/458 , H01L21/02 , H01L21/683 , H01L21/687 , H01J37/32 , H01L21/033 , C23C16/50 , C23C16/455
摘要： A deposition chamber includes a vacuum enclosure, an electrostatic chuck having a flat top surface located within a vacuum enclosure, a lift-and-rotation unit extending through or laterally surrounding the electrostatic chuck at a position that is laterally offset from a vertical axis passing through a geometrical center of the electrostatic chuck, a gas supply manifold configured to provide influx of gas into the vacuum enclosure, and a pumping port connected to the vacuum enclosure.
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公开(公告)号：US20210391154A1
公开(公告)日：2021-12-16
申请号：US16900126
申请日：2020-06-12
发明人： Syo FUKATA , Shoichi MURAKAMI , Shigeru NAKATSUKA , Yusuke OSAWA , Shigehiro FUJINO , Masaaki HIGASHITANI
IPC分类号： H01J37/32 , H01L21/687
摘要： An anisotropic etch apparatus contains an electrostatic chuck located in a vacuum enclosure and including a lower electrode, an upper electrode overlying the lower electrode and located in the vacuum enclosure, a main radio frequency (RF) power source configured to provide an RF bias voltage between the lower electrode and the upper electrode, and a plurality of conductive edge ring segments surrounding the electrostatic chuck and configured for at least one of independent vertical movement relative to the electrostatic chuck or for independently receiving a different RF bias voltage.
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4.发明公开公开(公告)号：US20240087860A1
公开(公告)日：2024-03-14
申请号：US17931374
申请日：2022-09-12
发明人： Shoichi MURAKAMI
IPC分类号： H01J37/32 , H01L21/3213
CPC分类号： H01J37/32972 , H01J37/32449 , H01J37/32963 , H01L21/32134 , H01J2237/3321 , H01J2237/3345
摘要： An etching method includes etching a material in an etch chamber by alternating normal-flow etch steps and reduced-flow etch steps, where an etchant gas is provided at a normal flow rate into the etch chamber during the normal-flow etch steps, and the etchant gas is provided at a reduced flow rate lower than the normal flow rate into the etch chamber during the reduced-flow etch steps, obtaining optical emission spectroscopy (OES) data during the reduced-flow etch steps, determining an end point for the etching based on the obtained OES data, and ending the etching at the determined end point.
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5.发明申请公开(公告)号：US20210351059A1
公开(公告)日：2021-11-11
申请号：US16867845
申请日：2020-05-06
发明人： Shoichi MURAKAMI , Shigeru NAKATSUKA , Syo FUKATA , Yusuke OSAWA , Shigehiro FUJINO , Masaaki HIGASHITANI
IPC分类号： H01L21/683 , H01J37/32 , H01L21/67 , H01L21/66 , C23C16/509
摘要： An apparatus includes an electrostatic chuck and located within a vacuum enclosure. A plurality of conductive plates can be embedded in the electrostatic chuck, and a plurality of plate bias circuits can be configured to independently electrically bias a respective one of the plurality of conductive plates. Alternatively or additionally, a plurality of spot lamp zones including a respective set of spot lamps can be provided between a bottom portion of the vacuum enclosure and a backside surface of the electrostatic chuck. The plurality of conductive plates and/or the plurality of spot lamp zones can be employed to locally modify chucking force and to provide local temperature control.
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