Abstract:
A photoelectric conversion apparatus includes a substrate 13 and a photodiode 9 in which a first semiconductor layer 25, a second semiconductor layer 26 and a third semiconductor layer 27 are laminated on the substrate 13 in the stated order. The second semiconductor layer 26 is an i-type semiconductor layer, and one of the first semiconductor layer 25 and the third semiconductor layer 27 is an n-type semiconductor layer, and the other is a p-type semiconductor layer. Also, the first semiconductor layer 25 is covered by the second semiconductor layer 26.
Abstract:
A light emitting device according to the present disclosure includes a substrate, and a columnar structure group formed of a plurality of columnar structures, wherein the plurality of columnar structures includes a plurality of first columnar structures disposed in a light emitting section, and a plurality of second columnar structures disposed in a region other than the light emitting section, the columnar structure group includes a first columnar structure group including the plurality of first columnar structures and a light propagation layer, and a second columnar structure group including the plurality of second columnar structures and an insulating layer, an inter-layer insulating layer configured to cover the columnar structure groups is disposed on the substrate, a conductive layer to be electrically coupled to the first columnar structure group is disposed on the inter-layer insulating layer, a first electrode terminal electrically coupled to the conductive layer is disposed on the inter-layer insulating layer, the first columnar structures are constituted by a first semiconductor layer, a second semiconductor layer, and a light emitting layer, the conductive layer is electrically coupled to the second semiconductor layer, and when viewed from a normal direction of the substrate, the conductive layer and the first electrode terminal overlap the second columnar structure group.
Abstract:
A photoelectric conversion apparatus includes a TFT 10 provided on one surface of a substrate 1, a second interlayer insulation film 7 provided so as to cover the TFT 10, a shading film 9 provided on the second interlayer insulation film 7 in an area overlapping the TFT 10 when seen from a thickness direction of films that are formed on the substrate 1, a lower electrode 8 provided on the second interlayer insulation film 7, and a semiconductor film 21 having a chalcopyrite structure provided on the lower electrode 8. A group 16 element is included in the shading film 9, the lower electrode 8 and the semiconductor film 21.
Abstract:
A light-emitting device includes: a substrate; first column portions provided at the substrate; a plurality of second column portions provided at the substrate and that surround the first column portions as viewed from a normal direction of the substrate; a first semiconductor layer coupled to the first column portions; an insulating layer covering the first semiconductor layer and the second column portions; and a wiring line electrically coupled to the first semiconductor layer. Each of the first column portions and each of the second column portions includes an n-type second semiconductor layer, a p-type third semiconductor layer, and a u-type fourth semiconductor layer. The fourth semiconductor layer at each of the first column portions is injected with current to emit light. The fourth semiconductor layer at each of the second column portions is not injected with current. The wiring line overlaps at least one of the second column portions.
Abstract:
The light emitting device includes a laminated structure having a plurality of columnar parts, wherein the laminated structure includes a first semiconductor layer, a second semiconductor layer different in conductivity type from the first semiconductor layer, a light emitting layer disposed between the first semiconductor layer and the second semiconductor layer, and a third semiconductor layer, the first semiconductor layer and the light emitting layer constitute the columnar part, the second semiconductor layer is disposed between the light emitting layer and the third semiconductor layer, the second semiconductor layer has a plurality of recessed parts, and a surface of the second semiconductor layer which defines the recessed part and a surface of the third semiconductor layer closer to the second semiconductor layer constitute an gap.
Abstract:
A photocatalyst device that includes a substrate having conductivity, a first photocatalyst layer in contact with the substrate, provided with at least one opening portion, and formed of one of an oxidation catalyst and a reduction catalyst, and a second photocatalyst layer provided at the opening portion and in contact with the substrate, and formed of the other of the oxidation catalyst and the reduction catalyst.
Abstract:
The light emitting device includes a substrate, and a laminated structure provided to the substrate, and including a plurality of columnar parts, wherein the columnar part includes a first semiconductor layer, a second semiconductor layer different in conductivity type from the first semiconductor layer, and a light emitting layer disposed between the first semiconductor layer and the second semiconductor layer, the laminated structure includes a third semiconductor layer which is connected to an opposite side to the substrate of the second semiconductor layer, and is same in conductivity type as the second semiconductor layer, the second semiconductor layer is disposed between the light emitting layer and the third semiconductor layer, the third semiconductor layer is provided with a recessed part, an opening of the recessed part is provided to a surface at an opposite side to the substrate side of the third semiconductor layer, and a diametrical size in a bottom of the recessed part is smaller than a diametrical size in the opening of the recessed part.
Abstract:
A method of manufacturing a photoelectric conversion apparatus includes forming a switching element on one surface of a substrate, forming an interlayer insulation film so as to cover the switching element, forming a shading film on the interlayer insulation film in an area overlapping the switching element when seen from a film thickness direction of the substrate, forming a lower electrode on the interlayer insulation film, and forming a semiconductor film having a chalcopyrite structure on the lower electrode. A group 16 element is included in the semiconductor film, and in forming the semiconductor film, the shading film and the lower electrode are caused to react to the group 16 element to form a shading film including the group 16 element and a lower electrode including the group 16 element.