公开(公告)号：US20190029643A1

公开(公告)日：2019-01-31

申请号：US16152564

申请日：2018-10-05

Applicant: SEIKO EPSON CORPORATION

Inventor： Masayoshi YAMADA ,  Hiroshi MATSUDA ,  Tomoaki NAKAMURA ,  Hiroshi ITO ,  Hiromu MIYAZAWA

IPC: A61B8/00 ,  B06B1/06 ,  G01N29/22 ,  H01L41/113 ,  G01N29/24 ,  G01N29/06

Abstract: An ultrasonic sensor includes a vibration plate, a first electrode, a piezoelectric body, and a second electrode. The first electrode is laminated on the vibration plate, that has a length along a surface of the vibration plate in a first direction, and that has a width Wbe along the surface of the vibration plate in a second direction that is orthogonal to the first direction. The width Wbe is not more than the length. The piezoelectric body is laminated on the first electrode and has a width Wpz in the second direction. The second electrode is laminated on the piezoelectric body. A ratio Wbe/Wpz between the width Wbe of the first electrode and the width Wpz of the piezoelectric body is not less than 0.1 and not more than 0.8.

公开(公告)号：US20180084642A1

公开(公告)日：2018-03-22

申请号：US15710094

申请日：2017-09-20

Applicant: Seiko Epson Corporation

Inventor： Hironori SUZUKI ,  Hiroshi MATSUDA ,  Koji OHASHI

IPC: H05K1/11 ,  B06B1/06 ,  H05K1/18

CPC classification number: H05K1/11 ,  B06B1/06 ,  B06B1/0644 ,  H05K1/18

Abstract: A mounting structure includes a first substrate on which an elastic core section is provided, a conductive film that is provided over the first substrate from an upper part of the core section, and a second substrate on which a wiring portion connected to the conductive film on the core section is provided, in which the conductive film has a notch that partially exposes an end part of a surface of the core section which is in contact with the first substrate.

公开(公告)号：US20170143302A1

公开(公告)日：2017-05-25

申请号：US15348092

申请日：2016-11-10

Applicant: Seiko Epson Corporation

Inventor： Daisuke NAKANISHI ,  Robina ATSUCHI ,  Hiroshi MATSUDA

IPC: A61B8/00 ,  A61B8/08 ,  A61B8/14

CPC classification number: A61B8/4209 ,  A61B8/14 ,  A61B8/4444 ,  A61B8/461 ,  A61B8/5207

Abstract: An ultrasonic probe includes an ultrasonic wave detection portion, a fixation base to which the ultrasonic wave detection portion is fixed, a casing from which the ultrasonic wave detection portion is exposed and into which the fixation base is built, and an elastic first connection portion that connects the fixation base to the casing, in which the first connection portion includes a first arm extending in a first direction and a second arm extending in a second direction intersecting the first direction, in which one end of the first connection portion is in contact with the fixation base, and the other end of the first connection portion is in contact with the casing, and in which the first direction and the second direction are the same as directions in which a surface of the fixation base and a surface of the casing facing each other extend.

公开(公告)号：US20160036412A1

公开(公告)日：2016-02-04

申请号：US14807057

申请日：2015-07-23

Applicant: SEIKO EPSON CORPORATION

Inventor： Hironori SUZUKI ,  Hiroshi MATSUDA

IPC: H03H9/13

CPC classification number: H01L41/0533 ,  A61B8/4427 ,  A61B8/4494 ,  B06B1/0629 ,  B06B1/067 ,  G01N29/2437 ,  G01N29/262 ,  G10K11/02 ,  H01L27/18 ,  H01L41/0973

Abstract: An acoustic matching layer is formed on individual ultrasonic transducer elements on a base. Electric conductors are arranged between adjacent ultrasonic transducer elements, the electric conductors being connected to electrodes of the ultrasonic transducer elements. Protective films overlap the electric conductors. The protective films have smaller moisture permeability than the acoustic matching layer. Wall portions are arranged on the protective films, the wall portions separating portions of the acoustic matching layer that are respectively located on adjacent ultrasonic transducer elements from each other at least in a part of a height range with respect to a height direction from the base, and having an acoustic impedance that is different from the acoustic impedance of the acoustic matching layer.

Abstract translation: 声学匹配层形成在基座上的各个超声换能器元件上。 电导体布置在相邻的超声换能器元件之间，电导体连接到超声换能器元件的电极。 保护膜与电导体重叠。 保护膜比声匹配层具有较小的透湿性。 壁部分布置在保护膜上，将声匹配层分别位于相邻的超声波换能器元件上的壁部至少部分相对于从基座的高度方向的高度范围彼此分开， 并且具有与声匹配层的声阻抗不同的声阻抗。

公开(公告)号：US20160033454A1

公开(公告)日：2016-02-04

申请号：US14807108

申请日：2015-07-23

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroshi MATSUDA

IPC: G01N29/24 ,  B06B1/06

CPC classification number: G01N29/2437 ,  B06B1/0622 ,  H01L41/08

Abstract: An ultrasonic device that has high accuracy with respect to frequency and sensitivity and that can achieve a reduction of crosstalk is provided. A substrate of an ultrasonic device has a first surface and a second surface on a side opposite to the first surface, and has a first opening and a second opening that are separated from each other by a wall portion. A first vibration film and a second vibration film that close the first opening and the second opening, respectively, are disposed on the first surface of the substrate. A first piezoelectric element and a second piezoelectric element are provided on the first vibration film and the second vibration film, respectively. A recess that opens in the second surface of the substrate is demarcated in the wall portion.

Abstract translation: 提供了相对于频率和灵敏度具有高精度并且可以实现串扰降低的超声波装置。 超声波装置的基板具有与第一面相反一侧的第一表面和第二表面，并且具有通过壁部彼此分离的第一开口和第二开口。 分别将第一开口和第二开口关闭的第一振动膜和第二振动膜设置在基板的第一表面上。 第一压电元件和第二压电元件分别设置在第一振动膜和第二振动膜上。 在壁部分中限定在基板的第二表面中开口的凹部。

公开(公告)号：US20150092514A1

公开(公告)日：2015-04-02

申请号：US14495145

申请日：2014-09-24

Applicant: SEIKO EPSON CORPORATION

Inventor： Kanechika KIYOSE ,  Hiroshi MATSUDA ,  Daisuke NAKANISHI

IPC: H01L41/047 ,  G01S7/52 ,  H04R17/00 ,  H01L41/08 ,  H01L41/083

CPC classification number: G01S7/52017 ,  A61B8/4494 ,  B06B1/0629 ,  G01S15/8925 ,  H01L41/0825

Abstract: An ultrasonic device includes a base in which a base layer of a vibrating film is formed in every opening that is disposed in an array; an interconnect layer, which is a conductor, formed on the base layer; an insulating film that is formed on the interconnect layer, and forms a laminated structure with respect to the base layer; a plurality of piezoelectric elements that are separated from the interconnect layer by the insulating film, the piezoelectric elements each including a first electrode and a second electrode that sandwich a piezoelectric film on the insulating film; and a through conductor that passes through the insulating film, and connects at least one of the first electrode and the second electrode to the conductor constituting the interconnect layer.

Abstract translation: 一种超声波装置，其特征在于，具备：基板，其中，在设置成阵列的每个开口中形成振动膜的基底层; 形成在基底层上的作为导体的互连层; 绝缘膜，其形成在所述互连层上，并相对于所述基底层形成层叠结构; 多个压电元件，通过绝缘膜与互连层分离，压电元件各自包括在绝缘膜上夹着压电膜的第一电极和第二电极; 以及穿过绝缘膜的贯通导体，并且将第一电极和第二电极中的至少一个连接到构成互连层的导体。

公开(公告)号：US20230329121A1

公开(公告)日：2023-10-12

申请号：US18296009

申请日：2023-04-05

Applicant: SEIKO EPSON CORPORATION

Inventor： Hikaru IWAI ,  Masahiro KOMATSU ,  Kanechika KIYOSE ,  Hiroshi MATSUDA

IPC: H10N30/87 ,  H10N30/88

CPC classification number: H10N30/87 ,  H10N30/88

Abstract: An electronic device includes elements, a first substrate including a first surface having a first electrode coupled to the elements and a second electrode coupled to the elements, and a second substrate having a second surface and a third surface and placed with the second surface facing the first surface, wherein the second substrate has a first opening penetrating the second substrate in a position corresponding to the first electrode, and a second opening penetrating the second substrate in a position corresponding to the second electrode, a first through electrode electrically coupled to the first electrode is provided in the first opening, a second through electrode electrically coupled to the second electrode is provided in the second opening, in a plan view of the third surface, an area of the first through electrode is larger than an area of the first opening and an area of the second through electrode is larger than an area of the second opening.

公开(公告)号：US20220080460A1

公开(公告)日：2022-03-17

申请号：US17469597

申请日：2021-09-08

Applicant: SEIKO EPSON CORPORATION

Inventor： Hiroshi MATSUDA ,  Kanechika KIYOSE

IPC: B06B1/06

Abstract: An ultrasonic sensor includes: a first substrate including an ultrasonic element; a first electrode and a second electrode on the first substrate; a second substrate having a through-hole that penetrates from a first surface facing the first substrate to a second surface; and a gap material that separates the first substrate and the second substrate from each other, in which in a plan view from a +Z direction, the through-hole overlaps with the first electrode and the second electrode, and the gap material surrounds the through-hole, the through-hole has a narrow portion, and a width of the narrow portion is smaller than a width of the through-hole in the first surface, in a direction orthogonal to the +Z direction.

公开(公告)号：US20190131515A1

公开(公告)日：2019-05-02

申请号：US16097011

申请日：2017-04-20

Applicant: Seiko Epson Corporation

Inventor： Koji OHASHI ,  Chikara KOJIMA ,  Hiroshi MATSUDA ,  Hironori SUZUKI ,  Shuichi TANAKA

IPC: H01L41/053 ,  H01L41/047 ,  A61B8/00 ,  B06B1/06

Abstract: A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.

公开(公告)号：US20170155030A1

公开(公告)日：2017-06-01

申请号：US15353854

申请日：2016-11-17

Applicant: Seiko Epson Corporation

Inventor： Hiroshi MATSUDA

IPC: H01L41/09 ,  H01L41/27 ,  H01L41/047

CPC classification number: H01L41/09 ,  B06B1/0622 ,  H01L41/047 ,  H01L41/0471 ,  H01L41/0805 ,  H01L41/0973 ,  H01L41/27 ,  H01L41/29 ,  H01L41/332

Abstract: A piezoelectric element includes a piezoelectric body that is provided on a substrate and includes multiple sides; a first wiring that is provided from the piezoelectric body to the substrate; and a second wiring that is provided from the piezoelectric body to the substrate. When the piezoelectric element is viewed from a thickness direction of the piezoelectric body, a second side and a fourth side on which the piezoelectric body is superimposed on the first wiring are different from a first side and a third side on which the second wiring is superimposed on the piezoelectric body.