公开(公告)号：US20180005849A1

公开(公告)日：2018-01-04

申请号：US15632768

申请日：2017-06-26

Applicant: SEMES CO., LTD.

Inventor： Ji-hwan LEE ,  Jungbong CHOI ,  Chan Young HEO ,  Pil Kyun HEO ,  Byung Man KANG

IPC: H01L21/67 ,  B08B3/00 ,  B23B31/28 ,  H01L21/687

CPC classification number: H01L21/67051 ,  B08B3/00 ,  B08B11/02 ,  B23B31/28 ,  H01L21/6708 ,  H01L21/6715 ,  H01L21/68728 ,  H01L21/6875 ,  H01L21/68785

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a spin head, a support shaft connected to a lower portion of the spin head to support the spin head, a pin located on an upper surface of the spin head to support the substrate and having a space in the interior thereof, and a nozzle member configured to supply a liquid to the substrate located on the spin head.

公开(公告)号：US20210023582A1

公开(公告)日：2021-01-28

申请号：US16936132

申请日：2020-07-22

Applicant: SEMES CO., LTD.

Inventor： Chan Young HEO ,  Kihoon CHOI ,  Ki-Moon KANG ,  Do Heon KIM ,  Jaeseong LEE

IPC: B05C5/02 ,  B05C11/10

Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a fluid supply unit for supplying supercritical fluid to the treatment space, and a controller configured to control the fluid supply unit, wherein the fluid supply unit is configured to selectively supply the supercritical fluid at a first density or a second density higher than the first density into the treatment space. Thus, drying efficiency of the substrate when drying the substrate using the supercritical fluid may be improved.

公开(公告)号：US20210020430A1

公开(公告)日：2021-01-21

申请号：US16929190

申请日：2020-07-15

Applicant: SEMES CO., LTD.

Inventor： Do Heon KIM ,  Kihoon CHOI ,  Chan Young HEO ,  Ki-Moon KANG

IPC: H01L21/02 ,  B08B7/00 ,  B08B7/04 ,  B08B3/08

Abstract: Disclosed is a method of treating a substrate. In one embodiment, supercritical fluid is supplied to a treatment space in a chamber such that the substrate in the treatment space is treated. The supercritical fluid is supplied to the treatment space while exhausting the treatment space. A temperature of the supercritical fluid supplied when exhausting the treatment space is higher than a temperature of the supercritical fluid supplied to the treatment space for treating the substrate.

公开(公告)号：US20190080902A1

公开(公告)日：2019-03-14

申请号：US16129089

申请日：2018-09-12

Applicant: SEMES CO., LTD.

Inventor： Hae-Won CHOI ,  Ki-Moon KANG ,  Kihoon CHOI ,  Anton KORIAKIN ,  Chan Young HEO ,  Jaeseong LEE ,  Kwon Taek LIM ,  Yong Hun KIM ,  Sang Ho LEE

IPC: H01L21/02 ,  B08B3/08 ,  C09K13/08 ,  C11D7/36 ,  C11D7/50 ,  C11D7/34 ,  C11D11/00 ,  H01L21/687 ,  H01L21/67

Abstract: Disclosed are an anhydrous substrate cleaning composition, a substrate treating method, and a substrate treating apparatus. The anhydrous substrate cleaning composition includes an etching composite that provides fluorine, a solvent that dissolves the etching composite, and a binder that is a composite including phosphorous.

公开(公告)号：US20170140975A1

公开(公告)日：2017-05-18

申请号：US15351770

申请日：2016-11-15

Applicant: SEMES CO., LTD.

Inventor： Jihwan LEE ,  Jungbong CHOI ,  Chan Young HEO ,  Pil Kyun HEO

IPC: H01L21/687 ,  H01L21/67 ,  B08B3/04

Abstract: The present disclosure relates to a spin head, apparatus and method for treating a substrate including the spin head. The spin head includes a supporting plate where a substrate is placed and a chuck pin placed on the supporting plate and supporting a lateral portion of the substrate, wherein the chuck pin includes an outer body and an inner body inserted in the outer body and provided with a different material from the outer body, wherein each outer body and the inner body is provided with any one of a first material or a second material, and wherein one material of the first material and the second material is provided with a material having lower heat conductivity and better thermal resistance than another one