公开(公告)号：US20250100029A1

公开(公告)日：2025-03-27

申请号：US18975080

申请日：2024-12-10

Applicant: SEMES CO., LTD.

Inventor： Ki-Moon KANG ,  Seung Un OH

IPC: B08B13/00 ,  B08B7/00

Abstract: The inventive concept provides a substrate treating method. The substrate treating method includes first treating a substrate in a treating space according to a reference recipe; second treating a substrate in the treating space according to the reference recipe after the first treating; and optimizing an inner ambient of the treating space according to the reference recipe, and wherein the optimizing includes a purge operation of supplying and discharging a treating fluid to/from the treating space.

公开(公告)号：US20240170304A1

公开(公告)日：2024-05-23

申请号：US18515611

申请日：2023-11-21

Applicant: SEMES CO., LTD.

Inventor： Ho Jong HWANG ,  Hyun Goo PARK ,  Hyo Won YANG ,  Ki-Moon KANG ,  Sang Min LEE ,  Se Hoon OH ,  Won Sik SON

IPC: H01L21/67

CPC classification number: H01L21/67017 ,  H01L21/67109

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes treating modules having an opening for taking in and taking out a substrate and which are stacked on each other; and an air flow generating member for generating a downward airflow at each treating module, and wherein the air flow generating member includes: a pan unit configured to supply an air; a spray unit configured to be provided above the treating module and which sprays an air supplied from the pan unit; and an exhaust unit configured to exhaust an air sprayed by the spray unit to outside of the treating module.

公开(公告)号：US20210023582A1

公开(公告)日：2021-01-28

申请号：US16936132

申请日：2020-07-22

Applicant: SEMES CO., LTD.

Inventor： Chan Young HEO ,  Kihoon CHOI ,  Ki-Moon KANG ,  Do Heon KIM ,  Jaeseong LEE

IPC: B05C5/02 ,  B05C11/10

Abstract: An apparatus for treating a substrate includes a process chamber having a treatment space defined therein, a support unit for supporting the substrate in the treatment space, a fluid supply unit for supplying supercritical fluid to the treatment space, and a controller configured to control the fluid supply unit, wherein the fluid supply unit is configured to selectively supply the supercritical fluid at a first density or a second density higher than the first density into the treatment space. Thus, drying efficiency of the substrate when drying the substrate using the supercritical fluid may be improved.

公开(公告)号：US20180093306A1

公开(公告)日：2018-04-05

申请号：US15721188

申请日：2017-09-29

Applicant: SEMES CO., LTD.

Inventor： Ki-Moon KANG ,  Anton KORIAKIN ,  In IL JUNG ,  Hae-Won CHOI

IPC: B08B7/00 ,  C11D11/00 ,  H01L21/311 ,  H01L21/67

CPC classification number: B08B7/0021 ,  C07C31/02 ,  C11D7/5022 ,  C11D11/0047 ,  H01L21/31133 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67109 ,  H01L21/6719

Abstract: Disclosed are an anhydrous substrate cleaning composition, a substrate treating method, and a substrate treating apparatus. The substrate cleaning composite includes an etching compound that provides a component for treating a substrate, and a solvent that dissolves the etching compound, wherein the substrate cleaning composite is an anhydrous composite that does not include water.

公开(公告)号：US20230402295A1

公开(公告)日：2023-12-14

申请号：US17835498

申请日：2022-06-08

Applicant: SEMES CO., LTD.

Inventor： Ki-Moon KANG ,  Hyun Goo PARK ,  Hyo Won YANG

IPC: H01L21/67 ,  C23C16/44 ,  C23C16/455

CPC classification number: H01L21/67017 ,  C23C16/4412 ,  H01L21/67173 ,  C23C16/45551

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a high pressure chamber configured to form a treating space for performing a supercritical treating process therein; a substrate support unit configured to support a substrate at the treating space; a fluid supply unit configured to supply a treating fluid to the treating space; and an exhaust unit configured to exhaust an atmosphere of the treating space, and wherein the fluid supply unit comprises a cover plate opposite to a treating surface of a substrate supported by the substrate support unit, and having a supply hole for supplying the treating fluid to the treating surface.

公开(公告)号：US20230384029A1

公开(公告)日：2023-11-30

申请号：US17825420

申请日：2022-05-26

Applicant: SEMES CO., LTD.

Inventor： Ki-Moon KANG ,  Hyun Goo PARK ,  Hyo Won YANG

IPC: F26B5/00

CPC classification number: F26B5/005

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space therein; a substrate support unit configured to support a substrate in the treating space; and a fluid supply unit configured to supply a fluid in a supercritical state to the treating space, wherein the fluid supply unit comprises: a supply line provided at a top wall of the chamber; and a discharge unit installed at the top wall of the chamber and configured to discharge a fluid to a substrate, and wherein the discharge unit comprises: a body having a discharge fluid channel for the fluid; a nozzle plate provided at a discharge end of the body; and a blocking plate within the discharge fluid channel and spaced apart from the nozzle plate.

公开(公告)号：US20210020430A1

公开(公告)日：2021-01-21

申请号：US16929190

申请日：2020-07-15

Applicant: SEMES CO., LTD.

Inventor： Do Heon KIM ,  Kihoon CHOI ,  Chan Young HEO ,  Ki-Moon KANG

IPC: H01L21/02 ,  B08B7/00 ,  B08B7/04 ,  B08B3/08

Abstract: Disclosed is a method of treating a substrate. In one embodiment, supercritical fluid is supplied to a treatment space in a chamber such that the substrate in the treatment space is treated. The supercritical fluid is supplied to the treatment space while exhausting the treatment space. A temperature of the supercritical fluid supplied when exhausting the treatment space is higher than a temperature of the supercritical fluid supplied to the treatment space for treating the substrate.

公开(公告)号：US20190080902A1

公开(公告)日：2019-03-14

申请号：US16129089

申请日：2018-09-12

Applicant: SEMES CO., LTD.

Inventor： Hae-Won CHOI ,  Ki-Moon KANG ,  Kihoon CHOI ,  Anton KORIAKIN ,  Chan Young HEO ,  Jaeseong LEE ,  Kwon Taek LIM ,  Yong Hun KIM ,  Sang Ho LEE

IPC: H01L21/02 ,  B08B3/08 ,  C09K13/08 ,  C11D7/36 ,  C11D7/50 ,  C11D7/34 ,  C11D11/00 ,  H01L21/687 ,  H01L21/67

Abstract: Disclosed are an anhydrous substrate cleaning composition, a substrate treating method, and a substrate treating apparatus. The anhydrous substrate cleaning composition includes an etching composite that provides fluorine, a solvent that dissolves the etching composite, and a binder that is a composite including phosphorous.