公开(公告)号：US20180114707A1

公开(公告)日：2018-04-26

申请号：US15793263

申请日：2017-10-25

Applicant: SEMES CO., LTD.

Inventor： Do-Youn Lim ,  Joonho Won ,  Kisang Eum ,  Boong Kim ,  Joo Jib Park

IPC: H01L21/67 ,  F26B5/04 ,  H01L21/02

CPC classification number: H01L21/67034 ,  F26B5/04 ,  H01L21/02052 ,  H01L21/02101 ,  H01L21/6704 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/67109 ,  H01L21/67126 ,  H01L21/6715 ,  H01L21/6719 ,  H01L21/68742

Abstract: Embodiments of the inventive concept relate to an apparatus for treating a substrate in a high-pressure atmosphere. The apparatus includes a process chamber having an upper body and a lower body that are combined with each other to provide a treatment space therein, an elevation member configured to elevate any one of the upper body and the lower body to an opening location at which the upper body and the lower body is spaced apart or a closing location at which the upper body and the lower body is attached, a clamping member configured to clamp the upper body and the lower body located at the closing location, and a movable member configured to move the clamping member to a locking location at which the clamping member clamps the process chamber or to the release location at which the clamping member is spaced apart from the process chamber.

公开(公告)号：US10529594B2

公开(公告)日：2020-01-07

申请号：US15793263

申请日：2017-10-25

Applicant: SEMES CO., LTD.

Inventor： Do-Youn Lim ,  Joonho Won ,  Kisang Eum ,  Boong Kim ,  Joo Jib Park

IPC: F27B17/00 ,  H01L21/67 ,  F26B5/04 ,  H01L21/02

Abstract: Embodiments of the inventive concept relate to an apparatus for treating a substrate in a high-pressure atmosphere. The apparatus includes a process chamber having an upper body and a lower body that are combined with each other to provide a treatment space therein, an elevation member configured to elevate any one of the upper body and the lower body to an opening location at which the upper body and the lower body is spaced apart or a closing location at which the upper body and the lower body is attached, a clamping member configured to clamp the upper body and the lower body located at the closing location, and a movable member configured to move the clamping member to a locking location at which the clamping member clamps the process chamber or to the release location at which the clamping member is spaced apart from the process chamber.