公开(公告)号：US20230268203A1

公开(公告)日：2023-08-24

申请号：US18111537

申请日：2023-02-18

Applicant: SEMES CO., LTD.

Inventor： Jin Taek Oh ,  Jong Seok Seo ,  Seung Han Lee ,  Dongwoon Park

IPC: H01L21/67 ,  H05B3/28 ,  F27B17/00 ,  G03F7/20

CPC classification number: H01L21/67103 ,  H05B3/28 ,  F27B17/0025 ,  G03F7/70875

Abstract: Provided are a heating unit including an air layer for thermal insulation and a substrate treating apparatus including the heating unit. The substrate treating apparatus includes: a housing providing a space in which a substrate is treated; a heating unit disposed in the housing and heating the substrate; a cooling unit disposed in the housing and cooling the substrate; and a transfer unit for moving the substrate, wherein the heating unit includes: a body including a heater therein; a first air layer provided inside the body for thermal insulation and formed in a first direction as a longitudinal direction thereof; and a second air layer provided inside the body for thermal insulation and formed in a second direction as a longitudinal direction thereof.

公开(公告)号：US20240213048A1

公开(公告)日：2024-06-27

申请号：US18391661

申请日：2023-12-21

Applicant: SEMES CO., LTD.

Inventor： Jongwha Kang ,  Sunwook Jung ,  Wooram Lee ,  Byoungdoo Choi ,  Arah Cho ,  Dongwoon Park

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67051 ,  H01L21/6719 ,  H01L21/67225 ,  H01L21/67742

Abstract: A substrate processing apparatus includes a processing unit including a processing vessel with an internal space and a support unit configured to support a substrate and rotate the substrate in a first rotation direction in the internal space, and an exhaust unit configured to exhaust a gas from the internal space, wherein the exhaust unit includes an exhaust pipe providing an exhaust path for the gas exhausted from the internal space, and one or more connectors connecting the processing vessel to the exhaust pipe, and one end of the exhaust pipe is closed, and an open outlet is formed at a remaining end of the exhaust pipe to discharge the gas.

公开(公告)号：US20230213283A1

公开(公告)日：2023-07-06

申请号：US18147524

申请日：2022-12-28

Applicant: Semes Co., Ltd.

Inventor： Juyeon CHO ,  Youngjun Lee ,  Kwangsoo Kim ,  Kisang Eum ,  Wooram Lee ,  Jongwha Kang ,  Younghun Jung ,  Junghyun Lee ,  Dongwoon Park ,  Sunwook Jung

IPC: F27B17/00 ,  H01L21/67 ,  F27D5/00 ,  F27D1/18 ,  F27D17/00 ,  F27D9/00

CPC classification number: F27B17/0025 ,  H01L21/67103 ,  F27D5/0037 ,  F27D1/1858 ,  F27D17/001 ,  F27D9/00 ,  F27D2009/007

Abstract: A substrate processing apparatus includes a bake chamber, a chamber door that opens and closes an opening of the bake chamber, a first support plate in the bake chamber, a first partition wall, which partitions a space provided on the first support plate into first heat treatment spaces spaced apart from each other in a first horizontal direction, and extends in a second horizontal direction and a vertical direction, first heat treatment modules arranged in the first heat treatment spaces, a first exhaust duct extending in the first horizontal direction across the first heat treatment spaces, a first sealing bracket coupled to the first exhaust duct, a first horizontal packing configured to seal a gap between the first sealing bracket and the chamber door, and a first vertical packing configured to seal a gap between the first partition wall and the chamber door.