HEATING UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME

    公开(公告)号:US20230268203A1

    公开(公告)日:2023-08-24

    申请号:US18111537

    申请日:2023-02-18

    CPC classification number: H01L21/67103 H05B3/28 F27B17/0025 G03F7/70875

    Abstract: Provided are a heating unit including an air layer for thermal insulation and a substrate treating apparatus including the heating unit. The substrate treating apparatus includes: a housing providing a space in which a substrate is treated; a heating unit disposed in the housing and heating the substrate; a cooling unit disposed in the housing and cooling the substrate; and a transfer unit for moving the substrate, wherein the heating unit includes: a body including a heater therein; a first air layer provided inside the body for thermal insulation and formed in a first direction as a longitudinal direction thereof; and a second air layer provided inside the body for thermal insulation and formed in a second direction as a longitudinal direction thereof.

    Substrate treating apparatus and substrate treating method

    公开(公告)号:US12230516B2

    公开(公告)日:2025-02-18

    申请号:US17515737

    申请日:2021-11-01

    Abstract: The inventive concept relates to a substrate treating apparatus including a process chamber having a first and a second body, a support unit supporting a substrate, a heating unit heats the substrate, a driver moves any one of the first body and the second body, an interval state detection unit that detects an interval state between a side wall of the first body and a side wall of the second body when the first and the second body are placed in a process location, and a controller that controls the driver and the interval state detection unit, wherein the interval state detection unit includes a pressure provision line that provides a positive pressure or a negative pressure between the side wall of the first body and the side wall of the second body, and a pressure measurement member that measures a change in a pressure of the pressure provision line.

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