公开(公告)号：US20230211966A1

公开(公告)日：2023-07-06

申请号：US18090513

申请日：2022-12-29

Applicant: SEMES CO., LTD.

Inventor： Wan Hee JEONG ,  Kuk Saeng KIM ,  Do Youn LIM ,  Noh Hoon MYOUNG

IPC: B65G54/02 ,  H01L21/677

CPC classification number: B65G54/02 ,  H01L21/67709 ,  H01L21/67724 ,  H01L21/67727 ,  H01L21/67733 ,  B65G2201/0297

Abstract: According to an embodiment of the present invention, there is provided an article transport vehicle capable of speeding up and reducing vibration in a manufacturing plant, a rail assembly, and an article transport system including the same. The article transport vehicle that conveys an article between manufacturing facilities along a rail of an article transport system in a manufacturing plant includes an article holder, a vehicle body, a magnetic levitation actuator, and a linear motor coil.

公开(公告)号：US20230207378A1

公开(公告)日：2023-06-29

申请号：US17735015

申请日：2022-05-02

Applicant: SEMES CO., LTD.

Inventor： Kuk Saeng KIM ,  Jun Hyeak CHOI ,  Wan Hee JEONG ,  Do Youn LIM

IPC: H01L21/687 ,  H01J37/32 ,  H01L41/09

CPC classification number: H01L21/68742 ,  H01J37/32724 ,  H01J37/3244 ,  H01L41/09 ,  H01J2237/334 ,  H01J2237/20235 ,  H01J2237/24578 ,  H01J37/321

Abstract: A substrate support unit includes a substrate support member that supports a substrate, the substrate support member being provided with one or more pin holes vertically penetrating the substrate support member, and a lift pin assembly provided to be lifted along a corresponding pin hole. The lift pin assembly includes lift pins, each lift pin having an upper end contacting the substrate and supporting the substrate, and a pin drive unit that is coupled to the lift pins and lifts the lift pins. The pin drive unit includes piezoelectric motors below the lift pins, respectively.

公开(公告)号：US20230338997A1

公开(公告)日：2023-10-26

申请号：US18105883

申请日：2023-02-06

Applicant: SEMES CO., LTD.

Inventor： Jae Hun JEONG ,  Cheol Yong SHIN ,  Wan Hee JEONG ,  Do Youn LIM

IPC: B08B11/02 ,  B08B3/02 ,  B08B3/08

CPC classification number: B08B11/02 ,  B08B3/02 ,  B08B3/08

Abstract: A support structure, includes: a support plate supporting a substrate; a lower cover covering a lower portion of the support plate; and a catching unit comprising a concave-convex structure having portions corresponding to each other so that the support plate and the lower cover are rotated and assembled with each other.

公开(公告)号：US20230207352A1

公开(公告)日：2023-06-29

申请号：US17750369

申请日：2022-05-22

Applicant: SEMES CO., LTD.

Inventor： Do Youn LIM ,  Kuk Saeng KIM ,  Wan Hee JEONG

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67132 ,  H01L21/6836 ,  H01L2221/68336

Abstract: Proposed is a wafer expander for uniformly expanding gaps between dies, and a die supplying module and die bonding equipment including the same. The wafer expander, for supporting a dicing tape to which a plurality of dies are attached and for expanding gaps between the plurality of dies, includes an expander ring detachably coupled to a wafer ring that fixes an edge of the dicing tape, and configured to ascend and descend, and a base ring supporting a bottom side of the dicing tape, and at least a portion thereof is configured to ascend and descend.

公开(公告)号：US20210183660A1

公开(公告)日：2021-06-17

申请号：US17115313

申请日：2020-12-08

Applicant: SEMES CO., LTD.

Inventor： Jung Suk GOH ,  Jae Seong LEE ,  Do Youn LIM ,  Kuk Saeng KIM ,  Young Dae CHUNG ,  Tae Shin KIM ,  Jee Young LEE ,  Won Geun KIM ,  Ji Hoon JEONG ,  Kwang Sup KIM ,  Pil Kyun HEO ,  Yoon Ki SA ,  Ye Rim YEON ,  Hyun YOON ,  Do Yeon KIM ,  Yong Jun SEO ,  Byeong Geun KIM ,  Young Je UM

IPC: H01L21/311 ,  H01L21/66 ,  H01L21/67

Abstract: Method and apparatus for etching a thin layer including silicon nitride formed on a substrate are disclosed. Etchant including phosphoric acid and water is supplied on the substrate so that a liquid layer is formed on the substrate. The thin layer is etched by reaction between the thin layer and the etchant. Thickness of the liquid layer is measured to detect variation in the thickness of the liquid layer while etching the thin layer. Variation in the concentration of the phosphoric acid and the water is calculated based on the variation in the thickness of the liquid layer. Water is supplied on the substrate based on the variation in the concentration of the phosphoric acid and the water so that the concentration of the phosphoric acid and the water becomes a predetermined value.