REFLECTIVE PHOTOMASK AND METHOD FOR FABRICATING THE SAME

    公开(公告)号:US20220283489A1

    公开(公告)日:2022-09-08

    申请号:US17501085

    申请日:2021-10-14

    Abstract: A reflective photomask includes a pattern area, a non-pattern area at least partially surrounding the pattern area, and a black border area interposed between the pattern area and the non-pattern area. The reflective photomask includes a mask substrate, a reflector layer stacked on the mask substrate, and an absorber layer stacked on the reflector layer. The black border area includes a plurality of first anneal patterns which are arranged along an edge of the pattern area and each have an island shape, and a second anneal pattern which fills inside of the black border area and has a line shape.

    Reflective photomask and method for fabricating the same

    公开(公告)号:US11829063B2

    公开(公告)日:2023-11-28

    申请号:US17501085

    申请日:2021-10-14

    CPC classification number: G03F1/24

    Abstract: A reflective photomask includes a pattern area, a non-pattern area at least partially surrounding the pattern area, and a black border area interposed between the pattern area and the non-pattern area. The reflective photomask includes a mask substrate, a reflector layer stacked on the mask substrate, and an absorber layer stacked on the reflector layer. The black border area includes a plurality of first anneal patterns which are arranged along an edge of the pattern area and each have an island shape, and a second anneal pattern which fills inside of the black border area and has a line shape.

    Photomask and method of forming the same
    4.
    发明授权
    Photomask and method of forming the same 有权
    光掩模及其形成方法

    公开(公告)号:US09223199B2

    公开(公告)日:2015-12-29

    申请号:US14059533

    申请日:2013-10-22

    CPC classification number: G03F1/76 G03F1/38 G03F1/48 G03F1/54 G03F1/68 G03F1/80

    Abstract: A photomask and a method of forming the same, the photomask including a transparent substrate; a light shielding pattern on the transparent substrate, the light shielding pattern including molybdenum and silicon; and an etch stop layer covering at least a sidewall of the light shielding pattern, wherein the etch stop layer has an etch rate lower than an etch rate of the light shielding pattern with respect to an ammonia-based cleaning solution.

    Abstract translation: 光掩模及其形成方法,所述光掩模包括透明基板; 透明基板上的遮光图案,包括钼和硅的遮光图案; 以及覆盖所述遮光图案的至少一侧壁的蚀刻停止层,其中所述蚀刻停止层的蚀刻速率低于所述遮光图案相对于氨基清洗溶液的蚀刻速率。

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