公开(公告)号：US20170014955A1

公开(公告)日：2017-01-19

申请号：US15300929

申请日：2015-04-02

Applicant: SENJU METAL INDUSTRY Co., LTD.

Inventor： Minoru UESHIMA ,  Takeshi SAKAMOTO ,  Rei FUJIMAKI

IPC: B23K35/26 ,  H01L33/62 ,  H01L33/52 ,  C22C13/02

CPC classification number: B23K35/262 ,  B23K35/26 ,  C22C9/00 ,  C22C13/02 ,  C22C21/00 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/16225

Abstract: Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface, is comprised of a ceramic. The solder alloy has an alloy composition comprising, in terms of mass %, 3-10% of Sb, 0-40 of Ag and 0.3-1.2% of Cu, with the remainder consisting of Sn. Furthermore, the alloy composition may contain, in terms of mass %, a total of 0.15% or less of one or more elements selected from among Ni and Co and/or a total of 0.02% or less of one or more elements selected from among P and Ge.

Abstract translation: 提供了一种焊料合金，其具有适合于焊接通过将铝基板接合到其上的部件的组件的组合物，其中侧表面上的电极的面积不大于侧面的总面积的30％ 侧表面由陶瓷组成。 焊料合金具有以质量％计含有3-10％的Sb，0-40的Ag和0.3-1.2％的Cu，其余由Sn组成的合金组成。 此外，合金组成可以以质量％计含有选自Ni和Co中的一种或多种元素的总量为0.15％以下和/或总共0.02％以下的一种或多种选自以下的元素： P和Ge。

公开(公告)号：US20140029224A1

公开(公告)日：2014-01-30

申请号：US13953682

申请日：2013-07-29

Applicant: SENJU METAL INDUSTRY CO., LTD. ,  OSAKA UNIVERSITY

Inventor： Kozo FUJIMOTO ,  Shinji FUKUMOTO ,  Michiya MATSUSHIMA ,  Satoshi WATANABE ,  Takeshi KAN ,  Minoru UESHIMA ,  Takeshi SAKAMOTO ,  Shu INOUE

IPC: H05K3/34 ,  H05K1/18

CPC classification number: H05K3/341 ,  H05K1/181 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2203/0405 ,  Y02P70/613 ,  Y10T29/49144

Abstract: An method of mounting electronic component includes: providing a connecting layer between a wiring and an electronic component, the connecting layer including a conductive layer formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent and one or two layers of a thermoplastic resin layer formed of thermoplastic resin; and electrically connecting the electronic component to the wiring through the connecting layer.

Abstract translation: 安装电子部件的方法包括：在布线和电子部件之间设置连接层，所述连接层包括由含有热固性树脂，焊料粉末和还原剂的含焊料粉末的树脂组合物形成的导电层，以及一个或多个 两层由热塑性树脂形成的热塑性树脂层; 并通过连接层将电子部件电连接到布线。